Patents Assigned to Engineering
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Patent number: 6810965Abstract: A fire engine or a truck carrying a fire extinguishing system having a device for supplying a powder fire extinguishing agent coated with a waterproof film, e.g., a silicone resin, and a fire-fighting water delivery pipeline, is used. The powder fire extinguishing agent is added and mixed into the fire-fighting water delivery pipeline, and mixed water is delivered through a fire house and discharged from a spray nozzle provided at the distal end of the fire hose.Type: GrantFiled: October 15, 2002Date of Patent: November 2, 2004Assignees: Miyake Engineering Co., Ltd., A.R.P. Co., Ltd.Inventors: Masao Matsukawa, Susumu Miyake
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Patent number: 6812981Abstract: The present invention is provided for obtaining a liquid crystal display device and a mobile phone which exhibit the low power consumption and do not damage the display quality. To this end, a display part of the liquid crystal display device is divided into two regions, wherein one region performs a display in a semi-transmission type or in a reflection type and the other region performs a display in a transmission type. Further, the display is performed in a state that the liquid crystal display device is incorporated into the mobile phone.Type: GrantFiled: June 8, 2001Date of Patent: November 2, 2004Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.Inventor: Yuichi Yoshino
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Patent number: 6812911Abstract: The present invention realizes a liquid crystal display device and an image display device which prevent the generation of flickering when power is supplied again after the supplying of power is stopped. The liquid crystal display device includes first and second substrates which are arranged to face each other in an opposed manner, a liquid crystal layer which is inserted between the first and second substrates, active elements, scanning signal lines for operating the active elements and pixel electrodes to which video signals are supplied upon operation of the active elements which are all mounted on one substrate, an orientation film which is inserted between the pixel electrodes and the liquid crystal layer, and reference electrodes which are mounted on either one or the other substrate, and the liquid crystal display device performing a display by generating the potential difference between the pixel electrodes and the reference electrode.Type: GrantFiled: November 21, 2001Date of Patent: November 2, 2004Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.Inventors: Tatsuo Makishima, Shinichi Iwasaki, Masaaki Kitajima, Yoshio Oowaki, Koji Takahashi, Shunsuke Morishita
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Patent number: 6811588Abstract: An automotive air filter including natural fiber filter media region, having piteous, absorbent, wickable natural fibers, a synthetic fiber filter media region including, absorbent spunbond polyester filters. The natural fiber region receives an influent fluid stream containing particles, trapping some particles. The manufactured fiber region removes residual particles, producing a filtered effluent stream. The fluid stream passes unimpaired through the fiber pores. Two structural mesh layers sandwich natural and manufactured fiber regions. Oil is disposed in the oleophilic cotton mesh. Fiber regions have layers disposed in gradient density arrangement.Type: GrantFiled: November 1, 2002Date of Patent: November 2, 2004Assignee: Advanced Flow Engineering, Inc.Inventor: Shahriar Nick Niakin
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Patent number: 6811627Abstract: A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is carried out based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.Type: GrantFiled: March 12, 2003Date of Patent: November 2, 2004Assignee: Toray Engineering Co., Ltd.Inventors: Yoshiyuki Arai, Akira Yamauchi
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Patent number: 6811683Abstract: A process for producing a diesel fuel stock from bitumen uses steam and a hydroisomerized diesel fraction produced by a gas conversion process, to respectively stimulate the bitumen production and increase the cetane number of a hydrotreated diesel fuel fraction produced by upgrading the bitumen, to form a diesel stock. The diesel stock is used for blending and forming diesel fuel.Type: GrantFiled: March 27, 2001Date of Patent: November 2, 2004Assignee: ExxonMobil Research and Engineering CompanyInventors: Stephen Mark Davis, Michael Gerard Matturro
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Patent number: 6811183Abstract: A device for venting a gas bag made of a textile material includes at least one ignitable pyrotechnic charge which is associated with the gas bag in such a way that, when the pyrotechnic charge is ignited, at least one thread of the textile material is directly destroyed by the explosion of the pyrotechnic charge.Type: GrantFiled: May 30, 2002Date of Patent: November 2, 2004Assignees: I.E.E. International Electronics & Engineering S.ar.l., DaimlerChrysler AGInventors: Bogdan Serban, Michel Witte, Volker Petri, Michael Meyer, Harald Rudolf
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Patent number: 6811682Abstract: The invention relates to a process for converting cycle oils produced in catalytic cracking reactions into light olefin and naphtha. More particularly, the invention relates to a process for hydroprocessing a catalytically cracked light cycle oil in order to form a hydroprocessed cycle oil containing a significant amount of tetralins. The hydroprocessed cycle oil is then re-cracked in an upstream zone of the primary FCC riser reactor.Type: GrantFiled: October 2, 2002Date of Patent: November 2, 2004Assignee: ExxonMobil Research and Engineering CompanyInventors: Gordon F. Stuntz, George A. Swan, III, William E. Winter, Michel Daage, Michele S. Touvelle, Darryl P. Klein
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Patent number: 6813185Abstract: A non-volatile memory device is provided which includes a flash memory having a plurality of banks and a bank selection register which can take on states at least equal in number to the number of banks. The bank selection register outputs a signal to point to one of the banks based upon one of the states of the bank selection register. A controller is also provided having a plurality of data buffers corresponding, respectively, to the banks. In addition to word lines, bit lines and memory cells, each bank includes a data register to temporarily hold data to be written to the memory cells. The controller transmits data in the data buffer to the data register of the pointed to bank, while the flash memory writes data held in the data register to the memory cells of another one of the banks.Type: GrantFiled: February 26, 2004Date of Patent: November 2, 2004Assignees: Renesas Technology Corp., Hitachi Device Engineering Co., Ltd.Inventors: Naoki Kobayashi, Shunichi Saeki, Hideaki Kurata
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Patent number: 6810797Abstract: A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeegee is being moved over the stencil, is characterized in that elevation control of the squeegee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeegee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening.Type: GrantFiled: October 18, 2002Date of Patent: November 2, 2004Assignee: Toray Engineering Company, LimitedInventors: Kenji Kanbara, Kazuo Ando, Shiro Okada
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Patent number: 6811685Abstract: A self-cleaning strainer which may be installed upstream of a heat exchanger to prevent debris greater than a critical size from reaching the heat exchanger. The strainer is preferably mounted just upstream of a heat exchanger in order to minimize the possibility of debris reaching the heat exchanger. The strainer comprises a screen element which can be advanced across the flow path of the fluid between two rollers. The screen element is placed so that the fluid must flow across the screen element face to continue through the process pipe; the screen may be perpendicular or parallel to the fluid flow axis of the strainer body or at an intermediate angle to it. Flow blocking members are used so as to direct the flow to pass through the screen element.Type: GrantFiled: August 19, 2003Date of Patent: November 2, 2004Assignee: ExxonMobil Research and Engineering CompanyInventors: Amar S. Wanni, Thomas M. Rudy, Marciano M. Calanog
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Patent number: 6812124Abstract: A chip structure with bumps comprising: a chip and at least a bump. The chip has an active surface and at least a bonding pad that is formed on the active surface. The bump is disposed on the bonding pad, and the bump comprises a medium layer, a bump body and a bump body passivation layer. The medium layer whose material includes zinc is disposed on the bonding pad. The bump body whose material includes nickel is disposed on the medium layer. The bump body passivation layer whose material includes gold covers the bump body except for a portion of the bump body that connects to the medium layer.Type: GrantFiled: November 5, 2002Date of Patent: November 2, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventor: Chao-Fu Weng
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Patent number: 6811515Abstract: The improved CVT control apparatus for a vehicle is disclosed. By using the CVT control apparatus, it becomes possible that the drive feeling is constant independently of a running state, the vehicle is accelerated as the driver's intention if accelerated due to the actuation of an accelerator pedal, and the run of the vehicle is performed so as to improve the fuel consumption rate if the acceleration is not required. By always calculating a correct driving torque, the transmission gear ratio is calculated to obtain the target driving torque set based on the amount of actuation of an accelerator pedal, and the obtained target driving torque is corrected by the gradient of a road obtained from the calculated driving torque. Further, the gear ratio which aims at the improvement of acceleration and the gear ratio which aims at the improvement of the rate of fuel consumption are weighted and combined with each other, and the optimum gear ratio is obtained by using fuzzy inference.Type: GrantFiled: April 28, 2003Date of Patent: November 2, 2004Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Masahiko Ibamoto, Kazuhiko Sato, Hiroshi Kuroiwa, Makoto Shioya
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Publication number: 20040211479Abstract: A liquid crystal dispensing apparatus dispenses liquid crystal onto a substrate. The liquid crystal dispensing apparatus includes a frame, a table, at least one liquid crystal discharge device, and a liquid crystal amount inspecting portion. The table is installed on the frame to have the substrate to be mounted thereon. The liquid crystal discharge device adjustably discharges an amount of liquid crystal, and the liquid crystal amount inspecting portion inspects a liquid crystal dispensing amount by comparing an actual amount of liquid crystal discharged from the liquid crystal discharge device with a preset liquid crystal amount. The liquid crystal discharge device includes a piston to perform ascending motions to draw in the liquid crystal and descending motions to discharge the liquid crystal with an angle of at least a portion of the liquid crystal discharge device determining a magnitude of the ascending/descending motion to control an amount of liquid crystal discharged.Type: ApplicationFiled: May 18, 2004Publication date: October 28, 2004Applicants: LG. Philips LCD Co., Ltd., Top Engineering Co., Ltd.Inventors: Joung-Ho Ryu, Hyug-Jin Kweon, Hae-Joon Son, Kyu-Yong Bang, Joon-Young Kim, Man-Ho An, Yong-Kyu Seo
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Publication number: 20040212067Abstract: A multi-chips stacked package at least comprises a substrate, an upper chip, a lower chip, a reinforced bump and a plurality of conductive bumps. The upper chip is flip-chip bonded to the upper surface of the substrate; and the lower chip is accommodated in the opening and flip-chip bonded to the upper chip. The reinforced bump is mounted onto the active surface of the upper chip and connected to the substrate so as to enhance the attachment of the upper chip to the substrate. In such a manner, the reinforced bump will restrain the thermal deformation of the substrate and the upper chip so as to prevent the electrically conductive bumps connecting the upper chip and the substrate from being damaged.Type: ApplicationFiled: April 9, 2004Publication date: October 28, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Meng-Jen Wang
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Publication number: 20040212097Abstract: A flip chip package comprises a carrier, a chip, a dam, a heat spreader, an underfill and a plurality of electrically conductive bumps. The chip is flip-chip bonded to the upper surface of the carrier. Furthermore, the dam is disposed on the carrier and supports the heat spreader. In addition, the underfill is filled into the space that is enclosed by the dam. In such a manner, the chip, the electrically conductive bumps and a portion of the carrier are covered by the underfill. The underfill is connected to the dam, the heat spreader and the carrier simultaneously, so the reinforced structure including the heat spreader, the underfill and the dam can reduce the stress at the interconnection between the chip and carrier so as to prevent the bumps connecting the chip and the carrier from being damaged.Type: ApplicationFiled: February 18, 2004Publication date: October 28, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Wen Chen, Chi-Hao Chiu, Meng-Jen Wang
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Publication number: 20040212066Abstract: A multi-chips stacked package at least comprises a substrate, a lower chip, an upper chip, an adhesive layer, a supporting body and an encapsulation. The lower chip is disposed on the substrate and the upper chip is attached to the lower chip via the adhesive layer. In addition, the lower chip and the upper chip are electrically connected to the substrate via first electrically conductive wires and second electrically conductive wires respectively. Furthermore, the supporting body is disposed on the substrate, surrounds the periphery of the first chip and covered by the second chip. The top of the supporting body is apart from the back surface of the second chip with a distance. Accordingly, when the second electrically conductive wires are bonded the upper chip to the substrate with a larger bonding force to cause the upper chip to be tilted more, the supporting body will support the upper chip and prevent the upper chip from contacting the first electrically conductive wires.Type: ApplicationFiled: December 30, 2003Publication date: October 28, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Sung-Fei Wang
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Publication number: 20040212068Abstract: A multi-chips stacked package at least comprises a substrate, an upper chip, a lower chip, a plurality of electrically conductive wires and a plurality of conductive bumps. The upper chip is flip-chip bonded to the upper surface of the substrate; and the lower chip is accommodated in the opening and wire-bonded to the upper chip. Furthermore, the lower chip can be wire-bonded to the substrate via a plurality of another electrically conductive wires, which directly connect the lower chip and the substrate.Type: ApplicationFiled: April 9, 2004Publication date: October 28, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Meng-Jen Wang
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Publication number: 20040212490Abstract: Base stations in an outdoor warning siren system monitor the system communication radio frequency to detect the command signals used to activate remotely located warning units. A valid command signal includes a portion identifying the base station generating the signal. When a base station detects a signal bearing its identification, the base station compares the detected signal to its own station ID. If the detected signal matches the detecting station's ID then a system breach is declared. The outdoor warning siren system may respond to a breach by automatically de-activating any alarms activated by the unauthorized signal and/or producing a breach indication to emergency personnel who may respond according to the situation.Type: ApplicationFiled: April 22, 2003Publication date: October 28, 2004Applicant: Whelen Engineering Company, Inc.Inventors: Thomas M. Fredericks, Kenneth S. Lemieux
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Publication number: 20040212069Abstract: A multi-chips stacked package comprises a substrate, an upper chip, a lower chip, a dam, a heat spreader, an underfill, a plurality of first electrically conductive bumps and a plurality of second electrically conductive bumps. The upper chip is flip-chip bonded to the upper surface of the substrate and the second chip is accommodated in the opening and flip-chip bonded to the upper chip. Furthermore, the dam is disposed on the substrate and supports the heat spreader so as to fix the heat spreader to the back surface of the first chip. In addition, the underfill is filled into the space which is enclosed by the dam, the upper surface of the substrate and the heat spreader. In such a manner, at least the upper chip, the lower chip, the first and second electrically conductive bumps and a portion of the substrate are covered by the underfill.Type: ApplicationFiled: April 9, 2004Publication date: October 28, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Wen Chen, Meng-Jen Wang, Chi-Hao Chiu