Patents Assigned to Engineering
  • Publication number: 20060042703
    Abstract: Devices and methods for evenly distributing sludge, including manure and industrial sludge, to numerous hoses, over a large range of sludge supply pressures. Some devices include a housing having an inlet for receiving sludge under pressure and several outlets disposed outwardly through the housing cylindrical wall for coupling to hoses. The devices can include a rotating plate within the housing sweeping one or more baffles over the outlets to momentarily occlude the outlets and reduce flow through the occluded outlets. The baffles can include a first portion secured to the plate and a second portion removably secured to the first portion and/or the plate. Changing the total length of the baffles can change the affective cross-sectional area of the outlets available for flow at any instant in time.
    Type: Application
    Filed: September 13, 2004
    Publication date: March 2, 2006
    Applicant: Hydro Engineering, Inc.
    Inventor: Thomas Huffman
  • Patent number: 7005750
    Abstract: A substrate with reinforced contact pad structure includes a metal wiring layer and a solder mask formed over its surface. The metal wiring layer includes at least a NSMD (Non-Solder Mask Defined) type contact pad, a trace and an extension. The extension connects the contact pad and the trace, and has an upper surface which is covered by the solder mask so as to enhance the connecting strength between the trace and the contact pad and to improve the position stability of the NSMD type contact pad on the substrate. In an embodiment, the contact pad is circular for bonding a bump or a solder ball. The first extension is fan-shaped. The extension also has a sidewall exposed out of the solder mask.
    Type: Grant
    Filed: July 30, 2004
    Date of Patent: February 28, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Sheng-Tsung Liu
  • Patent number: 7005327
    Abstract: A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.
    Type: Grant
    Filed: September 5, 2003
    Date of Patent: February 28, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Chun Kung, Liamh-Cheng Chang
  • Patent number: 7004022
    Abstract: The flow detecting elements are provided at the sub-passage for making the part of fluid to be measured (gas) flow. The wall of the sub-passage contains a leak hole (through hole) to drain a liquid having entered and accumulated inside the sub-passage. A protrusion for generating a dynamic pressure on the opening is arranged close to the opening of the leak hole on the external surface of the sub-passage. Alternatively, a protrusion located upstream from the leak hole is formed on the inner wall surface of the sub-passage. The former protrusion generates a dynamic pressure in response to the flow velocity of the gas flowing along the external surface of the sub-passage. The latter protrusion produces a separation flow area for separating the flow from the internal surface of the sub-passage (close to the leak hole), whereby the pressure of the separation floe area is reduced.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: February 28, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Sinya Igarashi, Hiroshi Kikawa, Yasuhiro Asano, Naoki Saito
  • Patent number: 7003846
    Abstract: A vacuum and disposal system for the collection and disposal of animal feces. The vacuum and disposal system consists of a vacuum source, a vacuum tube, a flexible hose, and an intake tube. The vacuum is provided by an electric motor powered by a rechargeable battery and is used to create a vacuum or suction through the vacuum tube, the flexible hose, and the intake tube to collect the animal feces. A cartridge having a filter is inserted into the intake tube to receive the animal feces collected. After collection, the vacuum and disposal system is converted to an unload position for the removal of the cartridge from the intake tube and the ultimate disposal of the animal feces. Alternatively, a compact vacuum and disposal system may be used in smaller areas.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: February 28, 2006
    Assignee: Holtz Engineering, Ltd.
    Inventor: Carl Michael Holtz
  • Patent number: 7003835
    Abstract: A cable-stay cradle system (“cradle system”) for cable stayed bridges is mounted onto a cable stay, the opposite ends of which are attached to anchors on a bridge deck. The cradle system is disposed along the length of the cable stay and located in a pre-formed opening in a pylon. The cradle system includes axially spaced sleeve centering plates that have radially spaced holes through which the cable strands of the cable stay are threaded. The cradle system ensures that a distance from center-points of adjacent cable strands remains essentially constant along the entire length of the cradle system. The invention also provides a method of installing a cable stay including a cradle system, which includes the steps of threading the cable stay through the opening in the pylon so as to locate the cradle system in the opening, and attaching the cable stay to anchors on the bridge deck.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: February 28, 2006
    Assignee: Figg Bridge Engineers, Inc.
    Inventors: Linda Figg, legal representative, W. Denney Pate, Eugene C. Figg, Jr., deceased
  • Patent number: 7005579
    Abstract: A system for passing a cable, a conduit, a pipe or the like sealingly through an opening in a wall, comprising a sealing device made of an elastic material, such as rubber, which includes at least one lead-through channel having a smooth inner wall, wherein the sealing device is externally provided with axially spaced-apart, circular, at least substantially inflexible, compressible ribs lying in (imaginary) radial planes, whose outside diameter is larger than the inside diameter of the opening, and wherein the system furthermore includes at least one grommet to be fitted round the cable, the conduit, the pipe or the like that is to be passed through, which grommet can be fitted sealingly in said lead-through channel, which grommet, which has a smooth outer side, includes a bore whose wall is provided with axially spaced-apart, circular, at least substantially inflexible, compressible ribs lying in (imaginary) radial planes, whose inside diameter is at least substantially identical to the outside diameter of t
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: February 28, 2006
    Assignee: Beele Engineering B.V.
    Inventor: Johannes Alfred Beele
  • Patent number: 7006069
    Abstract: In a display device having a pixel array in which a plurality of pixels are arranged two-dimensionally along a first direction and a second direction, each of the pixels includes a pair of electrodes applying a voltage to liquid crystals, respective groups of the pixels arranged along the first direction form a plurality of pixel-rows juxtaposed along the second direction, and respective groups of the pixels arranged along the second direction form a plurality of pixel-columns juxtaposed along the first direction, the present invention repeats a first step for selecting every Y rows of the pixel-rows sequentially along the second direction N-times and applying an image signal to one of the pair of electrodes provided for each one of the pixels belonging to the each Y rows of the pixel-rows as selected, and a second step for selecting every Z rows of the pixel-rows sequentially along the second direction M-times and applying a blanking signal to the one of the pair of electrodes provided for each one of the pi
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: February 28, 2006
    Assignees: Hitachi Displays, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Masahiro Tanaka, Hiroyuki Nitta, Nobuhiro Takeda, Masashi Nakamura
  • Patent number: 7004378
    Abstract: A container that holds small bulk articles observable through mesh-covered openings while restricting access for substituting articles among containers formed by folding a blank on scores to define a top wall with two opposing end walls and two opposing side walls. Each side wall has a bottom wall foldable on a respective score for closing the container after filing with contents. At least one of the top wall and side walls defines an opening that is covered with a netting that restricts casual removal of the contents while permitting visual inspection.
    Type: Grant
    Filed: December 4, 2002
    Date of Patent: February 28, 2006
    Assignee: R & L Engineering, Inc.
    Inventor: John M. Tharpe, Jr.
  • Patent number: 7005749
    Abstract: A flip chip package structure includes a substrate, a chip, solder bumps, a heat sink, a thermal interface material (TIM), and solder balls. The substrate has an upper surface and a lower surface and further has a receiving area. The receiving area has a bottom in the substrate and an opening formed on the upper surface. Several solder bumps are disposed in the receiving area. The chip is disposed on the upper surface of the substrate, and covers the opening. The front surface of the chip is electrically coupled to the bottom via the solder bumps. The heat sink is attached to the upper surface of the substrate and the back surface of the chip through the adhesion of TIM. Several solder balls are disposed on the lower surface of the substrate.
    Type: Grant
    Filed: July 27, 2004
    Date of Patent: February 28, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Ta Hsu, Tzu-Bin Lin, Ya-Ling Huang
  • Patent number: 7004142
    Abstract: A control system for an exhaust brake which operates to impede exhaust flow from a turbocharged combustion engine when the engine throttle is closed. The control system includes means for delaying application the exhaust brake only when the vehicle throttle is closed to allow the rotational speed of the turbo charger to drop thereby reducing wear to seal components.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: February 28, 2006
    Assignee: Holset Engineering Company, Ltd.
    Inventors: Kenneth Ball, Pierre B. French
  • Patent number: 7004112
    Abstract: Hatchling processing methods and systems that provide for the processing of hatchlings at a plurality of processing stations, with the hatchlings being transferred between stations using an automated conveying system. Each of the hatchlings is retained in a hatchling carrier designed to be conveyed by the automated conveying system. Each of the hatchling carriers is preferably designed to retain only one hatchling at a time. The systems and methods may also include identification tags that may be used to direct the hatchling through the processing system with the automated conveying system. The identification tags may be associated with the hatchlings themselves or they may be associated with the hatchling carriers.
    Type: Grant
    Filed: November 6, 2003
    Date of Patent: February 28, 2006
    Assignee: Nova-Tech Engineering, Inc.
    Inventor: Marc S. Gorans
  • Patent number: 7005935
    Abstract: A modulated Class E oscillator. In one embodiment, the modulated Class E oscillator may achieve high coil currents (about 1A) and voltages (about 500V) with low power components. Current may be injected when the oscillating current in the inductor passes through zero. A detector circuit may be used to trigger the current injection at the appropriate instant regardless of changes in the resonant frequency of the system. Its phase can be adjusted to compensate for propagation delays in the drive circuitry, while amplitude modulation is accomplished by switching in additional reactive conductance to increase the current injected into the tank circuit. Frequency modulation is accomplished in an alternate embodiment. The oscillator can also lock to an external reference signal and be phase modulated.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: February 28, 2006
    Assignee: Alfred E. Mann Institute for Biomedical Engineering at the University of Southern California
    Inventor: William Henry Moore
  • Patent number: 7002830
    Abstract: A nonvolatile storage element of a single-layer gate type structure is arranged so that a floating gate is formed of a conductive layer which partly overlaps with a control gate, formed of a diffused layer, and is provided with a barrier layer covering a part of or the whole surface of the floating gate. Nonvolatile storage elements characterized as such are used for redundancy control of defects or change of functions.
    Type: Grant
    Filed: October 28, 2003
    Date of Patent: February 21, 2006
    Assignees: Renesas Technology Corp., Hitachi VLSI Engineering Corp.
    Inventors: Kenichi Kuroda, Toshifumi Takeda, Hisahiro Moriuchi, Masaki Shirai, Jiroh Sakaguchi, Akinori Matsuo, Shoji Yoshida
  • Patent number: 7001515
    Abstract: A filtering system used on a meat injection machine that injects pickling into meat products. The filter consists of a tank and a first and second rotary filter. The first rotary filter uses a wedge wire wound cylinder and augers having flutes that rotate to catch and push away solid particles toward the second filter. The second filter then uses more wedge wire in a whirlpool effect to ensure all solid materials and foam are in the outside of the filter. Injector fluid is then taken from the center of the inside volume of the second filter to be used in injection needles.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: February 21, 2006
    Assignee: Townsend Engineering Company
    Inventors: Matthew P. Sawhill, Daniel W. Pfeffer
  • Patent number: 7002246
    Abstract: A chip package structure includes a substrate having an upper surface and a lower surface, a chip having an active surface and a back surface, a stiffener, a first heat sink and a second heat sink. The active surface of the chip is attached on the upper surface of the substrate via bumps, so that the chip electrically connects to the substrate. The stiffener is disposed on the upper surface of the substrate and around the chip. The first heat sink is disposed on the back surface of the chip and on the stiffener ring. The second heat sink is disposed on the lower surface of the substrate.
    Type: Grant
    Filed: July 2, 2004
    Date of Patent: February 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Lun Ho, Yu-Wen Chen
  • Patent number: 7001502
    Abstract: A process is provided for treating crude oil to visbreak and/or upgrade such oil using hydrogen gas. The process includes the steps of introducing hydrogen into a heated stream of crude oil or partially upgraded crude oil and mixing such introduced hydrogen with the oil to achieve intimate dispersion of hydrogen to enhance thereby visbreaking and/or upgrading.
    Type: Grant
    Filed: September 29, 1999
    Date of Patent: February 21, 2006
    Assignee: Canadian Enviromnental Equipment & Engineering Technologies, Inc.
    Inventors: Robert Satchwell, Jose Lourenco, Patrick J. Cochrane, Roderick M. Facey, Joao Rodrigues, Kenneth Bannard, Hannu Salokangas
  • Patent number: 7002255
    Abstract: A multi-chips stacked package mainly comprises a substrate, a lower chip, an upper chip, an intermediate chip, a plurality of bumps and an encapsulation. Therein, the lower chip is disposed on the substrate; the bumps connect the lower chip and the intermediate chip; the upper chip and the lower chip are electrically connected to the substrate via a plurality of first electrically conductive wires and second electrically conductive wires respectively. The bumps can support the intermediate chip more firmly, so the top of the intermediate chip can be kept in counterpoise and higher than the peak of the first wires. Accordingly, the intermediate chip will be prevented from being tilted excessively to cause the upper chip to be contacted to the first electrically conductive wires. Thus, the first electrically conductive wires can be prevented from being damaged when the upper chip is wire bonded to the substrate.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: February 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Sung-Fei Wang
  • Patent number: 7002257
    Abstract: An optical component package includes a substrate, an optical component, a plurality of spacers, a plurality of wires, and a transparent molding compound. The optical component is disposed on the substrate, and the surface of the optical component located away from the substrate is used to receive an optical signal. The spacers are disposed between the substrate and optical component. The wires electrically connect the optical component to the substrate. The transparent molding compound encapsulates the optical component. In this case, the diameter of each of the spacers is equal to the thickness of the transparent molding compound minus the thickness of the optical component minus the distance between where the optical signal enters the transparent molding compound and where the optical signal is received by the optical component. Furthermore, this invention also discloses a packaging method for the optical component package.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: February 21, 2006
    Assignee: Advanced Semiconductor Engineering Inc.
    Inventors: Su Tao, Kuo-Chung Yee, Jen-Chieh Kao
  • Patent number: 7002645
    Abstract: A liquid crystal display device includes a liquid crystal display element, a frame member arranged at a displaying surface side of the liquid crystal display element and having a display window, a light source arranged at an opposite surface of the liquid crystal display element to the displaying surface thereof for irradiating the liquid crystal display element, and a housing member having a side wall formed at a periphery thereof and housing the light source therein. The frame member is fixed to the housing member and has a side wall opposite to an outer surface of the side wall of the housing member, and a screw member has a tapped hole in which a fitting screw is screwed.
    Type: Grant
    Filed: May 18, 2004
    Date of Patent: February 21, 2006
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Norihisa Fukayama, Naoto Kobayashi, Fumitoshi Matsuda, Yoshihiro Imajo, Yoko Ota