Abstract: An electronic device is provided. The electronic device includes a flexible body having a first portion and a second portion, an electronic component in the first portion and the second portion of the flexible body, a first magnetic element in the first portion of the flexible body and a second magnetic element in the second portion of the flexible body. The first magnetic and the second magnetic generate a repulsive force with each other when the flexible body is bent and the first portion and the second portion of the flexible body are moved toward each other.

Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.

Abstract: Disclosed herein are systems and methods for regenerating media in a siloxane removal system. In particular, the present disclosure relates to a method for regenerating an adsorption medium, comprising receiving a source gas stream comprising at least one hydrocarbon and carbon dioxide; separating the source gas stream into a carbon dioxide-rich gas stream, and a substantially carbon dioxide-free gas stream; directing the carbon dioxide-rich gas stream into a regeneration vessel containing an adsorption medium having one or more adsorbed impurities on the adsorption medium; desorbing impurities from the adsorption medium by contacting the adsorption medium with the carbon dioxide-rich gas stream to generate a carbon dioxide-rich gas containing desorbed impurities and a regenerated adsorption medium; and directing the carbon dioxide-rich gas stream containing desorbed impurities out of the regeneration vessel.

Abstract: A package structure is provided. The package structure includes an electronic component and a connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The connection element penetrates and contacts the magnetic layer and the conductive wire.

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

Abstract: An electronic package is provided. The electronic package includes an insulating carrier, a first conductive layer, and an electronic component. The first conductive layer is disposed over the insulating carrier. The electronic component is disposed over the first conductive layer and electrically connected to the first conductive layer, wherein the insulating carrier is configured to dissipate heat from the electronic component to a second side of the insulating carrier opposite to a first side facing the electronic component.

Abstract: A method of wrapping optical fiber around a fluid conduit. The optical fiber is wrapped at least partially around the conduit. The optical fiber is secured relative to the conduit at one or more securing locations, thereby defining a sequence of multiple optical fiber portions. Each optical fiber portion comprises a portion of the optical fiber. Each securing location delimits a given optical fiber portion from the subsequent optical fiber portion in the sequence of optical fiber portions. A direction of wrapping of each consecutive optical fiber portion in the sequence of optical fiber portions may be alternated between a clockwise direction and a counter-clockwise direction.

Abstract: The present disclosure provides a semiconductor device package including a first substrate, a second substrate disposed over the first substrate, an electronic component disposed between the first substrate and the second substrate, a spacer disposed between the first substrate and the electronic component, and a supporting element disposed on the first substrate and configured to support the second substrate. The spacer is configured to control a distance between the first substrate and the second substrate through the electronic component. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: Techniques that facilitate optimization of prototype and machine design within a three-dimensional fluid modeling environment are presented. For example, a system includes a modeling component, a machine learning component, and a graphical user interface component. The modeling component generates three-dimensional model of a mechanical device based on a library of stored data elements. The machine learning component predicts one or more characteristics of the mechanical device based on a first machine learning process associated with the three-dimensional model. The machine learning component also generates physics modeling data of the mechanical device based on the one or more characteristics of the mechanical device. The graphical user interface component provides, via a graphical user interface, a three-dimensional design environment associated with the three-dimensional model and a probabilistic simulation environment associated with optimization of the three-dimensional model.

Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

Abstract: An optoelectronic package structure and a method of manufacturing an optoelectronic package structure are provided. The optoelectronic package structure includes a photonic component. The photonic component has an electrical connection region, a blocking region and a region for accommodating a device. The blocking region is located between the electrical connection region and the region for accommodating a device.

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Abstract: A gas detector comprises a gas detection unit and a filter introducing surrounding atmosphere to the gas detection unit. The filter comprises a gas-permeable organic polymer membrane having an acidic group or a basic group.

Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.