Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

Abstract: A gas shield positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a container forming, filling and sealing station.

Abstract: A gas shield generator positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a parison blowing and filling station.

Abstract: A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.

Abstract: An apparatus and methods are provided for a pass-through dongle for accessing and interacting with vehicle performance and status data. The dongle includes a first connector for plugging into an OBD-II connector of a vehicle. A wireless connection may be established between the dongle and a mobile device that provides access to and interactivity with the vehicle performance and status data. A second connector comprising the dongle is configured to receive an auxiliary device that is configured to access vehicle status data by way of the OBD-II connection. The dongle simultaneously establishes the wireless connection with the mobile device and provides the auxiliary device with access to the vehicle performance and status data. In some embodiments, the dongle is configured to operate in conjunction with a vehicle diagnostic communication system that includes a vehicle performance system whereby the vehicle performance and status data may be interactively accessed.

Abstract: A package structure is provided. The package structure includes an amplifier and a filter structure. The amplifier has an active surface. The filter structure is disposed over the amplifier, and communicates with the amplifier through a first signal path substantially vertical to the active surface of the amplifier.

Abstract: A novel emissions control watercraft (STAXcraft) solving a long-felt but unsolved need regarding disadvantages associated with prior-art emissions servicing watercraft, the disadvantages selected from the group, but not limited to, the use of tugboats, securing or mooring servicing watercraft to a serviced vessel, additional expenses and time-delays and inefficiencies of land-based approaches, increased toxic emissions, increased greenhouse gases (GHG) emissions, danger from falling cargo, tanker safety, alongside mooring in narrow channels preventing other OGV's to pass safely, and cargo tank emissions.

Abstract: An electronic package includes a pad, a dielectric layer, a bump, and a conductive element. The dielectric layer encapsulates the pad and includes an opening exposing the pad. The bump is disposed over the pad. The conductive element is disposed in the opening between the pad and the bump. The conductive element is configured to mitigate a shrinkage of an electrical path between the pad and the bump occupied by an expansion of the dielectric layer.

Abstract: A semiconductor substrate and a package structure including the same are provided. The semiconductor substrate includes a first surface and a second surface. The first surface includes a filtering region. The second surface is opposite to the first surface and includes an amplifying region.

Abstract: Disclosed are methods and apparatus for providing pre-assembled modular structural louvered systems that include structural supports and louvers, and may also include dampers, actuators and wiring in pre-assembled modules that may be transported to a building site, tilted up into place, and installed. Embodiments of the present invention also provide methods and apparatus for providing pre-assembled modular structural louvered systems which include integrated vertical and horizontal structural supports, allowing for the elimination of some vertical and horizontal wall structures in a building by relying on the structural support provided in the modular louvered systems, thereby making more space available in the building for louvers and airflow.

Abstract: Modeling performance of solar trackers at a solar site in order to accurately predict performance while subject to the limitations of available processing resources. Certain aspects of this invention include transposition modeling each individual bay of a solar site with terrain-adaptive backtracking schedules that prevent interrow shading. Further aspects include simplifying the bay composition of the solar site and/or the backtracking schedule, such as by averaging or otherwise choosing a representative angle amongst a plurality of angles, in order to simplify the modeling performance while still obtaining an accurate result.

Abstract: A method of for mixing gases is described. The gases may include a first and a second gas wherein a gas mixing system accepts the gases and operates in a plurality of modes of operation to produce a discharge gas including a mixture thereof, and the second gas may be supplied without the first gas, and the first gas may be supplied without the second gas. The gas mixing system may be integrated with a gas processing system to produce a biogas-related product. The gas mixing system may be a compressor, a jet compressor, an ejector, an eductor, venturi jet pump, eductor-jet pump, and/or a thermocompressor, that uses a first stream of high-pressure gas to entrain a relatively lower pressure second gas, mixes the two, and discharges a third gas mixture that is of a sufficiently elevated pressure to be supplied to other areas of a production facility.

Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within building spaces. The air filter comprises a support frame having a shape and size suitable to orient the air filter within a HVAC system. A compound filter medium is retained within the support frame to remove the airborne molecular contaminants and VOCs from air flowing through the HVAC system. A portion of the first media layer is pleated and may comprise a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. A second portion of the filter medium is coupled to the first portion and maintains a uniform distribution of the pleats with the first portion.

Abstract: Pre-roll infusing apparatus includes fluid vessel, a fluid pump and an infusion needle for spraying fluid into the pre-roll. An elevator includes a tube nest for receiving a support tube containing the pre-roll and selectively raises the pre-roll to be pierced by the needle. A needle heater is supported for travel along the needle as the elevator moves up and down. The elevator tube nest includes a motor-driven rotatable base for rotating the support tube and pre-roll during infusion. A stepper motor equipped with an encoder controls the raising and lowering of the elevator. The needle may include two or more spaced spray ports. A needle pointer indicates to a user the location of the needle spray ports. The fluid vessel includes a stirrer motor, and the current draw thereof is used to determine the viscosity of the fluid. Different support tubes are provided to accommodate different pre-roll styles.

Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.

Abstract: The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.

Abstract: A semiconductor package structure and a method of manufacturing a semiconductor package structure is provided. The semiconductor package structure includes a carrier and a component. The carrier includes a first part and a second part separated from the first part. The component is disposed under the first part and electrically connected to the second part. The first part is configured to be electrically connected to a device disposed over the first part.

Abstract: An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.