Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Abstract: A gas detector comprises a gas detection unit and a filter introducing surrounding atmosphere to the gas detection unit. The filter comprises a gas-permeable organic polymer membrane having an acidic group or a basic group.

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.

Abstract: A semiconductor package and a lid structure are disclosed. The semiconductor package includes a carrier, a lid structure, a first die, and a second die. The lid structure is disposed over the carrier and includes a gas inlet and a gas outlet. The first die is disposed over the carrier. The second die is disposed over the carrier. The lid structure includes a first protrusion pattern protruding toward the carrier and extending between the first die and the second die.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.

Abstract: A flexible package is provided. The flexible package includes a first carrier and a second carrier. The second carrier is electrically connected to the first carrier. The second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier.

Abstract: A radial-type anti-backlash nut for use upon linear actuator leadscrews uses a separate housing resting upon the actuator's main nut. The anti-backlash action is a multi-finger collet and spring setup located inside the housing. The collet tapers radially inward toward tips of the fingers at a specified taper angle. The whole interior length of an internal thread of the collet engages an external thread of the leadscrew. The housing is a pre-load nut with an internal tapered surface that mates with the collet fingers with substantially the same taper angle. The pre-load nut, when screwed onto external threads of the adjustment nut, both compresses a load spring and applies radially inward adjustable load force to the collet fingers against the leadscrew. Three tolerances adjust load: the taper angle of the main nut's collet fingers, the spring load's compression, and the collet finger mismatch with respect to the lead screw.

Abstract: An information providing system includes a content association database storing external information, in which content is divided in a chunk structure, and chunk reference information, in which reference information having a different attribute than the content is divided in a chunk structure, in association with each other. An external information similarity calculation database is built on machine learning using the external information. A processor acquires specific external information, and compares the external information with the acquired specific external information. The processor looks up the external information similarity calculation database, and calculates a similarity between the external information and the specific external information, when the external information does not match with the acquired specific external information.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: An apparatus and method are provided for a cone air filter for a closed intake system of an internal combustion engine. The cone air filter is comprised of a cone-shaped filter medium, retained between a base and a cap, that is fabricated to remove contaminants and particulate matter from an intake airstream. The base is comprised of a flange that couples with an air intake duct of the internal combustion engine. A shell receiver is incorporated into the base and receives a rigid exterior shell, such that the exterior shell surrounds the cone air filter and directs the intake airstream therein. A cap is disposed on an apex portion of the cone air filter and is configured to direct the intake airstream around the apex portion and into the cone-shaped filter medium.

Abstract: A method for manufacturing a package structure includes: providing a first electrical element and a second electrical element on a surface of a first carrier, wherein the second electrical element is shifted with respect to the first electrical element; and moving the first electrical element along at least one direction substantially parallel with the surface of the first carrier until a first surface of the first electrical element is substantially aligned with a first surface of the second electrical element from a top view.

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

Abstract: Systems and methods for determining a mass of a crop by using at least one X-ray scanner is provided. The method includes obtaining at least two scan images of the crop, where a first of the at least two images is obtained along a first plane relative to the crop and a second of the at least two images is obtained along a second plane relative to the crop, and where the first plane is angularly displaced relative to the second plane, registering the first image and the second image, correcting the registered first and second images, and determining the mass of the crop from the corrected first and second images.

Abstract: A system and method for securing a roof truss to a load bearing wall is disclosed. A strap is attached to a roof truss at one end and extended to the top of a load-bearing wall. A buckle is placed over the strap to secure the strap between the buckle and the roof truss, and also the buckle and the load-bearing wall. The end of the strap is extended along the top of buckle toward the roof truss and a top plate secures the strap between the buckle and the top plate. Screws are placed through holes in the top plate and corresponding holes in the buckle to attach the system to the top of the load-bearing wall. The system and method of the invention provides both horizontal (lateral) resistance and uplift resistance, thus resisting horizontal (lateral) forces while at the same time providing uplift resistance.