Abstract: The present application provides an integrated semiconductor device and an electronic apparatus, comprising a semiconductor substrate and a first doped epitaxial layer having a first region, a second region, and a third region; a partition structure is arranged in the third region; the first region is formed having at least two second doped deep wells, and the second region is formed having at least two second doped deep wells; a dielectric island partially covers a region between two adjacent doped deep wells in the first region and second region; a gate structure covers the dielectric island; a first doped source region is located on the two sides of the gate structure, and a first doped source region located in the same second doped deep well is separated; a first doped trench is located on the two sides of the dielectric island in the first region, and extends laterally to the first doped source region.

Abstract: A method for manufacturing a semiconductor device, includes: forming a well region (201) in a semiconductor substrate (200) and forming a channel region (202) in the well region (201), and forming a gate oxide layer (210) and a polysilicon layer (220) on the well region (201); etching a portion of the gate oxide layer (210) and the polysilicon layer (220), and exposing a first opening (221) used for forming a source region and a second opening (223) used for forming a drain region; forming a first dielectric layer (230) and a second dielectric layer (240) on the polysilicon layer (220) and in the first opening (221) and the second opening (223) successively, and forming a source region side wall at a side surface of the first opening (221) and forming a drain region side wall at a side surface of the second opening (223); forming a dielectric oxide layer (250) on the polysilicon layer (220), etching the dielectric oxide layer and retaining the dielectric oxide layer (250) located on the drain region side wall

Abstract: An accelerator comprises: an accelerometer (100), configured to detect an acceleration of a motion of a carrier and output a corresponding electrical signal; a sampling and low-pass filter (200), coupled to the accelerometer (100), and configured to sample the electrical signal regularly and filter a noise from the electrical signal; an amplifier (300), configured to amplify the electrical signal after filtering the noise; an analog-to-digital converter (400), configured to convert the amplified electrical signal into a digital signal; a function control module (500), configured to process the digital signal and output a control signal to control the analog-to-digital converter (400), the amplifier (300), and the sampling and low-pass filter (200); and an oscillator module (600), configured to output, according to the control signal, a sampling signal to the sampling and low-pass filter (200), so as to control the sampling and low-pass filter (200) to sample the electrical signal regularly.

Abstract: A delay locked loop detection system (10), the system can be used for detecting the working state of a delay locked loop (400) and comprises: a signal generator (300), which is used for generating a reference clock and providing the reference clock to the delay locked loop (400); and a testing instrument (500), which is used for acquiring the clock signals output from the delay locked loop (400) and measuring whether the time delays thereof are consistent with expectations; the detection system (10) further comprises at least one of the following circuits: a pre-receiving circuit (100), which is used for receiving the reference clock from the signal generator (300) and amplifying and shaping the reference clock and then providing the reference clock to the delay locked loop (400); and a multiphase multiplexing circuit (200), which is used for receiving the clock signals output from the delay locked loop (400) and synthesizing and then providing a plurality of clock signals with different delay to the testing

Abstract: A method for correcting the driving amplitude of a gyro sensor, mainly comprises adjusting the size of a driving signal (a preset amplitude value) through feedback of a sensor response amplitude signal (an average amplitude value) in a resonance maintaining time period, so that the response amplitude of the resonance maintaining time period tends to be equal, and a stable resonance amplitude is maintained. Also provided is a system for correcting the driving amplitude of a gyro sensor.

Abstract: A MOSFET structure and a manufacturing method thereof are provided. The structure includes a substrate, a well region of a first conductivity type, a first trench formed on a surface of the well region of the first conductivity type and extending downwards to a well region of a second conductivity type, a source disposed in the well region of the second conductivity type and under the first trench, a gate oxide layer disposed on an inner surface of the first trench, a polysilicon gate disposed on the gate oxide layer, a conductive plug extending downwards from above the first trench and being in contact with the well region of the second conductivity type after extending through the source, an insulation oxide layer filled in the first trench between the conductive plug and the polysilicon gate, and a drain disposed outside the first trench and obliquely above the source.

Abstract: A lateral insulated-gate bipolar transistor and a manufacturing method therefor. The lateral insulated-gate bipolar transistor comprises a substrate, an anode terminal and a cathode terminal on the substrate, and a drift region and a gate electrode located between the anode terminal and the cathode terminal. The anode terminal comprises an N-shaped buffer zone on the substrate, a P well in the N-shaped buffer zone, an N+ zone in the P well, a groove located above the N+ zone and partially encircled by the P well, polycrystalline silicon in the groove, P+ junctions at two sides of the groove, and N+ junctions at two sides of the P+ junctions.

Abstract: An insulated gate bipolar transistor includes a substrate; a first conductivity type base disposed on the substrate and having a first trench; a first conductivity type buffer region disposed in the first conductivity type base; a collector doped region having a second conductivity type and disposed in the first conductivity type base; a second conductivity type base to which the first trench extends downwardly; a gate oxide layer disposed on an inner surface of the first trench; a polysilicon gate disposed inside the gate oxide layer; an emitter doped region having a first conductivity type and disposed in the second conductivity type base and under the first trench; a conductive plug extending downwardly from above the first trench and contacting the second conductivity type base; and an insulating oxide layer filled in the first trench, the insulating oxide layer insulating and isolating the polysilicon gate from the emitter doped region.

Abstract: An integrated circuit chip and a manufacturing method therefor, and a gate drive circuit, the integrated circuit chip comprising: a semiconductor substrate (103), a high voltage island (101a) being formed in the semiconductor substrate (103); a high voltage junction terminal (102a), the high voltage junction terminal (102a) surrounding the high voltage island (101a), a depletion type MOS device (N1) being formed on the high voltage junction terminal (102a), a gate electrode and a drain electrode of the depletion type MOS device (N1) being short connected, and a source electrode of the depletion type MOS device (N1) being connected to a high side power supply end (VB) of the integrated circuit chip; and a bipolar transistor (Q1), a collector electrode of the bipolar transistor (Q1) being short connected to the substrate and being connected to a low side power supply end (VCC) of the integrated circuit chip, an emitter of the bipolar transistor (Q1) being connected to a gate electrode of the depletion type MOS

Abstract: A ring voltage control oscillator includes: a conversion unit (100), cascaded multistage delay units (200) and cascaded multistage isolation buffer units (300). The conversion unit (100) receives a voltage signal controlled by the external, converts the voltage signal into a current signal and respectively transmits the current signal to a plurality of delay units (200) and a plurality of isolation buffer units (300).

Abstract: A clock voltage step-up circuit comprises a first inverter, a second inverter, a third inverter, a PMOS transistor, and a bootstrap capacitor. An input end of the first inverter is used for inputting a first clock signal. An input end of the second inverter is connected to an output end of the first inverter, and an output end of the second inverter outputs a first control signal used for controlling a sampling switch; and after the first control signal passes through a fourth inverter, a fifth inverter and a sixth inverter, a second control signal used for controlling the sampling switch is generated. An input end of the third inverter is connected to a second clock signal, and the first clock signals and the second clock signals are a set of clock signals, every two of which are not overlapped.

Abstract: A segmented resistor string type digital to analog converter comprises: a most significant bit (MSB) resistor string (104) comprising a high level resistor string, an intermediate level resistor string and a ground level resistor string; a decoding circuit (101), configured to decode an n-bit code of the MSB resistor string (104) and output 2n decoded codes; a logic sequential generation circuit (102), connected to the decoding circuit (101) and configured to perform a logic operation on a middle-position code among the 2n decoded codes and a refresh clock signal in non-overlapping sequences, and output two groups of control signals with completely complementary high level durations; a control signal bootstrap circuit (103), connected to the logic sequential generation circuit (102) and configured to perform bootstrap processing on the control signal, and increase the high level of the control signal to a sum of a power supply voltage and a threshold voltage; and a first switch group (106), connected to the c

Abstract: A stacked spiral inductor, comprising: a substrate, and multiple stacked insulating layers and inductive metal layers formed on the substrate by means of a semiconductor process. Each inductive metal layer comprises a conductive coil in a shape of a spiral and a through hole area used for connecting two adjacent inductive metal layers. The conductive coils of the inductive metal layers have a common coil center. In two adjacent inductive metal layers, the conductive coil of the lower inductive metal layer is retracted toward the coil center with respect to the conductive coil of the upper inductive metal layer.

Abstract: Disclosed is a method for manufacturing an isolation structure for LDMOS, the method comprising: forming a first groove on the surface of a wafer; filling the first groove with silicon oxide; removing part of the surface of the silicon oxide within the first groove by means of etching; forming a silicon oxide corner structure at the corner of the top of the first groove by means of thermal oxidation; depositing a nitrogen-containing compound on the surface of the wafer to cover the surface of the silicon oxide within the first groove and the surface of the silicon oxide corner structure; dry-etching the nitrogen-containing compound to remove the nitrogen-containing compound from the surface of the silicon oxide within the first groove, and thereby forming a nitrogen-containing compound side wall residue; with the nitrogen-containing compound side wall residue as a mask, continuing to etch downwards to form a second groove; forming a silicon oxide layer on the side wall and the bottom of the second groove; rem

Abstract: An optical proximity correction method, comprising: dissecting an edge of a design pattern (120/220) to form a segment (Seg1/Seg2); setting target points of the segments (Seg1/Seg2), and if the segments (Seg1/Seg2) translate in a direction vertical to the segments (Seg1/Seg2), controlling tangent points (P1/P2) of the segments (Seg1/Seg2) tangent to a simulated pattern (110/210) to coincide with the target points; computing edge position differences of the target points; and correcting the design pattern (120/220) according to the edge position differences.

Abstract: A lateral diffused metal oxide semiconductor field effect transistor, comprising a substrate, a gate, a source, a drain, a body region, a field oxide region between the source and drain, and a first well region and second well region on the substrate. The second well region below the gate is provided with a plurality of gate doped regions, and a polycrystalline silicon gate of the gate is a multi-segment structure, each segment being separated from the others, with each gate doped region being disposed below the spaces between each segment of the polycrystalline silicon gate. Each of the gate doped regions is electrically connected to the segment that is in a direction nearest the source from among the two polycrystalline silicon gate segments on either side thereof.

Abstract: A trench gate lead-out structure comprises a substrate (10), a trench formed in the surface of the substrate (10) and a first dielectric layer (22) on the substrate (10), and also comprises a polysilicon gate (31) at the inner surface of the trench. The trench is partially filled by the polysilicon gate (31), so that a recess exists in the trench above the polysilicon gate (31). A second dielectric layer (41) is filled in the recess. The trench gate lead-out structure also comprises a metal plug (50). The metal plug (50) downwards penetrates through the first dielectric layer (22) and then is inserted between the second dielectric layer (41) and the polysilicon gate (31), and accordingly is connected to the polysilicon gate (31).

Abstract: A method for correcting the driving amplitude of a gyro sensor, mainly comprises adjusting the size of a driving signal (a preset amplitude value) through feedback of a sensor response amplitude signal (an average amplitude value) in a resonance maintaining time period, so that the response amplitude of the resonance maintaining time period tends to be equal, and a stable resonance amplitude is maintained. Also provided is a system for correcting the driving amplitude of a gyro sensor.

Abstract: A device integrated with JFET, the device is divided into a JFET region and a power device region, and the device includes: a drain (201) with a first conduction type; and a first conduction type region disposed on a front surface of the drain (201); the JFET region includes: a first well (205) with a second conduction type and formed in the first conduction type region; a second well (207) with a second conduction type and formed in the first conduction type region; a JFET source (212) with the first conduction type; a metal electrode formed on the JFET source (212), which is in contact with the JFET source (212); and a second conduction type buried layer (203) formed under the JFET source (212) and the second well (207).

Abstract: A device integrated with a junction field-effect transistor, the device is divided into a JFET region and a power device area, and the device includes: a drain (201) having a first conduction type; and a first conduction type region (214) disposed on a front face of the drain; the JFET region further includes: a JFET source (208) having a first conduction type; a first well (202) having a second conduction type; a metal electrode (212) formed on the JFET source (208), which is in contact with the JFET source (208); a JFET metal gate (213) disposed on the first well (202) at both sides of the JFET source (208); and a first clamping region (210) located below the JFET metal gate (213) and within the first well (202).