Abstract: A multi-chips package at least comprises a substrate, an upper chip, a lower chip, a reinforced device, and a plurality of electrically conductive bumps. The upper chip is flip-chip bonded to the upper surface of the substrate and the lower chip is accommodated in the opening and flip-chip bonded to the upper chip. Furthermore, the reinforced device is mounted onto the back surface of the lower chip and the lower surface of the substrate. The coefficient of the thermal expansion of the reinforced device ranges from the coefficient of the thermal expansion of the substrate to the coefficient of the thermal expansion of the chip. In such a manner, the reinforced device can constrain the thermal deformation of the substrate so as to prevent the electrically conductive bumps connecting the first chip and the substrate from being damaged.

Abstract: A multi-chips stacked package mainly comprises a substrate, a lower chip, an upper chip, an intermediate chip, a plurality of bumps and an encapsulation. Therein, the lower chip is disposed on the substrate; the bumps connect the lower chip and the intermediate chip; the upper chip and the lower chip are electrically connected to the substrate via a plurality of first electrically conductive wires and second electrically conductive wires respectively. The bumps can support the intermediate chip more firmly, so the top of the intermediate chip can be kept in counterpoise and higher than the peak of the first wires. Accordingly, the intermediate chip will be prevented from being tilted excessively to cause the upper chip to be contacted to the first electrically conductive wires. Thus, the first electrically conductive wires can be prevented from being damaged when the upper chip is wire bonded to the substrate.

Abstract: A multi-chips stacked package at least comprises a substrate, a lower chip, an upper chip, an adhesive layer, a supporting body and an encapsulation. The lower chip is disposed on the substrate and the upper chip is attached to the lower chip via the adhesive layer. In addition, the lower chip and the upper chip are electrically connected to the substrate via first electrically conductive wires and second electrically conductive wires respectively. Furthermore, the supporting body is disposed on the lower chip and at the periphery of the upper surface of the lower chip, and covered by the upper chip. The top of the supporting body is apart from the back surface of the upper chip with a distance. Accordingly, when the second electrically conductive wires are bonded the upper chip to the substrate with a larger bonding force to cause the upper chip to be tilted more, the supporting body will support the upper chip and prevent the upper chip from contacting the first electrically conductive wires.

Abstract: A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the top surface of the substrate body and a pre-solder material is formed on the bumped pads. The wire-bonding pads are disposed on the top surface of the substrate body and a Ni/Au layer is formed on the wire-bonding pads. In order to avoid the bumping pads and the wire-bonding pads from oxidation during packaging processes. The pre-solder material fully covers the bumping pads to avoid the Au intermetallics generated in a plurality of bumps on a bumped chip during packaging processes. The reliability of the multi-chip stacked package for both flip-chip bumping and wire-bonding applications will be greatly improved.

Abstract: A system for evaluating the cardiovascular system parameters using indicator dilution and non-invasive or minimally invasive detection methods is disclosed. Intravascular indicators are stimulated, and emissions patterns detected for computation of cardiac output, cardiac index, blood volume and other indicators of cardiovascular health.

Abstract: The present invention provides an optical transmitter using a multiplexer which can maintain a timing margin between a clock and data as an operating reference at an optimal value when data transmission speed, or data rate to be handled is changed.

Abstract: A device for exhaust air processing of clean rooms has a least one fresh air supply and at least one exhaust air device connected to a work room. At least one processing device is arranged in the work room. At least one supply line and at least one exhaust air line are connected to the processing device. At least one first filter is arranged in the at least one exhaust air line of the processing device, wherein the at least one exhaust air line is connected at least to one of the supply line of the processing device and the fresh air supply line of the work room.

Abstract: The present invention relates to a package structure for a microsystem, comprising a substrate, a chip, an adhesive structure, a carrying substrate, a micro-mechanism, a plurality of wires, an annular body and a transparent plate. The chip is placed on the substrate. The annular adhesive structure having an opening is placed on the chip. The carrying substrate is placed on the adhesive structure, thus forming an interspace between the chip, the adhesive structure and the carrying substrate. The pressure inside the interspace can be balanced with the pressure outside the interspace through the opening. The micro-mechanism is disposed on the carrying substrate. The annular body is formed on the substrate and the transparent plate is attached on the annular body, thus forming a closed chamber between the substrate, the annular body and the transparent plate. The chip, the micro-mechanism, the adhesive structure, the carrying substrate and the wires are disposed within the closed chamber.

Abstract: In a capacitor formation area A1, a capacitor C1 is formed. The capacitor is constituted by a lower-layer electrode-use polysilicon layer 105 (lower-layer electrode) formed on a LOCOS separation film 101, a nitride film 106 (dielectric film) and an upper-layer electrode-use polysilicon layer 107 (upper-layer electrode). In this case, the lower-layer electrode-use polysilicon layer 105 and the nitride film 106 are formed as the same plane pattern. In CMOS formation area A2, an NMOS transistor Q11 is formed on a P-well region 102 and a PMOS transistor Q12 is formed in an N-well region 103. Both of the gate electrodes of NMOS transistor Q11 and NMOS transistor Q21 are formed by the upper-layer electrode-use polysilicon layer 107.

Abstract: A method is provided for the orthocorrection of a satellite-acquired image. This method can be applied even if ground control points are not set. Without propagation of an error throughout the image and also without needing an excessively large amount of calculations, the method makes it possible to correct ground-relief-associated distortions caused by the relief of a ground surface. According to the method, a plurality of control planes of different elevations are set relative to a control plane of a zero elevation of a reference rotating ellipsoidal earth model. A corrected image is divided into blocks by lattices of equal intervals. With respect to each of these blocks, distortion model formulas in the form of bilinear functions are determined for the respective control planes.

Abstract: An integrated, compact, self contained surveillance unit including: a housing having a front end and a back end; a sensor section attached to the front end of the housing; mechanism for determining the position of the unit; a communications system; a computer, and image output attached to the back end of the housing connected to the computer. The computer is connected to the sensor section, the position determination mechanisms, the communication system and the image output. All are supported by the housing. The sensor is selected from the group including visible sensors, UV sensors, short wavelength infrared sensors and long wavelength infrared sensors. The sensor section also includes an uncooled focal plane array. The position determination mechanisms include GPS, GLONASS, an accelerometer and a compass. The communication system, which is bi-directional, includes a multi-mode patch antenna and a SDR.

Abstract: The instant invention provides a late transition metal complex which can be used with an activating cocatalyst to produce polymers and copolymers. The invention also provides methods for polymerizing olefins, as well as copolymers having polar monomers incorporated therein.

Abstract: A method and mold assembly for forming concrete or another moldable composition. A plurality of elongate elements, such as PVC pipes, are stacked in rows in gravity-stable arrangement to form a contour, such as an arch. The radius of the arch may be controlled by arranging the pipes as desired. Particulate matter, such as sand, may be used between the stacked pipes. Also, an anchor assembly can be used to secure one or more of the pipes to the earth. After the pipes are stacked and a bed of sand has been placed thereon, a waterproof cover is laid over the top of the stack, and layer of concrete is spread. After the concrete is set, the pipes, the cover and the anchor assemblies are removed. The removal will be expedited by washing the sand from the stack. Once removed, the pipes and anchors can be reused indefinitely.

Abstract: A gas flow meter having a gas flow detection circuit for detecting a current flowing through a resistor installed in a gas passage and a voltage generated across the resistor and outputting a voltage signal representing a gas flow passing through the gas passage; a noise reduction circuit for reducing external noise; and a digital adjusting circuit for digitally adjusting a signal representing the detected gas flow and outputting the adjusted signal; wherein a voltage signal based on the signal adjusted by the digital adjusting circuit is output.

Abstract: Disclosed is a steel-concrete composite beam. The steel-concrete composite beam has an asymmetric I-section steel member having an upper flange, a lower flange and a web. The web is formed with at least one opening at a predetermined interval. The upper flange has a narrower width than the lower flange. A pair of C-section steel members is attached integrally to the lower flange of the asymmetric I-section steel form a first space filled with concrete. The concrete interlocks with the lower flange. A deck is supported on the C-section steel members. At least one transverse reinforcing bar of slab is arranged through the opening perpendicular to the asymmetric I-section steel. An upper concrete slab is poured with the concrete to be formed at a predetermined thickness. The concrete fills in a second space defined by the C-section steel members and the lower flange so that the upper flange of the asymmetric I-section steel is embedded.

Abstract: Apparatus for igniting combustible fuel discharged from an outlet in a burner tube comprises a dielectric support within which are an ignition electrode and a ground electrode projecting beyond the support and which are spaced from one another a distance to form a gap which may be traversed by sparks generated by the ignition electrode. A fuel concentrator plate is carried by the ground electrode and partially embraces the ignition electrode adjacent the gap. The electrode support is mounted directly on the burner tube in a position to enable the concentrator plate to intercept fuel discharged from the outlet and concentrate the fuel in the zone of the gap.

Abstract: The apparatus includes two somewhat convex shoes clampable along the adjacent sides of a pair of rails for engagement by the peripheries of wheel flanges so that the wheels are raised just clear of the rails, a load-sensing device at the highest portion of each shoe, and load-indicating means connected to the devices. The apparatus is sectional, the shoes being urged apart into rigidly clamped positions by two struts separable from the shoes to facilitate portability. Two spaced-apart support members are secured to each shoe to embrace its outer and lower faces, each support member being vertically adjustable relative to the shoe to suit different heights of rails. The shoes have replaceable wear-strips.

Abstract: A process for preweakening the inside of an automotive trim piece cover layer of various constructions by use of a laser beam so as to enable formation of an air bag deployment opening in the trim piece formed at the time the air bag deploys. The laser beam impinges the inside surface of the cover to form a groove scoring or spaced perforations to form a preweakening pattern. A robot arm may be used to move a laser generator so as to form the preweakening pattern. The laser beam can be controlled in accordance with sensed conditions to achieve accurate preweakening, and may also be used to trim substrate panels and to perform other cutting operations.

Abstract: A method for producing a capillary bead array comprises the steps of: dispensing beads into a liquid pool 202, outside a capillary, having a depth of almost the same length as the particle diameter of a bead; leveling the excessive beads by moving a leveling member which is in contact with and relatively capable of be moved to the liquid pool to remove excessive beads that the liquid pool cannot contain; aligning the beads in the liquid pool one- or two-dimensionally; bonding adjacent individual beads to each other; producing a structure 209 having the plurality of beads bonded and aligned one- or two-dimensionally; removing the structure from the liquid pool; and disposing the structure in the capillary formed of soft resin, so that the beads comprising the plurality of beads retaining the one- or two-dimensional alignment can be introduced simultaneously into the capillary.