Patents Assigned to Electro Scientific Industries, Inc.
  • Method and apparatus for reliably laser marking articles
    Patent number: 8761216
    Abstract: The invention is a method and apparatus for creating a color and optical density selectable visible mark on an anodized aluminum specimen. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters and a controller with stored laser pulse parameters, selecting the stored laser pulse parameters associated with the desired color and optical density, directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired color and optical density including temporal pulse widths greater than about 1 and less than about 1000 picoseconds to impinge upon said anodized aluminum.
    Type: Grant
    Filed: January 11, 2013
    Date of Patent: June 24, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Haibin Zhang, Glenn Simenson, Robert Hainsey, David Barsic, Jeffrey Howerton, Wayne Crowther, Patrick Leonard
  • Method and apparatus for optically transparent via filling
    Patent number: 8735740
    Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: May 27, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Glenn Francis Simenson, William Antoni, Steve Cohen, Jeffrey Howerton
  • Shallow angle vertical rotary loader for electronic device testing
    Patent number: 8733535
    Abstract: A rotary loader taught herein comprises a rotatable load plate including a plurality of component pockets arranged about a rotational axis of the load plate, the load plate inclined with respect to a horizontal surface at an angle of inclination of less than 50 degrees and a load wall arranged about a lower portion of the load plate adjacent certain ones of the plurality of component pockets and extending above a height of the load plate. The load wall includes a retention surface extending in a direction parallel to an outer peripheral edge of the load plate and a loading surface inclined with respect a line perpendicular to a top surface of the load plate in a direction away from the retention surface at an angle of inclination of less than 45 degrees.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: May 27, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Douglas J. Garcia
  • Force reaction compensation system
    Patent number: 8735774
    Abstract: A laser beam propagates along a beam axis for incidence on a work surface mounted on a support. The support operatively connects to a positioning system moving at least one of the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. At least one force reaction compensation motor is located in a common force plane with, and as close as possible to, a corresponding stage motor. Any moment arm between the compensation motor and the corresponding stage motor is reduced or eliminated, allowing the compensation motor to directly couple and react to stage forces with virtually zero moment arm. Six degrees of freedom can be controlled with only four motors, since each compensation motor is directly coupled and aligned to a corresponding stage motor.
    Type: Grant
    Filed: July 28, 2009
    Date of Patent: May 27, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mark T. Kosmowski
  • Method and apparatus for improved laser scribing of opto-electric devices
    Patent number: 8735772
    Abstract: Disclosed are laser scribing systems for laser scribing semiconductor substrates with backside coatings. In particular these laser scribing systems laser scribe opto-electric semiconductor wafers with reflective backside coatings so as to avoid damage to the opto-electric device while maintaining efficient manufacturing. In more particular these laser scribing systems employ ultrafast pulsed lasers at wavelength in the visible region and below in multiple passes to remove the backside coatings and scribe the wafer.
    Type: Grant
    Filed: February 20, 2011
    Date of Patent: May 27, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Juan Chacin, Irving Chyr, Jonathan Halderman
  • METHOD AND APPARATUS FOR PROCESSING A WORKPIECE AND AN ARTICLE FORMED THEREBY
    Publication number: 20140138727
    Abstract: A manufacturing process is applicable to singulating die from a substrate, where the substrate has a layer distinguishable from the substrate by a mechanical property such as brittleness. The process can include providing a workpiece including a substrate and a layer disposed on a first surface, modifying the mechanical property such as by compression, deforming a region of the substrate proximate to the portion of the layer having the modified mechanical property; and fracturing the portion of the layer at a location proximate to the deformed region of the substrate. Also, the process can include propagating a crack through a region of the substrate on a line along the modified portion of the layer. A die formed in this manner is also provided.
    Type: Application
    Filed: November 14, 2013
    Publication date: May 22, 2014
    Applicant: Electro Scientific Industries, Inc.
    Inventors: THOMAS CHANG, THOMAS BOATWRIGHT, JONATHAN D. HALDERMAN
  • Method and apparatus for optically transparent via filling
    Patent number: 8729404
    Abstract: A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: May 20, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Glenn Simenson, William Antoni, Steven Cohen, Jeffery Howerton
  • Minimizing thermal effect during material removal using a laser
    Patent number: 8729427
    Abstract: A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: May 20, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Yasu Osako
  • Laser machining of fired ceramic and other hard and/or thick materials
    Patent number: 8723075
    Abstract: Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: May 13, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: James N. O'Brien, Peter Y. Pirogovsky, Michael S. Nashner
  • On-the-fly manipulation of spot size and cutting speed for real-time control of trench depth and width in laser operations
    Patent number: 8723076
    Abstract: Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: May 13, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Mehmet E. Alpay, Brian Johansen, David Childers
  • CONFIGURATIONS OF APERTURES IN A MINIATURE ELECTRONIC COMPONENT CARRIER MASK
    Publication number: 20140116922
    Abstract: A miniature component carrier includes a thin, resilient mask through which are formed multiple spaced-apart apertures each of which is sized and shaped to compliantly receive and hold a miniature component in a controlled orientation during termination processing such that the side margins of the aperture primarily contact and grip the corner regions of the miniature component. At least some of the apertures have side margins that form rhomboidal or elliptical apertures. The shape and size of the multiple spaced-apart apertures confine within an operational tolerance contact between the side margins of the aperture and the side or end wall surfaces of the electronic component. This reduces mechanical damage to the side and end wall surfaces that results from their contact with the side margins during receipt and gripping of the miniature component in the aperture.
    Type: Application
    Filed: January 6, 2014
    Publication date: May 1, 2014
    Applicant: Electro Scientific Industries, Inc.
    Inventors: William J. Saunders, Douglas J. Garcia, Nick A. Tubbs, Gerald F. Boe
  • Method of and apparatus for laser drilling holes with improved taper
    Patent number: 8710402
    Abstract: A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO2 laser pulses with identical pulse parameters. Real time pulse tailoring is not required; therefore, system complexity and cost may be reduced.
    Type: Grant
    Filed: June 1, 2007
    Date of Patent: April 29, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Weisheng Lei, Hisashi Matsumoto, Gregg Hardy, Yunlong Sun
  • Sample chamber for laser ablation inductively coupled plasma mass spectroscopy
    Patent number: 8710435
    Abstract: An improved sample chamber for laser assisted spectroscopy integrates valve mechanisms into the sample drawer, permitting the sample chamber to automatically bypass, purge and resume flow as the sample drawer is opened and closed to insert samples for processing. Integrating valve mechanisms into the sample drawer in this manner eliminates the need for external valves to be operated to bypass, purge and resume flow, thereby increasing system throughput and reducing system complexity.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: April 29, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Robert Hutchinson, Leif Summerfield, Shane Hilliard, Jay Wilkins
  • METHOD AND APPARATUS FOR MARKING AN ARTICLE
    Publication number: 20140110384
    Abstract: The invention is a method and an apparatus for marking an article and the article thus marked. It includes providing the article. Generating a plurality of groups of laser pulses. At least one of the plurality of groups is generated by modulating a beam of laser pulses to form a plurality of beamlets. Each, of the plurality of beamlets, include at least one laser pulse. It also includes directing the plurality of groups of laser pulses onto the article such that laser pulses within the at least one of the plurality of groups impinge upon the article at spot areas that do not overlap one another, wherein laser pulses within the plurality of groups are configured to produce a visible mark on the article.
    Type: Application
    Filed: October 21, 2013
    Publication date: April 24, 2014
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Jan Kleinert, Robert Reichenbach, Mark Unrath, Hisashi Matsumoto, Jefferey Howerton, Mehmet E. Alpay, Andy MOORE
  • Apparatus and method for handling a substrate
    Patent number: 8702142
    Abstract: A grip mechanism for an end effector includes a grip member configured to be coupled to an effector body. A gripper of the grip member is movable based on movement of the grip member such that the gripper is movable along an engagement path to an engagement position where an object such as a substrate can be retained within a retaining region adjacent to the effector body. End effectors for handling objects incorporating one or more grip mechanisms, and methods of handling an object such as a substrate, are also disclosed.
    Type: Grant
    Filed: January 4, 2012
    Date of Patent: April 22, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Kyung Young Kim
  • Apparatus and method for non-contact sensing of transparent articles
    Patent number: 8706288
    Abstract: A laser-based displacement detector is used to detect cosmetic coatings applied to one surface of the transparent article and thereby determine which side is uppermost when loaded into the laser processing system. In particular, articles that are transparent to visible light and are particularly difficult to orient properly in laser processing systems are oriented using a laser-based displacement detector in conjunction with a partial coating on the article.
    Type: Grant
    Filed: May 19, 2010
    Date of Patent: April 22, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventor: Mehmet Emin Alpay
  • SYSTEMS AND METHODS FOR PROVIDING TEMPERATURE STABILITY OF ACOUSTO-OPTIC BEAM DEFLECTORS AND ACOUSTO-OPTIC MODULATORS DURING USE
    Publication number: 20140098410
    Abstract: The invention provides a method of laser processing with a thermally stabilized acousto-optic beam deflector.
    Type: Application
    Filed: October 18, 2013
    Publication date: April 10, 2014
    Applicant: Electro Scientific Industries, Inc.
    Inventors: James Cordingley, Dimitry Maltsev
  • Tracking and marking specimens having defects formed during laser via drilling
    Patent number: 8694148
    Abstract: A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: April 8, 2014
    Assignee: Electro Scientific Industries, Inc.
    Inventors: Michael Tyler, Robert W. Colby, Jeffrey W. Leonard, Lindsey M. Dotson, David A. Watt, Cris E. Hill, Laura H. Campbell
  • PROBE OUT-OF-POSITION SENSING FOR AUTOMATED TEST EQUIPMENT
    Publication number: 20140091820
    Abstract: Detecting misalignment of test probes with component carriers in an automated test system is taught. Automated test systems for testing electronic components can have electronic components held in component carriers in preparation for testing. Testing can include moving test probes through openings provided in the component carrier to contact the electronic components held therein. Aspects of disclosed implementations use force feedback from the test probes to determine if the test probes have successfully contacted the electronic component without, for example, contacting the component carrier.
    Type: Application
    Filed: September 28, 2012
    Publication date: April 3, 2014
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Joseph Johann Emery, Jae H. Kim, Daniel Joel Boatright, Michael Charley Stocks, James Ray Huntington
  • ULTRASHORT LASER PULSE WAFER SCRIBING
    Publication number: 20140091069
    Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.
    Type: Application
    Filed: December 5, 2013
    Publication date: April 3, 2014
    Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
    Inventors: Jeffrey A. Albelo, Peter Pirogovsky