Abstract: An injection and solidification operation as well as a kneading and solidification operation can be performed by a single facility. A decreased amount of radioactive secondary waste is generated. A solidifying agent paste is prepared by kneading a solidifying agent and additive water. The solidifying agent paste is injected into a solidifying container. The radioactive waste is charged into the solidifying container and kneaded.

Abstract: An antenna base, a control circuit section, and a high-frequency circuit section are enclosed in an inner space defined by a housing and a radome. Inside this inner space, the control circuit section and the high-frequency circuit section are surrounded by the antenna base and the housing. A circuit GND common to the control circuit section and the high-frequency circuit section is electrically connected to the antenna base and the housing, and it is connected to a body GND through only capacitive impedance.

Abstract: The present invention relates to a V-notched web formed on a drill insert of a drill tool assembly. The V-notched web allows greater stability and feed rates, while decreasing the heat generated at the insert tip. The present invention is provided by a drill insert comprising a drill insert body having at least two cutting edges, a web between the two cutting edges, and a web thinning notch formed on either side of the web. Each web thinning notch forms a notch cutting edge having a positive rake angle.

Abstract: A multi-chip package with electrical interconnection comprises a leadframe, at least a relay conductor, at least a first chip, at least a second chip, a plurality of bonding wires and a molding compound. A dielectric carrier is attached to the leadframe for fixing the relay conductor. The relay conductor has a top surface for interconnection of the bonding wires and a bottom surface attached to the dielectric carrier to electrically isolated from the leadframe. The bonding wires electrically connect the bonding pads of the first chip and second chip to the common lead of the leadframe through the relay conductor so as to achieve electrical interconnection of the plurality of chips and the leadframe inside the molding compound with lower cost.

Abstract: Provided is a local heatsink welding device and a method of welding using the same. The local heatsink welding device includes a welding torch disposed above welds of two pieces of a base metal placed in contact with each other to be welded, the welding torch welding the pieces of the base metal by melting a welding wire on the welds of the base material and fusing the pieces together; and a cooling unit disposed to be able to spray a low-temperature fluid from the sides of the welding torch, the cooling unit cooling at least a portion of a heat-affected zone formed around the outside of a fusion zone in which the base material is molten during welding.

Abstract: A flip chip package mainly comprises a chip, a leadless lead frame. The leadless lead frame has a die paddle and a plurality of leads. The active surface of the chip has a plurality of bonding pads formed thereon. Besides, a plurality of bumps formed on the bonding pads are electrically connected to the chip, the leads and the die paddle. Therein, the die paddle electrically connected to the chip via the bumps not only prevents the chip from being dislocated but also provides another grounding and heat transmission paths to enhance the electrical, thermal and mechanical performance of the flip chip package. Similarly, the bumps formed on the bonding pads of the chip are electrically connected to the leads so as to fix the chip to the lead frame more securely.

Abstract: The present ink proofer arrangement generates consistent and reliable ink draw downs irrespective of the size of the substrate or the user preparing the ink sample. In one example embodiment, an ink proofer arrangement adapted to be used with an ink proofer tool, the ink proofer tool including an ink transfer roller. The ink proofer arrangement further includes a cylindrical roller and a drive motor adapted to rotate the roller. In addition, a first movable mounting assembly is included that retains the ink proofer tool adjacent to and in a non-contact position with the roller.

Abstract: An electromagnet includes a coil, a movable iron core adapted to move on the center axis of the coil, and a stationary iron core provided so as to cover the upper and lower surfaces and the outer peripheral surface of the coil. A permanent magnet is arranged in a gap surrounded by the movable iron core and the stationary core.

Abstract: An apparatus for automated preparation of DNA samples which comprises a reactor for preparing DNA samples and adjacent thereto an enzyme supply section, a plate holding section, a nozzle sealing section and a cleaning tank section, and wherein plates are loaded onto or unloaded from said plate holding section by means of a transport robot.

Abstract: A dual transformer design, each transformer having at least a primary winding and a secondary winding disposed on a core means, wherein the core means is circumferentially disposed about an inner housing means, and the whole structure located within an outer housing. The primary winding of one transformer of said pair of transformers is electrically coupled to the primary winding of the other in a manner such as to cause induced eddy currents from one transformer to be of a magnitude and direction so as to substantially cancel the induced eddy currents from the other transformer.

Abstract: To determine the transplant compatibility of an in vitro cultured tissue, a method measures the stiffness of the cultured tissue by using a stiffness measuring device, which stiffness measuring device includes a detecting unit and calculation means, the detecting unit includes a contact unit, a vibrator connected to the contact unit, and a vibration detecting unit for detecting the vibration of the vibrator, and the calculation means determines stiffness information by calculation based on the detected result from the vibration detecting element; and by bringing the contact unit into contact with the cultured tissue. With this method the transplant compatibility of the cultured tissue can be nondestructively and easily determined easily and the quality of the cultured tissue can be appropriately controlled.

Abstract: A screw actuator which has a housing, a motor, an actuating member and a screw mechanism which provides a linear movement of the actuating member with respect to the housing in response to a rotational movement of the motor. The screw mechanism has a screw and a nut engaging each other by rolling elements, one of the screw or the nut is rotatbly supported with respect to the housing, and a reduction gear means. The nut is fixed with repect to the housing, and the screw is rotatably supported with respect to the housing by mean of rolling elements.

Abstract: Provided is a BiCOMOS semiconductor integrated circuit device which comprises a semiconductor substrate having an insulating layer internally and partially embedded therein and a semiconductor layer deposited on the insulating layer, an insulated gate type transistor formed in the semiconductor layer, a highly-doped collector layer of a bipolar transistor embedded in an insulating-layer-free portion of the semiconductor substrate, and a low-doped collector layer disposed on the highly-doped collector layer of the bipolar transistor, wherein the height level of the lower portion of the low-doped collector layer is below the height level of the lower portion of the insulating layer so as to attain high breakdown voltage and high speed operation of the bipolar transistor.

Abstract: An uppermost interlayer isolation film is provided on a semiconductor substrate. An uppermost wire is provided on the uppermost interlayer isolation film. A silicon oxide film is provided to cover the upper surface and the side wall of the uppermost wire. A nitride film is provided on the uppermost interlayer isolation film to cover the uppermost wire through the silicon oxide film. A polyimide film is provided on the nitride film. A portion of the uppermost interlayer isolation film other than a portion located under the uppermost wire is downwardly scooped. The nitride film covers the scooped portion of the uppermost interlayer isolation film. According to the present invention, a semiconductor device improved to be capable of improving coverage of a silicon nitride passivation film is obtained.

Abstract: An apparatus for cutting a liquid crystal display panel includes a cutting wheel having a spindle shape substantially corresponding to two conical shapes being attached to each other at circular bottom surfaces, a cutting blade along a central portion of the cutting wheel, a holder to which the cutting wheel is mounted, and a support part at the holder, the support part fixing and supporting the cutting wheel.

Abstract: An electromagnet includes a coil, a movable iron core adapted to move on the center axis of the coil, and a stationary iron core provided so as to cover the upper and lower surfaces and the outer peripheral surface of the coil. A permanent magnet is arranged in a gap surrounded by the movable iron core and the stationary core.

Abstract: A hybrid transport vehicle, which needs an overhead wire and/or a railway and has a plurality of kinds of energy supply systems and/or driving apparatuses, is provided with a condition detection device for detecting an energy supply condition of the energy supply systems and/or an operation condition of the driving apparatuses, and an informing device for informing the energy supply condition and/or the operation condition, detected by the condition detection device.

Abstract: A method of conducting accurate identification of biological species with a biochip, and a method of effectuating identification of biological species at a level higher than species are provided. Selection of specific probes for multiple biological species is also facilitated. A plurality of partial sequences A, A′; B, B′; and so on, which are specific to respective targets, are selected as probes. in a manner that the partial sequences do not overlap one another. In addition, DNA regions I, J, K and L, which are common to some targets, respectively, are also selected as probes. Alternatively, if there is a common base sequence at leaves below a certain node based on a dendrogram of targets, such a base sequence is designed as a probe unique to the node.

Abstract: A stacked flip-chip package comprises a substrate having an opening, a back-to-face chip module, and an encapsulant. The back-to-face chip module is attached to the substrate and encapsulated by the encapsulant. The back-to-face chip module includes a first chip and a second chip. The first chip has a first active surface and a first back surface. Redistributed traces are formed on the first back surface. The second chip is flip-chip mounted on the first back surface of the first chip and electrically connected to the redistributed traces. A plurality of bumps connect the redistributed traces to the top surface of the substrate. Thus the second chip can be accommodated inside the opening and the redistributed traces are electrically connected to the second chip and the substrate so as to achieve fine pitch flip-chip mounting and improve the electrical performance and heat dissipation efficiency for the back-to-face chip module.

Abstract: A basic module 2 has operation program storing part for prescribing the relation between the state of a safety input signal to be fetched from external input terminal sections 32, 33 and the state of a safety output signal to be transmitted to external output terminal sections 41, 42 for each type of predetermined safety switches, type-of-switch setting part for setting external input terminal sections 31, 32 and the type of safety switches to be connected to the external input terminal sections, and operation program executing part for selecting a safety operation program corresponding to the type of the switch set by the setting part among a plurality of types of safety operation programs stored in the operation program storing part and executing the selected program for the external input terminal sections 31, 32 set by the setting part.