Patents Assigned to Broadcom
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Publication number: 20140061886Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.Type: ApplicationFiled: November 13, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Sam Ziqun Zhao, Rezaur Rahman Khan
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Publication number: 20140061946Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.Type: ApplicationFiled: November 13, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Sam Ziqun Zhao, Rezaur Rahman Khan
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Publication number: 20140064398Abstract: A method includes determining that an antenna shared between a Bluetooth transceiver and a WLAN transceiver is available to the WLAN transceiver based on an activity signal associated with the Bluetooth transceiver. Access to the shared antenna is provided to the WLAN transceiver based on the determination, and the WLAN transceiver is configured to use diversity in transacting WLAN signals via a plurality of antennas, including the shared antenna. Access to the shared antenna is transferred from the WLAN transceiver to the Bluetooth transceiver based on the activity signal.Type: ApplicationFiled: November 11, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Brima IBRAHIM, Prasanna DESAI, Mark GONIKBERG
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Publication number: 20140064088Abstract: A system and method for increasing input/output speeds in a network switch. A physical layer device is provided that includes a physical coding sublayer that insert data flow identifiers to data flows that are provided to a gearbox. In one embodiment, the gearbox is a 5 to 2 gearbox that can transport various combinations of 10G/40G data flows over a narrower interface to a second physical layer device having an inverse gearbox.Type: ApplicationFiled: November 8, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Ali Ghiasi, Velu Pillai, Sundar Chidambara
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Publication number: 20140061945Abstract: The present application discloses various implementations of a semiconductor package including an organic substrate and one or more interposers having through-semiconductor vias (TSVs). Such a semiconductor package may include a contiguous organic substrate having a lower substrate segment including first and second pluralities of lower interconnect pads, the second plurality of lower interconnect pads being disposed in an opening of the lower substrate segment. The contiguous organic substrate may also include an upper substrate segment having an upper width and including first and second pluralities of upper interconnect pads. In addition, the semiconductor package may include at least one interposer having TSVs for electrically connecting the first and second pluralities of lower interconnect pads to the first and second pluralities of upper interconnect pads. The interposer has an interposer width less than the upper width of the upper substrate segment.Type: ApplicationFiled: November 13, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Sam Ziqun Zhao, Rezaur Rahman Khan
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Publication number: 20140065979Abstract: Communication processing paths include distortions, such as DC offset in the baseband analog path which needs to be accounted for. The use of a digital-to-analog converter (DAC) to inject a DC offset cancellation signal can bring about noise/area/power advantages. The DAC is driven by a mixed signal low pass filter loop. However, the DAC could also be driven in an open loop system, or a combination of open and closed loop. A low noise sign and magnitude DAC with low area and power requirements is implemented using selectively connected programmable current sources to virtual earth input terminals on a transimpedance amplifier (TIA) op-amp circuit. The constant virtual earth voltage eliminates linearity problems that would otherwise exist due to the finite current source output impedance. Current sources are only switched in when required so unneeded sources are out of circuit and do not contribute noise or use any power.Type: ApplicationFiled: August 31, 2012Publication date: March 6, 2014Applicant: BROADCOM CORPORATIONInventor: Andrew Terry
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Publication number: 20140062738Abstract: Various pipeline ADCs are disclosed that substantially compensate for interference or distortion that results from imperfections with various ADC modules of the pipeline ADCs. The pipeline ADCs include various ADC stages and various compensation stages that are coupled to the various ADC stages. The various ADC stages convert their corresponding analog inputs from an analog signal domain to a digital signal domain to provide various digital output signals and various analog residual signals to subsequent ADC stages. The various compensation stages compensate for interference or distortion that is impressed onto the various analog residual signals which results from imperfections within previous ADC stages.Type: ApplicationFiled: September 5, 2012Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Jiangfeng WU, Tianwei LI, Wenbo LIU, Wei-Ta SHIH, Chun-Ying CHEN, Lin HE, Randall PERLOW, Binning CHEN, Ramon GOMEZ
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Publication number: 20140068716Abstract: Methods and systems for processing Ethernet data are disclosed and may comprise receiving Ethernet data via a single gigabit Ethernet IP telephone chip. A secure application key may be received from a secure server by an OSM integrated within the gigabit Ethernet IP telephone chip for processing the received Ethernet data. The received Ethernet data may be processed by the gigabit Ethernet IP telephone chip based on the received secure application key. A unique security identifier internal to the single gigabit Ethernet IP telephone chip may be communicated off-chip to the secure server. The unique security identifier may identify the single gigabit Ethernet IP telephone chip. The secure server may authenticate the gigabit Ethernet IP telephone chip based on the unique security identifier internal to the single gigabit Ethernet IP telephone chip, prior to the receiving of the secure application key.Type: ApplicationFiled: September 13, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Balwinder Boora, Henry Li, Paul Shore, Stephen Mueller
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Publication number: 20140064152Abstract: A system distributes high-definition (HD) audio across a local telephone network. The system receives an audio selection from a communication device linked through the local telephone network. The audio selection may identify an audio source to retrieve audio data from, such as a broadcast channel, Internet streaming source, or others. The system can tune a communication resource to obtain an audio stream from the specified audio source, transcode the received audio stream into HD audio data, and distribute the HD audio data to the communication device via the local telephone network. The local telephone network may be an analog telephone network or an Internet Protocol (IP) network that supports Voice over IP (VoIP) communications.Type: ApplicationFiled: September 4, 2012Publication date: March 6, 2014Applicant: Broadcom CorporationInventors: Gordon Y. Li, Xuemin Chen
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Publication number: 20140062782Abstract: A combined GPS and GLONASS receiver receives GPS signals and GLONASS signals. A calibration signal is generated utilizing the received GPS signals and/or the received GLONASS signals to offset group delay errors in the received GLONASS signals. The generated calibration signal is filtered through Kalman filters to estimate group delay variations in the received GLONASS signals. The estimated group error delay variations are combined with the received GLONASS signals to calibrate the received GLONASS signals by offsetting the estimated group error delay variations. When GPS signals are not available for use, the combined GPS and GLONASS receiver obtains group delay errors stored or in the received GLONASS signals to estimate calibration coefficients. The estimate calibration coefficients are updated utilizing received GPS and/or GLONASS signals.Type: ApplicationFiled: February 4, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventor: Broadcom Corporation
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Publication number: 20140061893Abstract: Flip chip packages are described that include two or more thermal interface materials (TIMs). A die is mounted to a substrate by solder bumps. A first TIM is applied to the die, and has a first thermal resistance. A second TIM is applied to the die and/or the substrate, and has a second thermal resistance that is greater than the first thermal resistance. An open end of a heat spreader lid is mounted to the substrate such that the die is positioned in an enclosure formed by the heat spreader lid and substrate. The first TIM and the second TIM are each in contact with an inner surface of the heat spreader lid. A ring-shaped stiffener may surround the die and be connected between the substrate and heat spreader lid by the second TIM.Type: ApplicationFiled: August 29, 2012Publication date: March 6, 2014Applicant: BROADCOM CORPORATIONInventors: Seyed Mahdi Saeidi, Sam Ziqun Zhao
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Publication number: 20140068004Abstract: Methods and systems for a persistent request generated by a wireless device, executed remotely and output to configurable local resources are described and may include generating via a handheld wireless communication device (HWCD) a persistent request for a user that may be communicated to remote devices for execution and storage of results. The stored results may be received from local resources local which may be configured by the remote devices based on user preferences to deliver the stored results to the user. The stored results may be received by the user via the HWCD or another wireless communication device, and the identity of the user may be authenticated prior to receiving the stored results. The remote devices may discover the local resources based on the detection of the user logging into the network. User preferences may be stored in networked devices or may be stored in the HWCD.Type: ApplicationFiled: November 11, 2013Publication date: March 6, 2014Applicant: BROADCOM CORPORATIONInventors: Mark Buer, Arya Behzad, Jeyhan Karaoguz, Alexander MacInnis, Thomas Quigley, John Walley
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Publication number: 20140065961Abstract: A near field communications (NFC) device is disclosed that intelligently routes NFC data from a NFC device between multiple user interfaces based upon a power level of its internal batteries. The communications device utilizes a communications device user interface to send and/or receive the NFC data from the NFC device when its internal batteries are sufficient to operate the communications device user interface. The communications device begins to route some of this NFC data from being sent and/or received by the communications device user interface to a NFC user interface as its internal batteries deplete. Eventually, all of the NFC data will be sent to and/or received by the NFC user interface as the internal batteries of the communications device become so depleted that they are unable to reliably operate the communications device user interface.Type: ApplicationFiled: September 30, 2013Publication date: March 6, 2014Applicant: Broadcom CorporationInventor: David Grant Cox
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Patent number: 8666079Abstract: A method includes receiving data which has been encoded according to a first higher complexity protection scheme and compressed. The method also includes decompressing the data. The method also includes decoding the data according to the first higher complexity protection scheme using a first higher complexity key. The method also includes encoding at least the first portion of the data according to a second higher complexity protection scheme using a second higher complexity key. The method also includes encoding at least a second portion of the data according to a lower complexity protection scheme using a lower complexity key.Type: GrantFiled: May 29, 2008Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Chad William Kendall, Narendra Sankar
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Patent number: 8666335Abstract: Methods and systems for an n-phase transmitter utilizing a leaky wave antenna (LWA) are disclosed and may include transmitting an n-phase wireless signal at a first frequency via the LWA utilizing a plurality of second frequency signals from one or more signal sources, and the second frequency may be lower than the first frequency. Each of the second frequency signals may be configured with a phase difference and may be communicated to the LWA utilizing one or more power amplifiers (PAs). The PAs may be operated in switching mode, thereby generating a square wave. The LWAs may be integrated on the chip, on a package to which the chip is affixed, and/or on a printed circuit board to which the chip is affixed. Square wave signals may be generated utilizing the signal sources. The transmitted wireless signal may be amplitude modulated utilizing a bias voltage applied to the LWAs.Type: GrantFiled: October 19, 2012Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Ahmadreza Rofougaran, Maryam Rofougaran
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Patent number: 8665725Abstract: A system and method for hierarchical adaptive dynamic egress port and queue buffer management. Efficient utilization of buffering resources in a commodity shared memory buffer switch is key to minimizing packet loss. Efficient utilization of buffering resources is enabled through adaptive queue limits that are derived from an adaptive port limit.Type: GrantFiled: June 15, 2012Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Bruce Kwan, Puneet Agarwal
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Patent number: 8666342Abstract: A circuit for a reflection-type variable attenuator may include a hybrid module including an input port, an output port, a first reflection port, and a second reflection port. The hybrid module may be configured to split an incident signal received at the input port into a first and a second input signal. A first and a second reflection circuit may be coupled to the first and the second reflection ports, respectively. The first and the second reflection circuits each may include one or more transistors, and may be configured to, respectively, reflect the first and the second input signals to generate a first and a second reflected signal, which are directed to the output port to be constructively combined to form an output signal that is an attenuated replica of the incident signal. A variable attenuation may be achieved by controlling amount of reflection through the reflection circuits.Type: GrantFiled: February 8, 2013Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Ehsan Adabi, Tirdad Sowlati
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Patent number: 8666160Abstract: Certain embodiments of the invention provide a method and apparatus for DRAM 2D video word formatting. In one aspect of the invention, words of data in a DRAM may be arranged for optimal DRAM operating efficiency. The data organization may utilize a 2-dimensional array of samples, for example. In one embodiment of the invention, a 128-bit or 16-byte word or GWord of DRAM may include an 8×2 array of luma samples, comprising 8 horizontal samples and 2 vertical samples from one field, for example. In this regard, either both may be even lines or both may be odd lines. Various other 2-dimensional arrangements may be chosen according to the demands of the video format being processed in accordance with various embodiments of the invention.Type: GrantFiled: April 22, 2013Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventor: Alexander MacInnis
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Patent number: 8667548Abstract: Different data communication architectures deliver a wide variety of content, including audio and video content, to consumers. The architectures employ channel bonding to deliver more bandwidth than any single communication channel can carry. In some implementations, the communication architectures distribute video programming in the form of MPEG2 TS packets, flagged by marker packets, in a round-robin manner across the communication channels. Channel bonding synchronization information may be present in packets defined above the data-link layer or added to fields within data-link layer frames.Type: GrantFiled: November 9, 2012Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Xuemin Chen, Rajesh Shankarrao Mamidwar, Anand Tongle, Victor Hou
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Patent number: 8665968Abstract: Disclosed are various embodiments of three-dimensional (3D) video coding using scalable video coding (SVC) spatial scalability. In one embodiment, 3D video is encoded to generate a SVC base layer that includes a left first-resolution view and a right first-resolution view packed in a first frame. 3D video is encoded to generate a SVC enhancement layer that includes a left second-resolution view and a right second-resolution view packed in a second frame. The left second-resolution view and the right second-resolution view may have a higher spatial resolution than the left first-resolution view and the right first-resolution view.Type: GrantFiled: July 21, 2010Date of Patent: March 4, 2014Assignee: Broadcom CorporationInventors: Xuemin Chen, Wade Wan, Brian Heng, Jason Herrick