Abstract: A bumping process mainly comprises the following steps. Initially, a wafer having a plurality of bonding pads and a passivation layer, which exposes the bonding pads, is provided. Next, a first dielectric layer is disposed on the wafer so as to form a plurality of first openings and second openings. The first openings and the second openings expose the bonding pads and the passivation layer respectively. Afterward, a patterned first electrically conductive layer is formed on the first dielectric layer, the bonding pads and the passivation layer exposed out of the first dielectric layer through the second openings. Then, a second patterned conductive layer is formed directly on the first patterned conductive layer.

Abstract: A bumping process mainly comprises the steps of providing a wafer having a plurality of bonding pads, forming a patterned adhesive layer over the bonding pads, forming a barrier layer and a wetting layer on the patterned adhesive layer and the surface of the wafer, removing the barrier layer and the wetting layer not covering the patterned adhesive layer, forming a plurality of bumps on the patterned wetting layer and reflowing the bumps.

Abstract: A manufacturing method of a semiconductor wafer package mainly comprises the following steps. Firstly, a semiconductor wafer having a plurality of bonding pads and a passivation layer exposing the bonding pads is provided. Next, under bump metallurgy layers are formed on each of the bonding pads respectively. Then, a mask is formed above the semiconductor wafer to expose the under bump metallurgy layers through each of the openings of the mask. Afterwards, a plurality of bump structures are disposed separately in the openings wherein each of the bump structures has a bump and a reinforced layer covering the bump. Finally, a reflow step is performed so that each of the reflowed bumps is connected to the corresponding under bump metallurgy layer and the reinforced layers are transformed into bump-reinforced collars to cover the under bump metallurgy layers and encompass the bumps. In addition, a semiconductor wafer package, which is formed by the manufacturing method, is provided.

Abstract: A bump structure is applicable for disposing above a semiconductor wafer, which has a plurality of bonding pads and a passivation exposing the bonding pads on which a plurality of patterned under bump metallurgy layers are formed. It is characterized that the bump structure is made of a first bump and a second bump, and the bump structure is disposed on one of the patterned under bump metallurgy layer wherein the second bump covers the first bump and the melting point of the second bump is below the melting point of the first bump. In addition, a manufacturing method of the bump structure is provided.

Abstract: An under bump metallurgy structure is applicable to be disposed above the wafer and on the bonding pads of the wafer. The wafer comprises a passivation layer and an under bump metallurgy structure. The passivation layer exposes the wafer pads, and the under bump metallurgy structure including an adhesive layer, a first barrier layer, a wetting layer and a second barrier layer are sequentially formed on the bonding pads. Specifically, the material of the second barrier mainly includes lead.

Abstract: A medically implantable electrical connector includes a housing having a bore with an internal V-groove or a flat bottom groove therein along with radial garter spring disposed in the V-groove or an axial garter spring disposed in the flat bottom groove. A pin is provided and sized for insertion in the housing bore. The housing, spring and pin are formed from a combination of medically implantable materials in order to control electrical resistivity between the housing, the garter spring and the pin.

Abstract: A spotting pin 10 capable of spotting equal amounts of a solution in a sequential manner comprises a first member 11 having a solution holding portion 13 formed at the tip thereof for holding a predetermined amount of solution, and a second member 12 having a solution supply portion 14 for holding the solution by a capillary action, the second member adapted to slide along the first member. As the solution supply portion 14 is brought into contact with the solution holding portion 13, the solution enters the solution holding portion 13 from the solution supply portion 14 by a capillary action. As the solution supply portion 14 and the solution holding portion 13 are separated from each other, a predetermined amount of the solution can be carried in the solution holding portion 13. Then, as the solution holding portion 13 is brought into contact with a water-absorbing support 21, a spot 22 of a predetermined amount of the solution can be formed thereon.

Abstract: A process for hydroprocessing a hydrotreated liquid distillate stream to produce a stream exceptionally low in sulfur as well as aromatics. A hydrotreated distillate stream is further hydrotreated in a co-current reaction zone wherein the reaction product is passed to a separation drum wherein a vapor product is collected overhead and a liquid product is passed to a aromatics saturation zone countercurrent to the flow of hydrogen treat gas.

Abstract: The present invention provides a polycrystalline silicon conducting structure (e.g., a resistor) whose resistance value is controlled, and can be less variable and less dependent on temperature with respect to any resistant value, and a process of producing the same. Use is made of at least a two-layer structure including a first polycrystalline silicon layer of large crystal grain size and a second polycrystalline silicon layer of small crystal grain size, and the first polycrystalline silicon layer has a positive temperature dependence of resistance while the second polycrystalline silicon layer has a negative temperature dependence of resistance, or vice versa. Moreover, the polycrystalline silicon layer of large grain size can be formed by high dose ion implantation and annealing, or by depositing the layers by chemical vapor deposition at different temperatures so as to form large-grain and small-grain layers.

Abstract: An electromagnetic fuel injector of an internal combustion engine having a plurality of electromagnetic coils for valve driving wound separately on a bobbin in an axial direction. The bobbin has a step difference of the outer diameter so that the bobbin outer diameter in the region with the second coil to be wound thereon is smaller then the bobbin outer diameter in the region with the first coil to be wound thereon, and the bobbin inner diameter has a step difference in that the bobbin inner diameter in the region with the first coil to be wound thereon is made large partially so as to secure an annular space to interpose a seal ring therein.

Abstract: A segmented arc generator is adapted to convert mechanical power such as wind or water power into electrical power at a wide range of wind or shaft speeds. A rotor has a plurality of salient poles disposed about a periphery of a rotor ring. A stator has a stator ring disposed radially about and in close proximity to the rotor ring. The stator ring includes a plurality of stator coils wound on a ferromagnetic structure and having permanent magnets imbedded within the structure. Relative motion between a rotor pole and a corresponding stator coil induces a coil voltage across that coil. A phase controlled converter in electrical communication with the stator coils rectifies the output voltage. A pulse width modulated inverter is in electrical communication with the phase controlled converter for converting the D.C. voltage output by the phase controlled converter to an A.C. voltage of controlled amplitude and phase relationship determined with respect to a voltage waveform present on a connected utility grid.

Abstract: In a liquid crystal display device having a flexible printed circuit board which includes a laminated structure of a pair of flexible films, a plurality of first conductive layers interposed between inner surfaces of the flexible films to be spaced from each other, and a plurality of groups of terminals formed on an outer surface of one of flexible films opposite to the respective first conductive layers, and a liquid crystal display panel which includes a plurality of groups of wirings formed on one of a pair of substrates thereof and connected to the plurality of groups of terminals respectively, the present invention interposes second conductive layers at respective portions spacing the plurality of first conductive layers between the inner surfaces of the flexible films and prevents the one of the pair of substrates from being cracked when the plurality of terminals of the flexible printed circuit board are connected to the groups of wiring of the one of the substrates by compression bonding thereby.

Abstract: A molding heater includes a first metal plate having a recess formed on one side and a flat surface formed at the other side. A groove is formed at a lower portion of the recess and a wafer is placed on the flat surface. A hot wire is inserted into the groove. A ceramic is filled in a gap between the hot wire and the groove. A second metal plate coupled with the first metal plate fills the recess while contacting with the lower portion and lateral sides of the recess. Since the hot wire is surrounded only with a single layer of the ceramic, a resistance of the heat conduction can be minimized. Accordingly, a sufficient calorific power can be obtained through the metal plates using even a small power and a short of the hot wire due to an overload can be prevented.

Abstract: A protective relay system for a power system having protective relays at specific locations in the system. Each location has specific setting information for the relay for operation of the relay at that location. Each relay in the protective relay system includes in memory all of the setting information for all of the locations in the power system. Connection of the relay to a key identifier member at a desired location, in one embodiment, provides an identification of that location to the relay. The identification may also be provided by a system computer to which the relay is connected at the desired location. The relay uses the information to obtain the correct setting information for the desired location from its memory for proper protection operation at the desired location, eliminating programming of replacement relays.

Abstract: A structure in a reactor building to be transported is made small when the structure is carried out from the reactor building and/or when the structure is carried into the reactor building. A beam is used outside a building inside of which a reactor pressure vessel is installed. The beam passes above the reactor pressure vessel and crosses over the building. A lifting machine has a lifting device and is moved on the beam. A shield is provided for shielding radioactive rays radiated from the reactor pressure vessel into the building through an opening portion provided in a roof of the building. The reactor pressure vessel, is moved together with the shield upward through the opening portion using the lifting device.

Abstract: A medical device with a hydrophilic and lubricious coating, wherein the coating includes a hydrophilic polymeric unit layer deposited on the medical device and cross-linked with a plasma deposited double bond monomer. The hydrophilic polymeric unit can include ethylene oxide with one or more primary or secondary alcohol groups or glycosaminoglycans such as hyaluronic acid, and the double bond monomer includes monomers containing at least one double bond, preferably a C═C, C═N or C═O bond, including N-trimethylsilyl-allylamine, ethylene, propylene and allyl alcohol.

Abstract: An electric power supply system for a vehicle has an electric power line wired in a loop configuration. From the electric power line power is supplied to a load, and to another system which supplies control system power supply. One shutdown circuit is provided in a module connected to the loop configured power supply line. When the electric power line and the load are short circuited, the shutdown can isolate and shut down only the failure point. Further, when the car is not in use, by stopping the power supply to the load, current consumption can be restrained. In response to detection of a ground short and a failure of a connection of a connector, an over-current prevention of an electric power line, a simple construction can be provided and a low current consumption can be realized.

Abstract: A spray data acquisition system includes a pumping device responsive to an applied force to generate an aerosol spray plume along a spray axis. The system further includes a spray pump actuator that is capable of controlling the pumping force and the duration of the aerosol spray plume produced by the pumping device. The system also includes an illumination device that illuminates the aerosol spray plume along at least one first geometric plane that intersects the aerosol spray plume. The system further includes an imaging device that acquires data representative of an interaction between the illumination and the aerosol spray plume along at least one geometric plane.

Abstract: A process for manufacturing a substrate with an embedded capacitor is disclosed. A first metal wiring layer including a lower electrode pad is formed on a substrate base. A dielectric layer is formed a on the substrate base by build-up coating. A hole is formed in the dielectric layer to expose the lower electrode pad, then a medium material is filled into the hole. The medium material is ground to have a ground surface coplanar to the dielectric layer. A second metal wiring layer including an upper electrode pad is formed on dielectric layer, the upper electrode pad covers the ground surface of the medium material and is parallel to the lower electrode pad so as to form an embedded capacitor.