Abstract: An apparatus for processing a workpiece can be exemplarily characterized as including a processing tool having a processing region within which a workpiece can be processed, and an illumination system configured to direct detection light into the processing region. In this embodiment, detection light directable by the illumination system has a wavelength to which the workpiece is at least partially opaque. The apparatus may further include an image sensor configured to detect a characteristic of the detection light transmitted through the processing region and a chuck configured to support a workpiece such that at least a portion of the workpiece is disposable within the processing region and is illuminatable by the detection light. Methods for processing a workpiece are also disclosed.

Abstract: Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

Abstract: An apparatus can include a first beam cropper configured to crop a portion of a radiation pulse having a first spot size to form an intermediate cropped radiation pulse having an intermediate cropped spot with an intermediate cropped spot size less than the first spot size; and a second beam cropper configured to crop the intermediate cropped spot to form a second cropped radiation pulse having a second cropped spot with a second cropped spot size less the intermediate cropped spot size.

Abstract: An improved method of testing and sorting electronic devices uses two or more test stations and two or more sorting stations applied to a single track to improve system throughput. Applying two or more test stations and two or more sorting stations to a single track accomplishes improved system throughput while increasing system cost less than would be expected if a duplicate track was installed for each test station.

Abstract: Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.

Abstract: The invention provides a method of laser processing that includes the steps of: generating a sequence of RF pulses corresponding to a sequence of laser pulses having a laser pulse repetition rate, the RF pulses including transmitting RF pulses at transmitting RF frequencies and non-transmitting RF pulses at non-transmitting RF frequencies for causing the sequence of laser pulses to be deflected in respective transmitting and non-transmitting directions, each RF pulse comprising an RF frequency, an RF amplitude and a duration; controlling each RF pulse such that the sequence of RF pulses provides a modulated RF drive signal that is modulated to provide a balanced thermal loading on the acousto-optic deflector; applying the modulated RF drive signal to the acousto-optic deflector; and deflecting at least one laser pulse with the acousto-optic deflector using the modulated RF drive signal to irradiate a selected target position with a predetermined pulse energy.

Abstract: A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer.

Abstract: A method of accomplishing high-speed intensity variation of a polarized output laser beam includes securing an angle of light incidence sensitive optical element to a galvanometer system that provides high-speed transitioning of the angle of light incidence sensitive optical element between different angular positions. The high-speed transitioning provided by the galvanometer system varies an angle of incidence between an input laser beam and the angle of light incidence sensitive optical element to thereby provide high-speed variation of an intensity of a polarized output laser beam produced by the angle of light incidence sensitive optical element.

Abstract: Calibrating automatic test systems for testing electronic components using Kelvin probes is taught. A nominal contact resistance of a Kelvin probe is measured using a test slug to replace an electronic component to be measured on the test system. The measured resistance is stored by the test system and can be used to compensate for a measured value for an electronic component. A test slug can be periodically inserted into the test system to update the contact resistance measure and/or track the contact resistance to measure Kelvin probe wear and/or contamination.

Abstract: Disclosed is a method for creating a mark desired properties on an anodized specimen and the mark itself. The method includes providing a laser marking system having a controllable laser pulse parameters, determining the laser pulse parameters associated with the desired properties and directing the laser marking system to mark the article using the selected laser pulse parameters. Laser marks so made have optical density that ranges from transparent to opaque, white color, texture indistinguishable from the surrounding article and durable, substantially intact anodization. The anodization may also be dyed and optionally bleached to create other colors.

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed.

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract: A light emitting diode is made using a laser to texture the sidewalls of the bottom contact layer, without damaging a mesa. To do so, the substrate is mounted on a laser machining platform, and trenches are cut along lines through the semiconductor layer on the substrate using a first sequence of laser pulses having short pulse lengths that result in formation of textured sidewalls in the trenches, without causing recasting of the material. Then the substrate can be scribed along the lines of the trenches using a second sequence of laser pulses for singulation of die.

Abstract: Methods of manufacturing a panel and resulting panels include a plurality of microholes arranged in a pattern and filled with light transmissive polymeric material. The light transmissive polymeric material occludes the microholes and is set, or cured, by exposure to an energy source using at least two discrete exposure periods separated by an idle or rest period.

Abstract: Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having a main surface, a tension region within an interior thereof, and a compression region between the main surface and the tension region, includes forming a modified stress zone extending along a guide path within the substrate such that a first portion of the substrate is within the modified stress zone, wherein the portion of the substrate within the modified stress zone has a modified stress different from a preliminary stress of the first portion. A vent crack also formed in the first main surface. The vent crack and the modified stress zone are configured to separate the substrate along the guide path.

Abstract: Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.

Abstract: Methods and apparatus for separating substrates are disclosed, as are articles formed from the separated substrates. A method of separating a substrate having first and second surfaces includes directing a beam of laser light to pass through the first surface and, thereafter, to pass through the second surface. The beam of laser light has a beam waist located at a surface of the substrate or outside the substrate. Relative motion between the beam of laser light and the substrate is caused to scan a spot on a surface of the substrate to be scanned along a guide path. Portions of the substrate illuminated within the spot absorb light within the beam of laser light so that the substrate can be separated along the guide path.

Abstract: A panel with an optically transmissive portion includes a group of holes drilled from one surface to another surface and filled with an optically transmissive material. The group of holes forms a pattern. The holes on a first surface form a smooth and continuous appearance to the naked eye. The holes on the other, second surface are sized so that a light source directed to the second surface illuminates the pattern to be visible to a viewer viewing the first surface. The panel may form a portion of a housing that houses the light source.

Abstract: A method for detecting particulate contamination under a workpiece fixtured by a calibrated material handling system includes performing 3D measurements of a workpiece at multiple of positions to construct a 3D map of the workpiece, calibrating the 3D map by comparing a pre-computed calibration map to the 3D measurements, and detecting particulate contamination by processing the calibrated map.

Abstract: The invention is a method and apparatus for creating marks 194 on an anodized aluminum specimen 190 with selectable color and optical density. The method includes providing a laser marking system 148 having a laser 150, laser optics 154 and a controller 160 operatively connected to said laser 150 to control laser pulse parameters. The laser marking system 148 is directed to produce laser pulses 152 having laser pulse parameters associated with the desired color and optical density in the presence of a fluid 168 directed to the surface of the anodized aluminum specimen 158 while marking.