Patents Assigned to Engineering
  • Publication number: 20060059682
    Abstract: A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points; connecting a passive element to the corresponding metal protruding points; providing a board having a core substrate with organic insulation layer on a core substrate; stacking the conductive foil and the board, wherein the passive component is embedded in the organic insulation layer and patterning on the conductive foil.
    Type: Application
    Filed: July 18, 2005
    Publication date: March 23, 2006
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ching-Fu Horng, Yung-Hui Wang
  • Patent number: 7014751
    Abstract: The invention relates to a method for treating and upgrading a hydrocarbon containing acidic species such as mercaptans, comprising: (a) contacting the hydrocarbon, in the essential absence of oxygen, with a first phase of a treatment composition containing water, dissolved alkali metal hydroxide, cobalt phthalocyanine sulfonate, and dissolved alkylphenylates and having at least two phases, (i) the first phase containing water, alkali metal alkylphenylate, dissolved alkali metal hydroxide, and dissolved sulfonated cobalt phthalocyanine, and (ii) the second phase containing water and dissolved alkali metal hydroxide; and then (b) separating an upgraded hydrocarbon.
    Type: Grant
    Filed: June 4, 2002
    Date of Patent: March 21, 2006
    Assignees: Exxonmobil Research and Engineering Co., Merichem Company
    Inventors: Mark A. Greaney, Binh N. Le, Daniel P. Leta, John N. Begasse, Charles T. Huang, Verlin Keith Turner
  • Patent number: 7013883
    Abstract: To improve an anti-heat shock performance and an electric field concentration relaxation (an insulation performance) between a secondary coil and a center core, to attain a narrow diameter structure in an individual ignition type ignition coil and further to improve an assembling working of the ignition coil. The individual ignition type ignition coil is adopted to an engine having a plastic head cover. A secondary coil 3 is positioned at an inner side of a primary coil 5 and between a secondary bobbin 2 and a center core 1 a soft epoxy resin 17 is filled up. In the secondary bobbin 2, a secondary coil low voltage side is a potting side of the soft epoxy resin 17 and an inclination having a difference in an inner diameter is provided on the inner diameter in which the secondary coil low voltage side is formed large and secondary coil high voltage side is formed small.
    Type: Grant
    Filed: May 30, 2003
    Date of Patent: March 21, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Junichi Shimada, Noboru Sugiura, Yoichi Anzo, Eiichiro Kondo, Kazutoshi Kobayashi, Takahide Kosai, Toshiaki Ueda
  • Patent number: 7015130
    Abstract: A method for making UBM (Under Bump Metallurgy) pads and bumps on a wafer is disclosed. Openings are formed in a photoresist layer for forming bumps, a positive liquid photoresist is provided into the openings of the photoresist layer for forming bumps. The positive liquid photoresist is exposed and developed to modify the openings of the photoresist layer. Thus, bumps formed in the modified openings have precise bonding areas on the UBM layer. Using the bumps as a mask, UBM pads under the bumps are formed by etching the UBM layer, so that the reflowed bumps have a uniform height.
    Type: Grant
    Filed: November 20, 2003
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chi-Long Tsai, Min-Lung Huang, Chao-Fu Weng, En-Chieh Wu, Yang Hong-Zen
  • Patent number: 7015571
    Abstract: A multi-chips module assembly package mainly comprises a first package, a second package and an intermediate substrate. The intermediate substrate includes an opening, at least a via and a plurality of circuit layers, wherein the second package is accommodated in the opening. The via has an inner wall, and a plurality of separated electrically conductive layers, which is formed on the inner wall and connected with the corresponding circuit layers. The first package electrically connects with the second package through the intermediate substrate, and the intermediate substrate is interposed between the first package and the second package. At least an insulator is formed in the via, and the separated electrically conductive layers are separated from each other. After the intermediate substrate is interposed between the first package and the second package, there will be not enough space between the intermediate substrate, the first package and the second package for disposing conductive devices therein.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Huang Chang, Shih-Chang Lee
  • Patent number: 7015577
    Abstract: A flip chip package includes a substrate, a flip chip, a thermal interface material and a heat sink. The flip chip is mounted on the substrate. The thermal interface material is applied on the back surface of the flip chip. The back surface of the flip chip includes a region uncovered by the thermal interface material. The opening exposes the uncover region of the back surface of the flip chip for measuring the height of the back surface. Also the opening has an inner sidewall above the back surface for fillet bonding of the thermal interface material. Therefore the bond line thickness (BLT) of the thermal interface material can be measured and calculated.
    Type: Grant
    Filed: July 21, 2004
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Sung-Fei Wang
  • Patent number: 7013899
    Abstract: A tubular assembly having a plurality of lumens is configured for insertion into the mouth and throat of a patient with a proximal end of the tubular assembly extending from the patient's mouth and a distal end of the tubular assembly extending into the patient's esophagus. The tubular assembly further includes a transition portion near the tubular assembly. The transition portion is configured to transition from a relatively radially large proximal end to a relatively radially small distal end, with the relatively radially small distal end being in communication with at least one of the lumens. The relatively radially large proximal end is configured to abut the aryepiglottic folds of the patient to arrest insertion of the tubular assembly with the relatively radially small distal end of the transition portion extending into the patient's esophagus.
    Type: Grant
    Filed: August 13, 2004
    Date of Patent: March 21, 2006
    Assignee: Engineered Medical System, Inc.
    Inventors: David D. Alfery, Brad Quinn
  • Patent number: 7013749
    Abstract: A robot driven robot index system includes a track having indices defining robot workstation positions along the track. The system also includes a non-driven carriage movable about the track. The carriage has a locking device for controllably locking the carriage to the track. The system further includes a robot having a base and a swingable, movable arm. The robot base is secured to the non-driven carriage. The system also includes at least one reference connector spacedly disposed from the track and located within a working range of the robot. The robot arm is adapted to connect with the reference connector, for moving the robot along the track between workstations through the movement of the robot arm.
    Type: Grant
    Filed: June 7, 2004
    Date of Patent: March 21, 2006
    Assignee: TESCO Engineering, Inc.
    Inventor: Katsutoshi Uno
  • Patent number: 7013870
    Abstract: An electronic throttle apparatus permits aggregating of various parts and rationalization of installation, and can simplify assembling operation and wiring operation to an engine room for rationalization of an installation space. The throttle apparatus for an engine includes a throttle body housing therein a throttle valve and disposed in an air intake of the engine, a throttle actuating motor, a throttle position sensor detecting a throttle valve angle and an air flow sensor located on upstream of the throttle valve and measuring an intake air flow rate. The throttle actuating motor, the throttle position sensor and the air flow sensor are mounted on the throttle body.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: March 21, 2006
    Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
    Inventors: Yasuhiro Kamimura, Norio Tomita, Kazuo Nagayama, Yasushi Sasaki
  • Patent number: 7015295
    Abstract: A method for bulk polymerization of monomers having a polymerizable unsaturated bond consisting mainly of an alkyl acrylate, which comprises adding a polymerization initiator having a 10 hours half-life temperature of 41.0° C. or below to the monomers in an amount of 0.0001 to 0.5 parts by weight based on 100 parts by weight of the monomers to initiate polymerization of the monomers, allowing after the reaction initiation the temperature of the reaction mixture to reach a maximum of 100 to 140° C. by the self-exotherm of the reaction system due to the consumption of the polymerization initiator, and thereby polymerizing 15 to 50% by weight of the monomers used.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: March 21, 2006
    Assignee: Soken Chemical & Engineering Co., Ltd.
    Inventors: Youichi Takizawa, Tetsuya Yoshida
  • Patent number: 7013800
    Abstract: The object of this invention is to provide a mechanical press that presents no inconvenience in press operations despite its low height, providing great stability and excellent durability. The invention comprises a slide guiding mechanism provided at an upper part of the adjusting member for converting the rotary motion of the eccentric part of the crankshaft into a linear reciprocating motion and a position adjusting mechanism provided at a lower part, as well as an adjusting member that advances and retracts relative to the slide, which serves for the prevention of rotation and guidance.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: March 21, 2006
    Assignee: Aida Engineering Co., Ltd
    Inventors: Hisanobu Kanamaru, Takao Ito
  • Patent number: 7014421
    Abstract: A compressor comprises a compressor wheel (8) mounted for rotation within a compressor housing (4,5), which an annular outlet passage (15) defined between opposing annular wall surfaces. A portion (20) of at least one of the wall surfaces is resiliently flexible such that operational pressure changes within the outlet passage (15) cause the resilient wall surface portion to flex.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: March 21, 2006
    Assignee: Holset Engineering Company, Limited
    Inventor: Pierre French
  • Patent number: 7014773
    Abstract: The invention includes a method for demulsification of water-in-oil emulsions, oil-in-water emulsions, and mixtures of water-in-oil and oil-in-water emulsions by oscillatory mixing of the emulsions.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: March 21, 2006
    Assignee: ExxonMobil Research and Engineering Company
    Inventor: Ramesh Varadaraj
  • Patent number: 7015807
    Abstract: A method for detecting smoke detector alarms comprises analyzing at least two parameters of ambient sound over a period of time to detect a temporal pattern of the alarm. In one embodiment, a series of samples are taken over a period of time sufficiently long to include at least one full period of a repeating sound pattern, and the two parameters are frequency and amplitude of the loudest sound in each sample. The algorithmic analysis may be triggered by a detection algorithm that utilizes a lower amount of power than the algorithmic analysis. In other embodiments, the detection apparatus is incorporated into a conventional smoke detector that will detect both smoke and an alarm from another detector. In another embodiment, a smoke detector includes a transceiver to transmit an activation signal to neighboring smoke detectors when a fire is detected and to receive an activation signal from neighboring detectors.
    Type: Grant
    Filed: October 2, 2003
    Date of Patent: March 21, 2006
    Assignee: Combustion Science & Engineering, Inc.
    Inventors: Richard J. Roby, Michael S. Klassen, Christopher F. Schemel, Diwakar Vashishat, Maclain M. Holton, Kelly R. Flint
  • Patent number: 7015065
    Abstract: A manufacturing method of a ball grid array package mainly comprises providing a carrier unit with an upper surface and a lower surface, mounting a plurality of solder balls on the lower surface of the carrier unit, disposing a protective layer below the lower surface to cover the solder balls, placing a chip on the upper surface of the carrier unit and electrically connecting the carrier and the chip, encapsulating the chip and removing the protective layer so as to form said ball grid array package.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Fang Tsai, Jung-Kun Kang, Tsung Yueh Tsai
  • Patent number: 7014660
    Abstract: A knee prosthesis includes a femoral component, a tibial component, a bearing and a control arm. The bearing is in articular bearing engagement with the femoral component and in sliding and rotational bearing engagement with the tibial component. Movement of the bearing relative to the tibial component is controlled by a control arm. The anterior extreme of the control arm includes a removable stop for limiting anterior movement of the bearing relative to the tibial component.
    Type: Grant
    Filed: April 9, 2003
    Date of Patent: March 21, 2006
    Assignee: Biomedical Engineering Trust I
    Inventors: John B. Fenning, Michael J. Pappas
  • Patent number: 7013560
    Abstract: A substrate comprises at least a semi-finished substrate, a circuit line, a contact and a solder mask layer. The circuit line and the contact are formed on the semi-finished substrate. The circuit line and the contact are connected together non-integrally. The solder mask layer is formed over the semi-finished substrate to cover the circuit line. The solder mask layer has an opening in which the contact is formed.
    Type: Grant
    Filed: November 14, 2003
    Date of Patent: March 21, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Po-Chih Liu
  • Publication number: 20060057041
    Abstract: An apparatus for installing and removing candles from a packed tower comprises a rail or series of rails attached to the inside of the top of the vessel. The rail(s) may be supported from either the roof or walls of the tower. A traveler assembly is supported on the rail(s). The traveler assembly supports a hoist puller that in turn raises and lowers the candles. The rail(s) may be located such that they extend over the centerlines of each of the candle locations, and each such that a portion of each rail passes under the candle installation port. Multiple traveler assemblies may be used to increase the speed of installation. The traveler assembly may be configured to be removed when not in use, to ensure it is not exposed to the harsh environment in the tower. Alternatively, the traveler assembly may be constructed from corrosion-resistant materials, so that the traveler assembly may be left in the tower.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 16, 2006
    Applicant: Noram Engineering and Constructors Ltd.
    Inventor: John Crowden
  • Publication number: 20060057263
    Abstract: The invention provides a process and an apparatus for scrubbing vapours generated during the vacuum stripping step of fatty glycerides, said process comprising bringing said vapours in contact with their liquid condensate and extracting said liquid condensate with a polar extraction solvent or solvent mixture.
    Type: Application
    Filed: September 14, 2005
    Publication date: March 16, 2006
    Applicant: De Smet Engineering n.v.
    Inventors: Marc Kellens, Wim De Greyt
  • Patent number: D517373
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: March 21, 2006
    Assignee: Mold Cam Engineering Inc.
    Inventors: Giuseppe Cappellino, Carlo Severini