Abstract: A package structure includes a substrate, an electronic device, an underfill, and an underfill guide structure. The electronic device is disposed over the substrate. The underfill is outflanked by the substrate and the electronic device. The underfill guide structure is disposed outside of a vertical projection of the circuit structure and horizontally overlaps a gap between the substrate and the electronic device, and configured to reduce an extension of a portion of the underfill outside of the vertical projection along a lateral surface of the electronic device.

Abstract: An antenna module is provided. The antenna module includes a conductive structure, a first dielectric layer, and a second dielectric layer. The conductive structure defines a first space and a second space over the first space. The first dielectric layer is at least partially within the first space and has a first dielectric constant. The second dielectric layer is at least partially within the second space and has a second dielectric constant different from the first dielectric constant.

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element and a deformable element configured to convert energy from one form to make the flexible element compliant with a user's skin.

Abstract: An electronic device is disclosed. The electronic device includes an interposer, a voltage regulator, a first circuit structure, and an electronic component. The voltage regulator is attached to the interposer. The first circuit structure is supported by the interposer. The electronic component is disposed adjacent to the interposer and electrically connected to the voltage regulator through the first circuit structure and the interposer.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a first interposer. The first electronic component is disposed under the interposer and includes a logic circuit and a power delivery circuit disposed between the interposer and the logic circuit. The interposer and the power delivery circuit are collectively configured to function as a power delivery structure which is electrically connected to the logic circuit.

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element having a channel, a first cover at least covering the channel, and a transducing element connected with the flexible element. The transducing element is configured to convert energy from one form to another to deform and affect the flexible element to adjust a dimension of the first cover.

Abstract: The present disclosure provides a semiconductor device package including a substrate, a waveguide component, and an antenna pattern. The substrate includes a feeding element. The waveguide component is disposed over the substrate. The antenna pattern is disposed over the substrate. The waveguide component is substantially aligned with the feeding element and the antenna pattern.

Abstract: A package structure includes a wiring structure, a first electronic device and a reinforcement structure. The first electronic device is disposed over the top surface of the wiring structure, and has a bottom surface facing the top surface of the wiring structure. The first electronic device includes a plurality of first wires. The reinforcement structure is disposed over the top surface of the wiring structure, and includes a plurality of second wires directly contacting the plurality of first wires to reduce a variation of an elevation of the bottom surface of the first electronic device with respect to the top surface of the wiring structure.

Abstract: An apparatus and a method are provided for an air filter configured to be mounted onto air inlets of turbochargers and superchargers. The air filter comprises a proximal base including an inlet receiver configured to receive an air inlet, a clamp to secure the air inlet within the inlet receiver, and a first opening aligned with a screw mechanism of the clamp. A filter medium fastened to the proximal base is configured to remove particulate matter and other contaminates from an incoming air stream. A distal end cap fastened to the filter medium comprises a second opening aligned with the first opening. A conduit within an interior cavity of the air filter is disposed between the first opening and the second opening, facilitating tightening and loosening the clamp by extending an appropriate tool through the interior cavity so as to engage the screw mechanism of the clamp.

Abstract: A method and equipment for manufacturing a package structure are disclosed. The equipment includes a first space, a de-bonding apparatus, a second space and a fluid supply device. The de-bonding apparatus is disposed in the first space, and configured to perform a de-bonding process. The second space is disposed around the first space. The fluid supply device is configured to make a first humidity of an atmosphere in the first space greater than a second humidity of an atmosphere in the second space.

Abstract: A method for manufacturing a package structure is provided. The method includes providing a package structure including a first region and a second region different from the first region, wherein the package structure comprises a package substrate having an active surface and a backside surface; and irradiating the package structure by a first light beam along a first direction from the active surface toward the backside surface, wherein the first light beam only irradiates the first region without irradiating the second region.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.

Abstract: Support assemblies are described herein for use with heat exchanges, wherein the assemblies are deflector and grid support assemblies having a grid support structure formed of a series of interconnected strips and having a peripheral exterior configured to be positioned within an interior surface of a heat exchanger such that the grid support structure substantially extends across a transverse cross-section of the interior of a the tube heat exchanger, wherein the grid support has a first grid support surface and an opposite second grid support surface longitudinally spaced from the first grid surface, the grid support structure defines a plurality of passageways extending therethrough from the first to the second grid support surface, the passageways being configured to support longitudinally extending tubes of a heat exchanger passing substantially perpendicularly to the first grid support surface through the passageways from the first grid surface to the second grid surface without substantially obstructin

Abstract: The present invention provides an adhesive composition which is a primerless urethane-based adhesive and has high adhesive force with respect to a polyolefin-based resin. An adhesive composition according to the present invention is a two-liquid type urethane-based adhesive composition comprising: a main agent which comprises (A) a urethane prepolymer having an isocyanate group at the end thereof, (B) a polyfunctional isocyanate compound having an alkoxysilyl group which can be obtained through a reaction of a silane compound having at least two alkoxysilyl groups in one molecule and a polyisocyanate having an isocyanate group at the end thereof and (C1) a first curing catalyst; and a curing agent which comprises (D) a hydrophobic polyol and (C2) a second curing catalyst.

Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.

Abstract: An apparatus and a method are provided for a modular intercooler block that may be fabricated by way of direct metal printing and assembled to form larger intercoolers. The modular intercooler block comprises cooling fins that are spaced between first and second core headers to allow passage of an airstream. Countersunk holes are arranged on the first and second core headers and configured to receive grommets when the first or second core header is fastened to another core header comprising similarly arranged countersunk holes. A core tube extends along an undulating path from each countersunk hole in the first core header, through the multiplicity of cooling fins, to a similar countersunk hole in the second core header. The core tubes may include thin copper walls and spiraled inner passages to enhance heat transfer to the airstream passing through the multiplicity of cooling fins.