Abstract: The present invention relates to a flip chip package comprising a chip assembly, a substrate, and an underfill material. The chip assembly has at least one chip. Each chips has a plurality of bond pads formed on a bottom portion of the chip. Each bond pad has a first solder bump formed on the bond pad. The chips are packaged by molding compound to form the chip assembly. The chip assembly has a bottom surface exposing a portion of the first solder bumps. The substrate has a plurality of support pads formed on a top surface of the substrate. Each support pad has a second solder bump formed on the support pad. The first solder bumps electrically connect to the second solder bumps to support the chip assembly by the substrate. The underfill material fills into a gap between the bottom surface of the chip assembly and the top surface of the substrate so as to form the flip chip package.

Abstract: A novel control system for image input device, especially fingerprint image input device, is disclosed. The control system comprises a fingerprint image input device selection module, an instruction conversion module and a fingerprint image size determination module. The fingerprint image input device selection module selects a particular fingerprint image input device from a variety of fingerprint image input devices. The instruction conversion module generates, upon an image capture instruction or a match instruction from a fingerprint verification software, particular image capture instructions to a the selected fingerprint image input device, wherein the instruction pertains to a specification of image as selected by a user or determined with a particular method. The fingerprint image size determination module determines the specification, including the resolution and the size of fingerprint image to be captured.

Abstract: A cold-storage appliance includes an open-topped insulating container defining an external surface; an insulating lid adapted to close the open top of the container; a cooling means adapted to cool the interior of the container; and a structure supporting the container, the lid and the cooling means; wherein the container is mounted to the structure for movement relative to the structure and the lid to open the container and afford access to its interior or to close the container. The cold-storage appliance includes air transfer valves that mitigate the piston effect experienced when opening and closing a drawer, and bellows are attached to the drawer to maintain the vapor barrier.

Abstract: An energy absorbing knee bolster for use in an interior of a vehicle is disclosed. The knee bolster is configured to absorb energy from the vehicle's occupants during a crash. The knee bolster is formed of a collapsible cylinder which is welded to an impact plate on its first end and to a vehicle's cross-car beam at its second end. A coupling flange is disposed between the impact plate and a medial portion of the collapsible cylinder. The collapsible cylinder is configured to axially collapse at a predetermined force when impacted by a moving occupant.

Abstract: A continuously variable transmission system comprises a continuously variable transmission having two pulley sets each with two discs defining a V-shaped groove, drive means-for varying the width of said groove and a belt extending between said-pulley sets in the grooves thereof, as well as a forward-reverse control connected to the shaft of one of the pulley sets and a clutch connected to said forward-reverse control, said pulley sets, forward-reverse control and clutch each being provided with a respective actuator. The actuators of the forward-reverse control and of the clutch are of an electromechanical type.

Abstract: A wafer-level package includes a first chip, a second chip and a bump ring. The first chip has a semiconductor micro device, a bonding pad ring surrounding the semiconductor micro device, and a plurality of bonding pads disposed outside the bonding pad ring and electrically connected to the semiconductor micro device for electrically connecting to an external circuit. The second chip has a bonding pad ring corresponding to the bonding pad ring of the first chip. The bump ring is disposed between the bonding pad ring of the first chip and the bonding pad ring of the second chip for bonding the first and the second chips so as to form a hermetical cavity.

Abstract: Method for the production of a part of a rolling bearing, such as a ring for a ball bearing. The starting material used is a grade of steel containing 0.90 1.00% C; at most 0.15% Si; 0.25-0.45% Mn; at most 0.0015% P; at most 0.010% S; 1.30-1.50% Cr; at most 0.15% Ni; 0.20-0.23% Mo; at most 0.20-0.23% Cu; at most 20 ppm Ti; at most 8 ppm O. Before subjecting this grade of steel to a quenching and tempering treatment, the shaped item is subjected to plastic deformation in the hot or cold state. The mechanical properties and in particular the anticipated life under severe stress improve as a result.

Abstract: An actuator comprises a housing (8) which contains a screw mechanism (9) and a motor (10) which is drivably connected to the screw mechanism (9), said screw mechanism providing a linear movement in response to a rotational movement of the motor, and comprising a screw (12) and a nut (13) one of which is supported rotatably with respect to the housing (8). The linearly displaceable member of the screw mechanism is drivingly connected to a pump mechanism for providing a flow of medium.

Abstract: A marine plough includes twin, complementary steering mechanisms, one or more soil-engaging fins, which are able to be steered, and a tow rope attachment mechanism that enables adjustment of the position of the tow rope retention point relative to the plough. This alters the position at which the line of a tow rope crosses the longitudinal axis of the plough, so that the plough can operate at offset tow positions. The tow rope attachment mechanism includes a bridle having two bridle limbs terminating at respective bridle limb retention points. The adjustment of the position of the tow rope retention point relative to the plough is done by moving the bridle rope retention points or adjusting the relative length of the bridle limbs. The bridle limb retention points can be moved, using cylinders, from towing positions to lifting positions at which the tow bridle can be used to lift plough in a substantially level attitude.

Abstract: Supports are provided on the upper outer casing of each turbine of a turbine unit, and the upper inner casing of the turbine is temporarily placed on the supports of the upper outer casing, which is temporarily placed on the operating floor. By placing the casings temporarily in that way, a large space can be secured for the inspection of the turbine unit, and the inspection can be carried out quickly, which increases the operation ratio of the whole plant including the turbine unit. This invention is useful mainly for turbine units and their overhaul.

Abstract: A manufacturing method of a flip chip package mainly comprises the following steps. Initially, a chip having an active surface with a plurality of bumps formed thereon is provided. Next, the active surface of the chip is faced to and disposed on an upper surface of a substrate. In such manner, the chip will be electrically connected to the substrate and a gap between the chip and the substrate will be formed. Afterwards, an underfill is filled in the gap and then a first curing process is performed to have the underfill partially hardened to have the underfill transformed into a partially hardened underfill. Finally, the combination of the chip, the substrate and the partially hardened underfill is flipped over to have the substrate located above the chip, then a second curing process is performed to have the partially hardened undefill into a fully hardened underfill, and then flipping over the combination of the chip, the substrate and the fully hardened underfill.

Abstract: An under bump metallurgy structure is applicable to be disposed above the wafer and on the bonding pads of the wafer. The wafer comprises a passivation layer and an under bump metallurgy structure. The passivation layer exposes the bonding pads, and the under bump metallurgy structure including an adhesive layer, a first barrier layer, a wetting layer and a second barrier layer are sequentially formed on the bonding pads. Specifically, the material of the second barrier mainly includes tin-nickel alloy.

Abstract: A gas injector for supplying gas into a reaction chamber, in which a substrate is placed, including a main supply tube extending through the reaction chamber such that an outlet end of the main supply tube is positioned in the interior of the reaction chamber, branch tubes branched from the outlet end of the main supply tube, and injector port members connected to respective outlet ends of the branch tubes. Gas from an external gas supply source is supplied into the main supply tube. Each injector port member has a plurality of nozzle holes. Since gas is distributed through the branch tubes, and is then injected through the nozzle holes provided at each injector port member, it is possible to achieve uniform gas injection, and thus, to achieve an improvement in process uniformity.

Abstract: A liquid crystal dispensing system includes a container for containing liquid crystal; a liquid crystal measuring sensor proximate the container; a discharge pump for pumping liquid crystal from the container, and a nozzle for dispensing liquid crystal discharged from the discharge pump onto a substrate. In an exemplary embodiment, the crystal dispensing system includes a control unit for controlling a discharge amount of liquid crystal discharged from the discharge pump and calculating and compensating a dispensing amount of liquid crystal based on an amount of measured liquid crystal in the container.

Abstract: A method and apparatus for evacuating pockets of injected fluid in meat products involves the structure and use of a machine which has a longitudinal movable conveyor surface on the machine; a fluid injection station on the machine for injecting fluid into a meat product on the conveyor surface; a second station on the machine downstream of the fluid injection station; the second station comprising an assembly for applying compressive pressure to the injected meat and penetrating the meat with a plurality of projecting elements to create a plurality of fluid conduits in the injected meat wherein the compressive pressure will force fluid out of the injected meat through the fluid conduits when the projecting elements penetrate the pockets of fluid.

Abstract: A pressing force transmission plate (126) for a friction clutch comprises an annular plate body (150) and at least one impingement area (152) for the introduction of a force exerted by an energy accumulator (130), preferably a diaphragm spring, wherein the plate body (150) and impingement area (152) are flexibly connected by a connection area (154), and wherein the plate body (150) and impingement area (152) form a leg spring arrangement.

Abstract: A method of forming a plurality of bumps over a wafer mainly comprises the steps of providing a wafer having a plurality of bonding pads, forming an adhesive layer on the surface of the wafer to cover the bonding pads, patterning the adhesive layer to expose the bonding pads to form a patterned adhesive layer, forming a barrier layer and a wetting layer on the patterned adhesive layer and the surface of the wafer, removing the barrier layer and the wetting layer not covering the patterned adhesive layer, forming a plurality of bumps on the patterned wetting layer, and reflowing the bumps.

Abstract: An under bump metallurgy structure is applicable to be disposed above the wafer and on the bonding pads of the wafer. The wafer comprises a passivation layer and an under bump metallurgy structure. The passivation layer exposes the bonding pads, and the under bump metallurgy structure including an adhesive layer, a first barrier layer, a wetting layer and a second barrier layer are sequentially formed on the bonding pads. Specifically, the material of the second barrier mainly includes tin-copper alloy.

Abstract: An under bump metallurgy structure is applicable to be disposed above the wafer and on the bonding pads of the wafer. The wafer comprises a passivation layer and an under bump metallurgy structure. The passivation layer exposes the wafer pads, and the under bump metallurgy structure including an adhesive layer, a first barrier layer, a wetting layer and a second barrier layer are sequentially formed on the bonding pads. Specifically, the material of the second barrier mainly includes lead.