Patents Assigned to Engineering
  • Patent number: 7023082
    Abstract: A semiconductor package mainly comprises a substrate unit and a chip. The chip is electrically connected to the substrate unit. The substrate unit includes an upper surface, a lower surface and a side surface. A plurality of circuit traces are formed on the upper surface and a plurality of contacts are formed on the side surface, wherein the contacts are electrically connected to the circuit traces. Besides, a plurality of solder balls are formed on the contacts in order to transmit the signals from chip to outside through the substrate unit, the contacts and the solder balls. Furthermore, a semiconductor package module will be formed by electrically connecting the semiconductor packages with each other through solder balls and a module substrate, and mounting the semiconductor packages with each other through an adhesive layer. In addition, a method for manufacturing the semiconductor package is disclosed.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: April 4, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Su Tao
  • Patent number: 7024289
    Abstract: A train control system includes positioning systems at the end of the train and at the front of the train, allowing the conductor or engineer to unambiguously determine that no cars of the train have become detached. The positioning system at the end of the train is also used to verify that the entire train has cleared a block. This information can be relayed to a dispatcher, thereby eliminating the need for trackside sensing equipment. A control unit prevents the train from moving without an authorization that includes the train's current position.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: April 4, 2006
    Assignee: Quantum Engineering, Inc.
    Inventors: Mark Edward Kane, James Francis Shockley, Harrison Thomas Hickenlooper
  • Publication number: 20060067862
    Abstract: A system and method for the removal of metals such as mercury from a gas stream. The method involves contacting a gas stream containing the target metals with reactive chemical species generated in a plasma device. The metal to be removed is chemically converted into forms enabling capture in either conventional particulate removal devices or in a wet scrubber for the capture of a soluble chemical species.
    Type: Application
    Filed: July 21, 2005
    Publication date: March 30, 2006
    Applicant: Continental Research & Engineering, LLC
    Inventor: Christopher Herbst
  • Publication number: 20060065869
    Abstract: A nozzle design and method for designing such a nozzle being adapted for three phase slurry flow from the choke into the flash tank during pressure let-down in autoclave mining operations that uses a selection of the expansion ratio in the choke to select a nozzle dispersion angle to select a spread of the flow over the slurry pool in the flash tank, to generally maximize the use of the pool for energy dissipation without causing undo wear and tear on the tank walls.
    Type: Application
    Filed: May 12, 2005
    Publication date: March 30, 2006
    Applicant: Caldera Engineering, LLC
    Inventors: Stephen Chipman, Michael Luque, Herman Pieterse, Jeffrey Robison, Craig Smith
  • Publication number: 20060065049
    Abstract: A Thermal type fluid flow sensor comprises a heating resistor formed on a thin film of a substrate, and plural thermal sensitive resistors configuring a bridge circuit. The thermal sensitive resistors are disposed on the thin film of the substrate so as to be located on an adjacent upstream side and an adjacent downstream side of the heating resistor in a stream direction of fluid to be measured. Resistor traces for the thermal sensitive resistors are formed so that the respective thermal sensitive resistors exhibit substantially equal changes in resistance with each other to distortion caused in the thin film.
    Type: Application
    Filed: August 19, 2005
    Publication date: March 30, 2006
    Applicants: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Keiichi Nakada, Junichi Horie, Hiroshi Nakano, Izumi Watanabe
  • Patent number: 7019407
    Abstract: A flip chip package structure comprising a chip, a substrate, at least a first bump and a plurality of second bumps is provided. The chip has a first bump-positioning region and the substrate has a second bump-positioning region. The substrate has at least a first hole and multiple second holes. The first hole and the second holes are located within the second bump-positioning region. The first hole has a depth greater than that of the second hole. The first bump is set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The first bump is bonded to the substrate through the first holes. The second bumps are set up between the first bump-positioning region of the chip and the second bump-positioning region of the substrate. The second bumps are bonded to the substrate through the second holes. The first bump has a volume greater than the volume of the second bump.
    Type: Grant
    Filed: December 24, 2003
    Date of Patent: March 28, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Wen Chen, Ming-Lun Ho, Shih-Chang Lee, Chih-Huang Chang
  • Patent number: 7019626
    Abstract: Systems, methods and apparatus' of converting an engine into a multi-fuel engine are provided. One embodiment reduces particulate emissions and reduces the amount of combusted gasoline or diesel fuel by replacing some of the fuel with a second fuel, such as natural gas, propane, or hydrogen. One feature of the present invention includes a control unit for metering the second fuel. Another feature of the present invention includes an indicator that indicates how much second fuel is being combusted relative to the diesel or gasoline. This Abstract is provided for the sole purpose of complying with the Abstract requirement rules that allow a reader to quickly ascertain the subject matter of the disclosure contained herein. This Abstract is submitted with the explicit understanding that it will not be used to interpret or to limit the scope or the meaning of the claims.
    Type: Grant
    Filed: March 3, 2005
    Date of Patent: March 28, 2006
    Assignee: Omnitek Engineering, Inc.
    Inventor: Werner Funk
  • Patent number: 7018505
    Abstract: An apparatus of fabricating a semiconductor device includes: a chamber; a radio frequency (RF) power supply supplying an RF power for the chamber; a matching box including a matching unit adjusting an impedance of the RF power; and a chuck penetrating a surface of the chamber, the chuck including a fixing means to fix the matching box to the chuck.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: March 28, 2006
    Assignee: Jusung Engineering Co., Ltd.
    Inventor: Chang-Yeop Jeon
  • Patent number: 7018145
    Abstract: A spade drill insert and drilling tool assembly is provided wherein the spade drill insert body comprises curved cutting edges and a lip groove having a trough substantially parallel to a plane formed through each adjacent curved cutting edge, which provides a significant improvement in chip formation during cutting operations.
    Type: Grant
    Filed: February 17, 2004
    Date of Patent: March 28, 2006
    Assignee: Allied Machine & Engineering Corp.
    Inventors: Wendell E. Mast, Joseph P. Nuzzi
  • Patent number: 7018980
    Abstract: The invention relates to the method for preparation of orally administrated insulin oil formulation comprising: dissolving an amount of insulin in an acidic aqueous buffer(A); adding A to liquid surfactant, the HLB value of which is between 10 and 20, with agitation to form a homogeneous solution(B); adding B to an oil, the HLB value of which is between 0 and 10, with agitation to form oil formulation. This invention has a simple process with low cost. After orally administrated, the formulation prepared with the process of the invention can resist the gastrointestinal degradation by digestive enzymes, and is easily absorbed for hypoglycemic effect.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: March 28, 2006
    Assignees: Tsinghua University, Fosse Bio-Engineering Development, Ltd.
    Inventors: Changxue Zheng, Mingxing Duan, Hong Ma, Housheng Zhong
  • Patent number: 7018199
    Abstract: A manifold for conveying injection molding material into a mold from a molding material supply and method for making same includes a main flow member having a central flow passage extending through the main flow member along a longitudinal axis of the main flow member. The main flow member also includes a plurality of branching passages each transverse to and in fluid communication with the central flow passage. The main flow member has an outer surface that is generally round in cross sectional shape. The outer surface is machined so as to be generally round in cross sectional shape.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: March 28, 2006
    Assignee: Plastic Engineering & Technical Services, Inc.
    Inventor: Patrick A. Tooman
  • Patent number: 7017704
    Abstract: A steering device (1) for drive-by-wire functions in a vehicle comprises a base (2) which can be fixed to the vehicle interior at the location of the driver, and two steering grips (3, 4) at opposite sides of the base, which steering grips each can be gripped by a hand of the driver, said steering grips being coupled and being moveable with respect to the base in mutually opposite directions.
    Type: Grant
    Filed: May 18, 2001
    Date of Patent: March 28, 2006
    Assignee: SKF Engineering and Research Centre B.V.
    Inventors: Hendrikus Jan Kapaan, Eduardus Gerardus Maria Holweg, Alexander Jan Carel Vries
  • Patent number: 7017246
    Abstract: Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: March 28, 2006
    Assignee: Toho Engineering Kabushiki Kaisha
    Inventor: Tatsutoshi Suzuki
  • Patent number: 7017954
    Abstract: A latch assembly for a trailer roll up door has a base plate, a handle and hook assembly with a locking flange rotatably mounted to the base plate, a closed keeper to selectively retain the handle in the closed position. The closed keeper is moveably mounted to the base plate for movement between a latched position and an unlatched position. The movement of the closed keeper is limited by stops on the base plate and further has a rotation stop that is adapted to contact a portion of the handle when the closed keeper is in the unlatched position and the handle is moved to the closed position to move the closed keeper into the latched position.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: March 28, 2006
    Assignee: Fleet Engineers, Inc.
    Inventors: Wesley K. Eklund, Andrew Hartmann
  • Patent number: 7018218
    Abstract: A device for controlling a vehicle 8 having a housing 3, a rectangular printed circuit board 4 which is fixed to the inside of the housing and has a control circuit thereon. Plugs 1a and 1b are provided along one side of the rectangular printed circuit board 4 to transfer signals between the inside and the outside of the housing 3. The plugs 1a and 1b respectively contain plug pins and the plug pins 2 are electrically connected to the printed circuit board 4 via bonding wires 5 inside the housing 3.
    Type: Grant
    Filed: July 29, 2003
    Date of Patent: March 28, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Masahiko Asano, Yasuo Akutsu, Shuji Eguchi, Kunito Nakatsuru, Kaoru Uchiyama
  • Patent number: 7018498
    Abstract: A three dimensional amorphous metal mass suitable for milling is formed wrapping amorphous metal ribbon into a three dimensional shape and then applying adhesive to the three dimensional shape. The adhesive permeates the three dimensional shape. The adhesive is then cured. The three dimensional shape is mechanically contained in three dimensions. If the amorphous metal mass is made as a toroid, then it could be processed into a stator. The stator would then be suitable for use in very high frequency electric motors.
    Type: Grant
    Filed: June 11, 2003
    Date of Patent: March 28, 2006
    Assignee: Light Engineering, Inc.
    Inventors: Thomas J. Berwald, Kendall Scott Page
  • Publication number: 20060060808
    Abstract: A lightweight, low cost throttle body and throttle valve placed in the body, both formed of resins, that resolve the problem of excessively large gap formation is disclosed. Circumferentially oriented filler contained in a resin forming a throttle valve compensates to make the radial linear expansion coefficient of the throttle valve substantially equal to that of a bore. Grooves are formed on concentric circles in the throttle valve to orient filler circumferentially. A throttle valve provided with circumferentially oriented filler can be formed by impregnating an aggregate formed by circumferentially arranging the filler with a resin and curing the resin. A rib is formed in a part near a throttle shaft to control molding shrinkage so that the roundness of the bore is small.
    Type: Application
    Filed: November 14, 2005
    Publication date: March 23, 2006
    Applicants: Hitachi Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Naozumi Hatada, Makoto Iida, Yutaka Takeuchi, Shigeo Tamaki
  • Publication number: 20060063301
    Abstract: A manufacturing method of a multi-layer circuit board with an embedded passive component includes providing a single layer plate having a dielectric layer and a first conductive foil, heating the single layer plate to melt the dielectric layer, pressing a passive component into the second surface of melting dielectric layer, stacking the single layer plate on a core substrate, stacking a second conductive foil on single layer plate, and forming electrical pattern on the second conductive foil. The dielectric layer has a first surface and a second surface. The first conductive foil is disposed on the first surface.
    Type: Application
    Filed: July 14, 2005
    Publication date: March 23, 2006
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ching-Fu Hung, Yung-Hui Wang
  • Publication number: 20060060149
    Abstract: A spill-resistant fluid container includes a chamber for holding a quantity of fluid. Within the chamber is a plurality of cavities. The cavities are circumferentially arranged so as to define a central chamber area. Each of the cavities have at least one opening so that the plurality of cavities are in restricted fluid communication with the central chamber area. Optionally, the container includes a removable top section having an inner-lip portion with a substantially flat inner surface defining an oblong opening, the inner surface being either parallel with the outer wall of the chamber, or angled upward away from the chamber. The top section also has an outer-lip portion spanning from a top edge of the outside wall of the chamber to a bottom edge of the inner-lip portion.
    Type: Application
    Filed: September 20, 2005
    Publication date: March 23, 2006
    Applicant: Response Engineering, Inc.
    Inventor: Richard Skowronski
  • Patent number: D518073
    Type: Grant
    Filed: July 23, 2004
    Date of Patent: March 28, 2006
    Assignee: Belle Engineering (Sheen) Limited
    Inventor: Jamie Hamilton