Abstract: A diaphragm pump system includes a diaphragm pump and a pressure regulator. The diaphragm pump has a housing having a pumping chamber containing fluid to be pumped, and a transfer chamber adapted to contain hydraulic fluid. A diaphragm is supported by the housing and at least partially defines a pumping chamber side and a transfer chamber side. A driven plunger slides in a reciprocating motion and forcing hydraulic fluid against the diaphragm. A first valve allows hydraulic fluid into the transfer chamber and a second valve allows hydraulic fluid to be removed from the transfer chamber. A hydraulic fluid reservoir is in fluid communication with the transfer chamber. The pressure regulator includes valving that provides a hydraulic fluid pressure above a pumped fluid inlet feed pressure to maintain a proper amount of hydraulic oil in the transfer chamber.

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

Abstract: The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a power die and a patterned layer. The power die has a front surface, a backside surface, and a lateral surface extending between the front surface and the backside surface. The patterned layer is disposed on the backside surface. The patterned layer is indented from the lateral surface of the power die.

Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.

Abstract: The present disclosure provides a semiconductor package structure having a semiconductor die having an active surface, a conductive bump on the active surface, configured to electrically couple the semiconductor die to an external circuit, the conductive bump having a bump height, a dielectric encapsulating the semiconductor die and the conductive bump, and a plurality of fillers in the dielectric, each of the fillers comprising a diameter, wherein a maximum diameter of the fillers is smaller than the bump height.

Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.

Abstract: Disclosed are devices and methods for creating a bore in bone. The devices and methods described involve driving a rotating bit in an axial direction such that both rotation and linear movement are controlled and measurable. The instrument is useful for a surgeon to control and simultaneously measure the travel of the tool into the bone and prevent injury to surrounding structures.

Abstract: An electronic package structure is provided. The electronic package structure includes a first carrier, a first electronic component, a first optical channel, and a second electronic component. The first electronic component is disposed on or within the first carrier. The first optical channel is disposed within the first carrier. The first optical channel is configured to provide optical communication between the first electronic component and the second electronic component. The first carrier is configured to electrically connect the first electronic component.

Abstract: Machine learning techniques for estimating an indication of carotid-femoral pulse wave velocity (CFPWV) and/or vascular age (VA) of a subject from an arterial waveform previously measured at a single site by an arterial waveform acquisition device coupled to the subject, the method comprising using at least one computer hardware processor to perform: obtaining the arterial waveform, the arterial waveform comprising a plurality of portions corresponding to a respective plurality of heartbeats of the subject; generating a representative heartbeat waveform from the arterial waveform; and providing the representative heartbeat waveform as input to a trained machine learning model to produce a corresponding output indicative of the CFPWV of the subject.

Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant.

Abstract: The present disclosure provides an antenna device. The antenna device includes a dielectric element including a first region and a second region, a first antenna disposed on the first region, and a second antenna disposed on the second region. The first antenna and the second antenna are configured to operate in different frequencies. The first antenna and the second antenna are misaligned in directions perpendicular and parallel to a surface of the dielectric element on which the first antenna or the second antenna is disposed.

Abstract: A throttle-controlled intake system is disclosed that provides a driver of a vehicle with greater control over engine functions and vehicle performance. The throttle-controlled intake system includes a control module that is coupled with an aircharger air intake. The control module processes input signals from a throttle pedal of the vehicle and sends modified throttle position signals to a throttle body of the vehicle so as to increase throttle responsiveness of the vehicle. The throttle-controlled intake system further includes a wiring harness and a signal adjuster. The wiring harness electrically couples the control module with the throttle pedal and the throttle body. The control module sends signals directly to the throttle body of the engine, bypassing an electronic control unit of the vehicle. The signal adjuster includes a rheostat that enables manual adjustment of the throttle responsiveness of the vehicle.

Abstract: Tire-tread constructions may incorporate multiple circumferential asymmetries. Prime-number values are used for (a) the number of pitches (where a pitch is an individual pattern that is repeated around the circumference of the tire tread); (b) the number of segments of the mold with which the overall tire tread is formed; (c) the number of variations in the lengths of pitches; or (d) the number of variations in the lengths of the segments.

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

Abstract: An electronic device is disclosed. The electronic device includes a first module having a first electronic component, a second module at least partially overlapped with the first module and having an encapsulant, and a first power path penetrating through the encapsulant and providing a first power signal to a backside surface of the first electronic component.

Abstract: A detachable pre-filter assembly, an air filter with the detachable pre-filter assembly, and an air-filtration enabled device featuring the air filter with the detachable pre-filter assembly are provided. The air filter includes a perimeter frame that defines a cavity, a filter element disposed within the cavity, and a pre-filter assembly secured to the perimeter frame in a detachable configuration. The pre-filter assembly includes a pre-filter element disposed adjacent to the filter element and a retainer element disposed adjacent to the pre-filter element. The retainer element retains the pre-filter element adjacent to the filter element and engages with the perimeter frame. Thus, the retainer element retains the washable and reusable pre-filter element in place, while allowing removal, installation, and potential re-use of the pre-filter element with ease.

Abstract: An optical package structure is provided. The optical package structure includes a first substrate, a second substrate, a first optical component, a second optical component, and an electrical shielding element. The second substrate is over the first substrate. The first substrate and the second substrate collectively define a first cavity. The first optical component is disposed in the first cavity. The second optical component is disposed over the first substrate. The electrical shielding element is disposed adjacent to a sidewall of the first cavity and between the first optical component and the second optical component.

Abstract: An optoelectronic structure is provided. The optoelectronic structure includes a carrier, a first optical component, and a second optical component. The first optical component is supported by the carrier. The second optical component is supported by the first optical component and optically coupled to the first optical component.

Abstract: A package structure and a testing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The wiring structure includes at least one dielectric layer, at least one conductive circuit layer in contact with the dielectric layer, and at least one test circuit structure in contact with the dielectric layer. The test circuit structure is disposed adjacent to the interconnection portion of the conductive circuit layer. The first electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the interconnection portion of the conductive circuit layer.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a second electronic component, and a reinforcing component. The first electronic component is fabricated by a first technology node. The second electronic component is fabricated by a second technology node different from the first technology node. The reinforcing component supports the first electronic component and the second electronic component. The first electronic component has an upper surface facing the reinforcing component and a lower surface configured to receive a first power.