Patents Assigned to Engineering
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Patent number: 6864580Abstract: A semiconductor device having a structure in which no short circuit occurs between plug interconnections even when a void occurs in an insulating layer in a gap between wiring layers and a method of manufacturing the same are attained. The method includes: a step of forming transfer gates so as to be close to each other with a gap on a semiconductor substrate; a step of burying the gap and covering a wiring layer; a step of opening a contact hole in an insulating layer in the gap portion; a step of depositing a short-circuit preventing insulating film in the contact hole; an etch back step of removing the short-circuit preventing insulating film at least on the bottom of the gap to expose the semiconductor substrate; and a step of forming a plug interconnection.Type: GrantFiled: July 27, 2001Date of Patent: March 8, 2005Assignees: Renesas Technology Corp., Ryoden Semiconductor System Engineering CorporationInventors: Shoichiro Nakazawa, Heiji Kobayashi
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Patent number: 6863246Abstract: An automated fault reporting system for a train includes a controller that gathers information concerning malfunctioning wayside status devices and automatically reports the information to an appropriate party. In one embodiment, the control module uses a positioning system and a database including device locations in order to determine when the train is near a device. If no status information is received from the device as the train approaches, or the status information indicates a problem, the train is allowed to continue at a reduced speed to allow the operator to visually confirm that it is safe to proceed. If an area monitored by the device has been passed, or if the operator indicates that there is no problem, or the device fails to respond, the controller records and reports the malfunction.Type: GrantFiled: December 31, 2002Date of Patent: March 8, 2005Assignee: Quantum Engineering, Inc.Inventors: Mark Edward Kane, James Francis Shockley, Harrison Thomas Hickenlooper
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Patent number: 6862768Abstract: Disclosed is an overhead adjustable support system for use with an aircraft passenger boarding bridge, and especially for use with an aircraft passenger boarding bridge having at least two tunnel sections disposed one each on opposite sides of a flexible connection. A preferred embodiment of the overhead adjustable support system includes a first support member for being mounted to one of the at least two tunnel sections at a first point proximate the flexible connection. The first support member also has a free end for being disposed elevationally above the one of the at least two tunnel sections. The overhead adjustable support system also includes a second support member for being mounted to the other one of the at least two tunnel sections at a second point proximate the flexible connection, and has a free end for being disposed elevationally above the other one of the at least two tunnel sections.Type: GrantFiled: March 7, 2003Date of Patent: March 8, 2005Assignee: DEW Engineering and Development LimitedInventor: Neil Hutton
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Patent number: 6865471Abstract: A vehicle cruise control apparatus is provided for controlling a vehicle to run at a set speed desired by a driver. The apparatus stores a state in which the driver inputs a set speed (for example, the number of times the driver inputs the set speeds and a period at which the driver inputs the set speeds), and calculates a target acceleration/deceleration from the input state and a vehicle speed deviation (calculated by subtracting the actual vehicle speed from the set speed).Type: GrantFiled: April 10, 2003Date of Patent: March 8, 2005Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Yasufumi Konishi, Taisetsu Tanimichi, Tatsuya Yoshida, Toshio Manaka, Hidefumi Adachi, Eiichiro Kondo
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Patent number: 6863097Abstract: A liquid crystal dispensing apparatus dispenses liquid crystal onto a substrate. The liquid crystal dispensing apparatus includes a frame, a table, at least one liquid crystal discharge device, and a liquid crystal amount inspecting portion. The table is installed on the frame to have the substrate to be mounted thereon. The liquid crystal discharge device adjustably discharges an amount of liquid crystal, and the liquid crystal amount inspecting portion inspects a liquid crystal dispensing amount by comparing an actual amount of liquid crystal discharged from the liquid crystal discharge device with a preset liquid crystal amount. The liquid crystal discharge device includes a piston to perform ascending motions to draw in the liquid crystal and descending motions to discharge the liquid crystal with an angle of at least a portion of the liquid crystal discharge device determining a magnitude of the ascending/descending motion to control an amount of liquid crystal discharged.Type: GrantFiled: April 24, 2003Date of Patent: March 8, 2005Assignees: LG Philips LCD Co., Ltd., Top Engineering Co., Ltd.Inventors: Joung-Ho Ryu, Hyug-Jin Kweon, Hae-Joon Son, Kyu-Yong Bang, Joon-Young Kim, Man-Ho An, Yong-Kyu Seo
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Patent number: 6864982Abstract: A gas analyzer for a semiconductor treater improved to be capable of monitoring leakage or change of gas composition influencing treatability of the semiconductor treater in situ is provided. A duct is provided on the outer wall of a chamber of the semiconductor treater for taking out gas to be analyzed from the chamber. A gas analytic chamber stores the gas to be analyzed taken out through the duct. A discharge formation part is mounted in the vicinity of the gas analytic chamber. The discharge formation part includes a high frequency generation coil generating a high frequency and forming a plasma of the gas to be analyzed in the gas analytic chamber. This gas analyzer further comprises a spectrometer analyzing the emission wavelength of the plasma of the gas to be analyzed.Type: GrantFiled: June 6, 2002Date of Patent: March 8, 2005Assignees: Renesas Technology Corp., Mitsubishi Electric Engineering Company LimitedInventors: Minoru Hanazaki, Toshiki Oono
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Patent number: 6864354Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.Type: GrantFiled: June 15, 2001Date of Patent: March 8, 2005Assignee: Rhodia Engineering Plastics S.r.l.Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
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Patent number: 6863424Abstract: Brackets received in an elongated base support both lens portions and internal light bar components. Lens portion longitudinal edges penetrate the outer portion of a gasket channel to engage a gasket member. Lens retainer straps sandwich gasket layers to seal the longitudinal butt ends of lens portions. The lens retainers also penetrate the gasket channel to engage the gasket member. The brackets provide multiple locations for mounting warning light units and related light bar components within the space defined between the base and the lens portions.Type: GrantFiled: August 7, 2003Date of Patent: March 8, 2005Assignee: Whelen Engineering Company, Inc.Inventor: Kevin M. Smith
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Patent number: 6864334Abstract: The instant invention provides a late transition metal complex which can be used with an activating cocatalyst to produce polymers and copolymers. The invention also provides methods for polymerizing olefins, as well as copolymers having polar monomers incorporated therein.Type: GrantFiled: July 16, 2004Date of Patent: March 8, 2005Assignee: ExxonMobil Research and Engineering CompanyInventors: Lisa Saunders Baugh, Abhimanyu Onkar Patil, Donald Norman Schulz, Robert Timothy Stibrany, Joseph Anthony Sissano, Stephen Zushma
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Patent number: 6864588Abstract: An MCM package with bridge connection mainly comprises a carrier, a first chip, a second chip and at least one conductive body. The carrier has an upper surface and an opposite lower surface, and a plurality of contacts formed on the upper surface of the carrier. The first chip has a first active surface, a first side surface and a first boding pad formed on the first active surface. Similarly, the second chip has a second active surface, a second side surface, and a second boding pad formed on the second active surface. Therein, the first side surface of the first chip is proximate to the second side surface of the second chip, and the first active surface is coplanar to the second active chip. Accordingly, one of the conductive body can be disposed continuously on the active surface and the second surface to electrically connect the first chip and the second chip.Type: GrantFiled: September 9, 2003Date of Patent: March 8, 2005Assignee: Advanced Semiconductor Engineering Inc.Inventor: Chih-Pin Hung
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Patent number: 6863325Abstract: A lifting device (1) for goods containers (35) includes a body member (2). Four inner pickup elements (7, 8, 9, 10) are movably mounted on the body member (2). Two first extendable members (3, 4) are movably mounted on the body member (2) for movement between a first position in which the first extendable members (3, 4) are not extended from the body member (2) and a second position in which the first extendable members (3, 4) extend from opposite ends of the body member (2). Two second extendable members (5, 6) are provided with one second extendable member (5, 6) being mounted on each of the first extendable members (3, 4). Each second extendable member (5, 6) is movably mounted on the respective first extendable member (3, 4) for movement between a first position in which the second extendable member (5, 6) is not extended from the first extendable member (3, 4) and a second position in which the second extendable member (5, 6) is extended from the first extendable member (3, 4).Type: GrantFiled: February 25, 2000Date of Patent: March 8, 2005Assignee: Natsteel Engineering Pte. Ltd.Inventor: Robert Arthur Mills
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Patent number: 6862877Abstract: A biomass fuel combustor for use in the pressurized combustion comprising of biomass fule particles to produce a pressurized exhaust gas, the combustor comprising: a cyclonic combustion chamber having a combustion region and first and second fuel inlets, the first inlet being for the entry into the chamber of gas and/or liquid secondary fuel for combustion in said combustion region and the second inlet being for the entry into the chamber of biomass fuel particles also for combustion in said combustion region, the chamber being so constructed and arranged that the heat generated by the secondary fuel combustion will, in use and at least during stan-up of the combustor, promote fragmentation of the incoming biomass fuel particles.Type: GrantFiled: April 5, 2000Date of Patent: March 8, 2005Assignee: James Engineering (Turbines) LimitedInventor: David W James
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Patent number: 6864168Abstract: A bump structure on a contact pad and a fabricating process thereof. The bump comprises an under-ball-metallurgy layer, a bonding mass and a welding lump. The under-ball-metallurgy layer is formed over the contact pad and the bonding mass is formed over the under-ball-metallurgy layer by conducting a pressure bonding process. The bonding mass having a thickness between 4 to 10 ?m is made from a material such as copper. The welding lump is formed over the bonding mass such that a sidewall of the bonding mass is also enclosed.Type: GrantFiled: August 18, 2003Date of Patent: March 8, 2005Assignee: Advanced Semiconductor Engineering, Inc.Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Chih-Huang Chang, Jeng-Da Wu, Wen-Pin Huang, Po-Jen Cheng
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Patent number: 6862852Abstract: The invention releases to a sealing system comprising a cylindrical tube of a material that is capable of deformation under the influence of a temperature increase, and a gasket of an at least partially elastic material for sealingly retaining the tube in a lead-through housing coaxial with the tube by forming a collar therearound, wherein said gasket is made of a fire-retardant material with a base of a cross-linkable material and an expandable material, in such an amount and of such a composition that a temperature increase above the plasticizing point of the tube will cause the gasket to expand to such an extent that the tube is compressed and a medium-tight seal of the lead-through housing and the tube is obtained.Type: GrantFiled: July 18, 2000Date of Patent: March 8, 2005Assignee: Beele Engineering, B.V.Inventor: Johannes A. Beele
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Patent number: 6865454Abstract: A train control system includes positioning systems at the end of the train and at the front of the train, allowing the conductor or engineer to unambiguously determine that no cars of the train have become detached. The positioning system at the end of the train is also used to verify that the entire train has cleared a block. This information can be relayed to a dispatcher, thereby eliminating the need for trackside sensing equipment. A control unit prevents the train from moving without an authorization that includes the train's current position.Type: GrantFiled: July 2, 2002Date of Patent: March 8, 2005Assignee: Quantum Engineering Inc.Inventors: Mark Edward Kane, James Francis Shockley, Harrison Thomas Hickenlooper
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Publication number: 20050045747Abstract: A remotely controllable apparatus and technique for the removal of “CRUD” from surfaces within a nuclear Reactor Pressure Vessel includes a flexible, high pressure water jetting lance assembly for delivering intense water pressure (up to 20,000 psi) via nozzle(s) directly to the areas containing the highly radioactive “CRUD” material. The jetting lance assembly is positioned to the contamination site with either a guide tube having any predetermined shape and into which the lance assembly is disposed or a positioning member attached to the lance assembly, either of which may be torqued and manipulated until the nozzle end of the lance assembly is in position. Various other embodiments include multiple nozzles, adapters that have a specific shaped lumen, one or more sensor devices is communication with processing units near the proximal end of the apparatus.Type: ApplicationFiled: July 24, 2003Publication date: March 3, 2005Applicant: Hennigan Engineering Company, Inc.Inventor: Charles Hacquebord
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Publication number: 20050046040Abstract: A flip chip stacked package mainly comprises a carrier, a lower chip, an upper chip, a plurality of bumps, a plurality of bonding wires and a supporter. The supporter is attached to the lower surface of the carrier via an adhesive and covers the opening of the carrier. Thus, the lower chip can be disposed in the opening. In addition, the lower chip is electrically flip-chip bonded to the upper chip via the bumps and electrically connected to the carrier via the bonding wires. Accordingly, the heat generated from the lower chip can be transmitted to outside via the supporter. Furthermore, the upper chip is directly exposed to outside so that the capability of the heat dissipation will be enhanced.Type: ApplicationFiled: July 29, 2004Publication date: March 3, 2005Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sung-Fei Wang, Ming-Lun Ho
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Publication number: 20050046008Abstract: A leadless semiconductor package mainly comprises a leadless lead-frame, a chip, a silver paste and a plurality of electrically conductive wires. The leadless lead-frame includes a chip paddle and a plurality of leads surrounding the chip paddle wherein the chip paddle has a cavity serving as a chip disposal area and a grounding area encompassing the cavity. The chip is disposed in the cavity so that the back surface of the chip faces the chip paddle and attached onto the chip paddle via the silver paste. Moreover, the chip is electrically connected to the leads. The grounding area is at the periphery of the chip paddle, and furthermore it is protruded from the chip disposal area so as to prevent the silver paste from overflowing on the grounding area. Thus, the electrically conductive wires will attach onto the grounding area well and enhance the electrical performance of the leadless semiconductor package.Type: ApplicationFiled: July 29, 2004Publication date: March 3, 2005Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yung Gai
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Publication number: 20050045105Abstract: The present invention relates to a substrate holder for performing the same or different processes on a plurality of substrates independently of each other in a single chamber and a chamber mounted with the same. According to the present invention, there is provided a substrate holder for fixing a plurality of substrates. The substrate holder comprises a plurality of nozzles for injecting curtain gas for separating the plurality of the substrates from each other.Type: ApplicationFiled: August 27, 2004Publication date: March 3, 2005Applicant: Jusung Engineering Co., Ltd.Inventors: Jung Choi, Kyoung Park
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Patent number: 6860149Abstract: To offer a mass airflow measuring apparatus in which the effect of the adhesion onto the heating resistor caused while the engine is off is reduced and the measuring accuracy is improved. The apparatus measures the mass airflow of the air sucked into the internal combustion engine, using the heating resistor 1. The power control circuit 4 maintains the heating resistor 1 temperature equal to or higher than the temperature during the operation of the internal combustion engine after the internal combustion engine has stopped and until the temperature of the internal combustion engine and its apparatuses installed in the suction system has lowered below the generation temperature of volatile gas such as oil vapor.Type: GrantFiled: September 2, 2003Date of Patent: March 1, 2005Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Shinya Igarashi, Atsushi Kanke, Rintarou Minamitani, Keiichi Nakada, Izumi Watanabe