Abstract: Solar trackers that may be advantageously employed on sloped and/or variable terrain to rotate solar panels to track motion of the sun across the sky include bearing assemblies and other mechanical features configured to address mechanical challenges posed by the sloped and/or variable terrain that might otherwise prevent or complicate use of solar trackers on such terrain.

Abstract: A multiple fluid model tool for multi-dimensional fluid modeling of a biological structure is presented. For example, a system includes a modeling component, a machine learning component, and a three-dimensional health assessment component. The modeling component generates a three-dimensional model of a biological structure based on multi-dimensional medical imaging data. The machine learning component predicts one or more characteristics of the biological structure based on input data and a machine learning process associated with the three-dimensional model. The three-dimensional health assessment component that provides a three-dimensional design environment associated with the three-dimensional model. The three-dimensional design environment renders physics modeling data of the biological structure based on the input data and the one or more characteristics of the biological structure on the three-dimensional model.

Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.

Abstract: An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.

Abstract: An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.

Abstract: An apparatus and methods are provided for a portable mass airflow (MAF) training module configured to simulate an air intake into an internal combustion engine. An in-line blower draws an airflow through an air filter by way of a first air duct and a second air duct. A throttle assembly is coupled between the first air duct and the second air duct. The throttle assembly includes a throttle plate that may be rotated to regulate the airflow. The power output of the in-line blower is variable to simulate the air intake of various sizes of the internal combustion engine. A MAF sensor and a duct velocity sensor are configured to provide airflow information. The portable MAF training module enables a practitioner to select a desired throttle setting and observe a resultant mass airflow through the portable MAF training module that is measured by the MAF sensor.

Abstract: A heat exchanger includes an inlet for receiving bulk solids, a plurality of heat transfer plate assemblies, a plurality of spacers disposed between adjacent heat transfer plate assemblies, and supports for supporting the heat transfer plate assemblies. The heat transfer plate assemblies include a first plate having a first pair of holes extending therethrough, the first plate having channels extending along a surface thereof, for the flow of fluid through the channels, and a second plate bonded to the first plate to enclose the channels, the second plate including a second pair of holes generally aligned with the first pair of holes to form through holes to facilitate flow of the fluid through the through holes and the channels.

Abstract: A discharge device includes a nozzle (50) having a plurality of discharge ports, a liquid chamber (26) communicating with the plurality of discharge ports via a plurality of discharge flow paths, and a plunger rod (18) that reciprocates in the liquid chamber and is narrower than the liquid chamber. The plurality of discharge ports (62) is arranged un a straight nozzle arrangement line, and arranged with such a distance therebetween that globs of a liquid material having landed on an application target join together to form an application line. A plurality of liquid globs having been discharged from the plurality of discharge ports (62) have no contact with each other before landing on the application target, and letting the globs of the liquid material having landed join together on the application target.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.

Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.

Abstract: Waste water treatment systems and methods are described that remove screenings, objects, and grit from waste water. The system includes a tank for receiving unfiltered waste water from an inlet and a flow screen installed in the tank to capture screenings that are objects too large to pass through the flow screen. A washing compactor ejects the screenings out of the system. Filtered water containing grit passes through the flow screen and under a velocity-diffusing baffle surrounding the flow screen into the tank to produce a grit slurry. A pump removes the grit slurry from the tank through piping to a dewatering device, and the dewatering device removes water from the grit slurry to produce dewatered grit. Filtered waste water and objects are transmitted out of the tank via an outlet after it flows over an overflow weir installed around an interior surface of a wall of the tank.

Abstract: Provided is an antibody that binds to the N-protein of SARS-CoV-2, and a method for utilizing the antibody.

Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.

Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.

Abstract: An apparatus includes an enclosure having one or more apertures for receiving therethrough optical fiber, and one or more actuators sealed within the enclosure for generating one or more interference signals for interfering with optical fiber within the enclosure such that an optical path length of the optical fiber is altered. A method for verifying an event detection system includes interrogating optical fiber positioned alongside a conduit by sending one or more light pulses along the optical fiber and receiving reflections of the one or more light pulses. The method further includes using an event verification device housed within an enclosure through which passes the optical fiber to generate one or more interference signals for interfering with the optical fiber such that an optical path length of the optical fiber is altered.