Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

Abstract: The chips in coolant having passed through a first bath 202A and a second bath 202B are attracted to a permanent magnets 307B of an endless chain 302B and discharged into a chip box 308. Magnetic force of a permanent magnets 307A of an endless chain 302A is set to be stronger than magnetic force of the permanent magnets 307B of the endless chain 302B. Consequently, fine chips in coolant passing through a third bath 202C and a fourth bath 202D can be attracted to the permanent magnets 307A of the endless chain 302A and discharged into the chip box 308. Further, when coolant having passed through the fourth bath 202D flows into a sub-coolant tank 105, a coolant pump 107 feeds the coolant within the sub-coolant tank 105 to a magnetic inline filter 10 so as to further filtering the coolant.

Abstract: The present disclosure provides an electronic device. The electronic device includes a circuit structure, an interconnection structure disposed over the circuit structure, and an antenna element disposed over the interconnection structure. The antenna element defines a first recess having a sidewall, and the sidewall of the first recess of the antenna element is configured to feed a signal to the antenna element and is electrically connected to the interconnection structure.

Abstract: A gas dispensing canopy positionable over open parisons in a Blow/Fill/Seal machine prior to container forming, filling and sealing minimizes likelihood of particulate contamination of open parisons while the open parisons are transported to a container forming, filling and sealing station.

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

Abstract: An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.

Abstract: A pleat counter and methods are provided to accurately count the number of pleats in a corrugated sheet of material to be used for the production of air filters. The pleat counter comprises a pleat detector mounted underneath a mounting board for counting the pleats. The mounting board is configured to position the pleat detector adjacent to the corrugated sheet of filter material. The pleat detector includes one or more sensors configured to detect the presence of individual pleats comprising the corrugated sheet. The pleat counter includes an interface configured to enable coupling the pleat counter with a data processing system. The data processing system may comprise any of a desktop, a tablet, a server, a mobile phone, a media player, a personal digital assistant (PDA), a personal communicator, a network router or hub, a wireless access point (AP) or repeater, a set-top box, or a combination thereof.

Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.

Abstract: The device includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The device also includes an extension portion and opposing side portions, the opposing side portions extend the length of and contact the second portion and extension portion. The opposing side portions include at least one light which is controlled by a sensor adjacent to a door.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.

Abstract: A bond structure is provided. The bond structure includes a seed layer and a conductive structure. The conductive structure includes a via portion over the seed layer and a plurality of wires protruding from the via portion.

Abstract: A bonding structure and a package structure are provided. The bonding structure includes a first pad and a plurality of first wires. The first pad has a top surface including a first region and a second region, wherein the second region is closer to an edge of the top surface of the first pad than the first region is. The first wires are on the top surface of the first pad, wherein a number of the first wires on the first region is greater than a number of the first wires on the second region.

Abstract: A system uses a storage efficient data representation to route mechanical, electrical, or plumbing (MEP) objects of variable cross-sectional area through a bounded three-dimensional space containing obstructions of varying size and complexity. The system uses the triangular representations of the surfaces of the space in which the systems are to be routed. The system creates a computationally efficient 3D model that accurately represents the physical constraints of the space to be traversed and ensures that the routes are built within the constraints of the physical possibility requirements with no conflicts between different types of the MEP objects being routed.

Abstract: A throttle-controlled intake system is disclosed that provides a driver of a vehicle with greater control over engine functions and vehicle performance. The throttle-controlled intake system includes a control module that is coupled with an aircharger air intake. The control module processes input signals from a throttle pedal of the vehicle and sends modified throttle position signals to a throttle body of the vehicle so as to increase throttle responsiveness of the vehicle. The throttle-controlled intake system further includes a wiring harness and a signal adjuster. The wiring harness electrically couples the control module with the throttle pedal and the throttle body. The control module sends signals directly to the throttle body of the engine, bypassing an electronic control unit of the vehicle. The signal adjuster includes a rheostat that enables manual adjustment of the throttle responsiveness of the vehicle.

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.

Abstract: An electronic device is provided. The electronic device includes a first electronic component, a plurality of second electronic components, and a plurality of conductive elements. The plurality of second electronic components are disposed under the first electronic component. The plurality of conductive elements electrically connect the first electronic component to the plurality of second electronic components. The plurality of conductive elements are free from vertically overlapping the plurality of second electronic components.

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.