Abstract: An embodiment of the invention includes a mass storage device with a storage media that includes magnetic random access memory (MRAM) devices with a NAND flash interface and NAND flash memory devices that are coupled to the MRAM devices. The storage media is partitioned into a hybrid reserved area made of a combination of MRAM array NAND array and hybrid user area made of a combination of MRAM array and NAND array and further includes a controller with a host interface and flash interface coupled to the MRAM and NAND flash memory devices through a flash interface.

Abstract: Resistive memory cell array fabricated with unit areas able to be scaled down to 4 F2, where F is minimum feature size in a technology node are described. Memory cells in a pair of cells commonly include a pair of buried sources in the bottom of trenches formed in a silicon substrate. The source line is shared with an adjacent cell. A pair of gate electrodes provides a vertical channel on a sidewall of the trench. A buried word line connects the bottom of the gates on the sidewall overlying the source wherein the word line is looped at the end of the array. A drain, which is self-aligned to the gate, is formed by implantation/doping the surface of the silicon before patterning the trenches. A contact is formed on top of the drain and the resistive memory element is fabrication on the contact.

Abstract: An embodiment of the invention includes a mass storage device with a storage media that includes magnetic random access memory (MRAM) devices with a NAND flash interface and NAND flash memory devices that are coupled to the MRAM devices. The storage media is partitioned into a hybrid reserved area made of a combination of MRAM array NAND array and hybrid user area made of a combination of MRAM array and NAND array and further includes a controller with a host interface and flash interface coupled to the MRAM and NAND flash memory devices through a flash interface.

Abstract: A magnetic random access memory (MRAM) cell includes an embedded MRAM and an access transistor. The embedded MRAM is formed on a number of metal-interposed-in-interlayer dielectric (ILD) layers, which each include metal dispersed there through and are formed on top of the access transistor. A magneto tunnel junction (MTJ) is formed on top of a metal formed in the ILD layers that is in close proximity to a bit line. An MTJ mask is used to pattern the MTJ and is etched to expose the MTJ. Ultimately, metal is formed on top of the bit line and extended to contact the MTJ.

Abstract: A magnetic memory cell is formed including a magneto tunnel junction (MTJ) and an access transistor, which is used to access the MTJ in operation. The access transistor, which is formed on a silicon substrate, includes a gate, drain and source with the gate position substantially perpendicular to the plane of the silicon substrate thereby burying the gate and allowing more surface area on the silicon substrate for formation of additional memory cells.

Abstract: A spin-torque transfer memory random access memory (STTMRAM) cell is disclosed comprising a selected magnetic tunnel junction (MTJ) identified to be programmed; a first transistor having a first port, a second port and a gate, the first port of the first transistor coupled to the selected MTJ; a first neighboring MTJ coupled to the selected MTJ through the second port of the first transistor; a second transistor having a first port, a second port, and a gate, the first port of the second transistor coupled to the selected MTJ; a second neighboring MTJ coupled to the selected MTJ through the second port of the second transistor; a first bit/source line coupled to the second end of the selected MTJ; and a second bit/source line coupled to the second end of the first neighboring MTJ and the second end of the second neighboring MTJ.

Abstract: A multi-state low-current-switching magnetic memory element (magnetic memory element) comprising a free layer, two stacks, and a magnetic tunneling junction is disclosed. The stacks and magnetic tunneling junction are disposed upon surfaces of the free layer, with the magnetic tunneling junction located between the stacks. The stacks pin magnetic domains within the free layer, creating a free layer domain wall. A current passed from stack to stack pushes the domain wall, repositioning the domain wall within the free layer. The position of the domain wall relative to the magnetic tunnel junction corresponds to a unique resistance value, and passing current from a stack to the magnetic tunnel junction reads the magnetic memory element's resistance. Thus, unique memory states may be achieved by moving the domain wall.

Abstract: The present invention is directed to a method for reading and writing an STT-MRAM multi-level cell (MLC), which includes a plurality of MTJ memory elements coupled in series. The method detects the resistance states of individual MTJ memory elements in an MLC by sequentially writing each memory element to the low resistance state in order of ascending parallelizing write current threshold. If a written element switches the resistance state thereof after the write step, then the written element was in the high resistance state prior to the write step. Otherwise, the written element was in the low resistance state prior to the write step. The switching of the resistance state can be ascertained by comparing the resistance or voltage values of the plurality of memory elements before and after writing each of the plurality of memory elements in accordance with the embodiments of the present invention.

Abstract: A multi-state current-switching magnetic memory element includes a stack of magnetic tunneling junction (MTJ) separated by a non-magnetic layer for storing more than one bit of information, wherein different levels of current applied to the memory element cause switching to different states.

Abstract: A mass storage device includes a controller configured to communicate with a host. The controller is coupled to a first memory and a second memory, the first and second memories being of different types. The mass storage device includes a storage media partitioned into a plurality of Logical Units (LUNs) based on capabilities and resources of the mass storage device. The mass storage device further includes the first memory and the second memories and a hybrid reserved area spanning at least a portion of the first and second memories.

Abstract: A block storage system includes a host and comprises a block storage module that is coupled to the host. The block storage module includes a MRAM array and a bridge controller buffer coupled to communicate with the MRAM array. The MRAM array includes a buffer widow that is moveable within the MRAM array to allow contents of the MRAM array to be read by the host through the bridge controller buffer even when the capacity of the bridge controller buffer is less than the size of the data being read from the MRAM array.

Abstract: A flash-RAM memory includes non-volatile random access memory (RAM) formed on a monolithic die and non-volatile page-mode memory formed on top of the non-volatile RAM, the non-volatile page-mode memory and the non-volatile RAM reside on the monolithic die. The non-volatile RAM is formed of stacks of magnetic memory cells arranged in three-dimensional form for higher density and lower costs.

Abstract: BEOL memory cells are described that include one or more sidewall protection layers on the memory device (including, for example, an MTJ element) deposited prior to interconnect via etching to prevent the formation of electrical shorts between layers. One embodiment uses a single layer sidewall protection sleeve that is deposited after the memory device has been patterned. The layer material is vertically etched down to expose the upper surface of the top electrode while leaving a residual layer of protective material surrounding the rest of the memory device. The material for the protection layer is selected to resist the etchant used to remove the first dielectric material from the via in the subsequent interconnect process. A second embodiment uses dual-layer sidewall protection in which the first layer covers the memory element is preferably an oxygen-free dielectric and the second layer protects the first layer during via etching.

Abstract: An embodiment of the invention includes a mass storage device with a storage media that includes magnetic random access memory (MRAM) devices with a NAND flash interface and NAND flash memory devices that are coupled to the MRAM devices. The storage media is partitioned into a hybrid reserved area made of a combination of MRAM array NAND array and hybrid user area made of a combination of MRAM array and NAND array and further includes a controller with a host interface and flash interface coupled to the MRAM and NAND flash memory devices through a flash interface.

Abstract: The present invention relates to memory devices incorporating therein a novel memory cell architecture which includes an array of selection transistors sharing a common channel and method for making the same. A memory device comprises a semiconductor substrate having a first type conductivity, a plurality of drain regions and a common source region separated by a common plate channel in the substrate, and a selection gate disposed on top of the plate channel with a gate dielectric layer interposed therebetween. The plurality of drain regions and the common source region have a second type conductivity opposite to the first type provided in the substrate.

Abstract: A magnetic random access memory (MRAM) array having a magnetic tunnel junction (MTJ) to be read using a magnetic state of the MTJ, the MTJ being read by applying a current therethrough. Further, the MRAM array has a reference MTJ, a sense amplifier coupled to the MTJ and the reference MTJ, the sense amplifier operable to compare the voltage of the MTJ to the reference MTJ in determining the state of the MTJ; a first capacitor coupled to the sense amplifier at a first end and to ground at a second end; and a second capacitor coupled to the sense amplifier at a first end and to ground at a second end, the first capacitor storing the, wherein short voltage pulses are applied to the first end of each of the first and second capacitors when reading the MTJ thereby makes the current flowing through the MTJ therethrough for small time intervals thereby avoiding read disturbance to the MTJ.

Abstract: An embodiment of the present invention includes a non-volatile storage unit comprising a first and second N-diffusion well separated by a distance of P-substrate. A first isolation layer is formed upon the first and second N-diffusion wells and the P-substrate. A nano-pillar charge trap layer is formed upon the first isolation layer and includes conductive nano-pillars interspersed between non-conducting regions. The storage unit further includes a second isolation layer formed upon the nano-pillar charge trap layer; and at least one word line formed upon the second isolation layer and above a region of nano-pillar charge trap layer. The nano-pillar charge trap layer is operative to trap charge upon application of a threshold voltage. Subsequently, the charge trap layer may be read to determine any charge stored in the non-volatile storage unit, where presence or absence of stored charge in the charge trap layer corresponds to a bit value.

Abstract: A magnetic memory device includes a main memory made of magnetic memory, the main memory and further includes a parameter area used to store parameters used to authenticate data. Further, the magnetic memory device has parameter memory that maintains a protected zone used to store protected zone parameters, and an authentication zone used to store authentication parameters, the protection zone parameters and the authentication parameters being associated with the data that requires authentication. Upon modification of any of the parameters stored in the parameter memory by a user, a corresponding location of the parameter area of the main memory is also modified.

Abstract: A mobile device includes an application processor, an RF modem for connection to cellular networks, wireless device for connection to wireless networks, a display coupled to the application processor, audio devices coupled to the application processor, power management for providing power through a main battery; and charging the battery, a hybrid memory including a magnetic memory, the magnetic memory further including a parameter area configured to store parameters used to authenticate access to certain areas of the main memory, and a parameter memory that maintains a first area, used to store protected zone parameters, and a second area used to store authentication parameters, the protection zone parameters and the authentication parameters being associated with access to the certain areas in the main memory that requires authentication. Upon modification of any of the parameters stored in the parameter memory by a user, a corresponding location of the parameter area of the main memory is also modified.

Abstract: A memory array is organized into rows and columns of resistive elements and is disclosed to include a resistive element to be read or to be written thereto. Further, a first access transistor is coupled to the resistive element and to a first source line and a second access transistor is coupled to the resistive element and to a second source line, the resistive element being coupled at one end to the first and second access transistors and at an opposite end to a bit line. The memory array further has other resistive elements that are each coupled to the bit line. The resistive element is written to while one or more of the other resistive elements are being read.