Patents Assigned to Engineering
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Patent number: 6823229Abstract: The substrate carrier management system includes a pre-diffusion processing apparatus, a carrier cleaner, and a carrier conveyer. The pre-diffusion processing apparatus unloads a substrate from a supplied carrier in which the substrate is stored, performs predetermined processing on the substrate, and transfers the processed substrate stored in a carrier to be used after processing. The carrier cleaner cleans a carrier emptied as a result of taking a substrate out of the carrier. The carrier conveyer conveys a carrier between the pre-diffusion processing apparatus and the carrier cleaner. The empty carrier unloaded from the pre-diffusion processing apparatus is cleaned by the carrier cleaner, and the processed substrate is stored in the empty carrier. With this arrangement, it is possible to automatically change carriers and thereby continuously use a cleaned carrier in the subsequent step without using a dedicated carrier.Type: GrantFiled: April 25, 2002Date of Patent: November 23, 2004Assignees: Renesas Technology Corp., Ryoden Semiconductor System Engineering CorporationInventors: Masaki Ootani, Yasuhiro Sato, Takamasa Inobe, Yasuhiro Marume, Toshiyuki Watanabe
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Patent number: 6822324Abstract: A wafer-level package with a cavity includes a chip, a substrate, and a seal member. The chip has a micro device and a plurality of bonding pads electrically connected to the micro device. The substrate has a plurality of through conductive vias corresponding and electrically connected to the bonding pads. Each of the bonding pads on the chip is provided with a conductive bump for electrically connecting the bonding pad to the conductive via. The seal member surrounds the package to form a hermetical cavity. The present invention further provides a method for fabricating the wafer-level package with a cavity.Type: GrantFiled: January 28, 2003Date of Patent: November 23, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Su Tao, Kuo-Chung Yee, Jen-Chieh Kao, Chih-Lung Chen, Hsing-Jung Liau
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Patent number: 6820296Abstract: A novel apparatus for moving passengers between an airport terminal building and a doorway of an aircraft located rearward of a wing of the aircraft. The inventive apparatus includes a passageway member pivotally anchored to one of the terminal building and a passenger loading bridge for servicing a front doorway of a same aircraft. The apparatus includes a telescopic passageway member that is pivotally mounted to the passageway member via a flexible connection. In use, the apparatus is cantilevered over the wing of an aircraft with the flexible connection substantially above a highest point along an upper surface of the aircraft wing. The flexible connection allows a cabin carried at an outboard end of the telescopic passageway member to mate to the rear doorway of the aircraft, providing an open passageway between the rear doorway and the terminal building through which passengers deplane.Type: GrantFiled: January 30, 2003Date of Patent: November 23, 2004Assignee: DEW Engineering and Development LimitedInventors: Neil Hutton, Christopher Nowak
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Patent number: 6820864Abstract: Atomization and vaporization of spray in a fuel supply system is promoted at the time of cold startup and the amount of fuel depositing on the inner wall of the intake manifold is reduced, thereby ensuring improved startability of an internal combustion engine of a car, reduced fuel costs and improved purification of exhaust gas. A very fine groove is formed on a heat transfer surface in a fuel vaporization promoting apparatus, wherein this groove is shaped in such a way that fuel is dispersed by the surface tension of the heat transfer surface and the fuel. This configuration ensures uniform dispersion of fuel on the heat transfer surface and effective promotion of vaporization.Type: GrantFiled: December 24, 2002Date of Patent: November 23, 2004Assignees: Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.Inventors: Kiyoshi Amou, Yuzo Kadomukai, Hiroaki Saeki, Kenji Watanabe, Takanobu Ichihara, Masami Nagano
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Patent number: 6821906Abstract: Method and apparatus for treating a surface of a substrate plate under irradiation of ultraviolet ray emitted from a dielectric barrier discharge lamp. Upon admission into a treating chamber, oxygen is removed from a treating surface and surrounding atmosphere of a substrate plate in order to suppress energy losses of ultraviolet ray to a minimum.Type: GrantFiled: November 20, 2001Date of Patent: November 23, 2004Assignee: Hitachi High-Tech Electronics Engineering Co., Ltd.Inventors: Kenya Wada, Kazuto Kinoshita, Kazuhiko Gommori
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Patent number: 6820816Abstract: A thermostatic mixing valve (TMV) for operation across a range of flow rates wherein during low pressure operation water enters the TVM (100) into chamber (157) around the circumference of the valve member (150) and cold valve seat (140) and hot water enters into chamber (158), the hot and cold water entering chamber (235) and becoming thoroughly mixed. At low pressure drops, the check valves (230) remain closed so the only pathway the mixed water can follow is through the sensing chamber (125) and the mixed water enters discharge portion (120) to the mixed water outlet (245), the flow path of the hot and cold water shown by pathways (255) and (260), the water becomes thoroughly mixed before entering the sensing chamber (225).Type: GrantFiled: October 1, 2003Date of Patent: November 23, 2004Assignee: The Horne Engineering Co. Ltd.Inventor: William Reid
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Patent number: 6822582Abstract: An improved automotive vehicle service system incorporating an RFID interrogator to exchange data with one or more RFID transponders or tags associated with a vehicle undergoing service, or with a component of a vehicle undergoing service. The automotive vehicle service system is configured to utilize data received through the RFID interrogator from the RFID transponders or tags during a vehicle service procedure. Optionally, the automotive vehicle service system is configured to store data associated with a vehicle service procedure in an RFID transponder or tag associated with a vehicle undergoing service, or with a component of a vehicle undergoing service.Type: GrantFiled: February 25, 2003Date of Patent: November 23, 2004Assignee: Hunter Engineering CompanyInventors: David Voeller, Joel Clasquin
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Publication number: 20040230179Abstract: The present invention is directed to devices and methods of using a surgical drain, and more particularly to a surgical drain having at least one sensor for monitoring and/or recording the condition of the anatomical site or fluid emitted from the site where the surgical drain is placed. The invention may also include modifications of the surgical drain to improve stabilization or immobilization in the proximity of the anatomical site to be monitored.Type: ApplicationFiled: February 9, 2004Publication date: November 18, 2004Applicants: Alfred E. Mann Institute for Biomedical Engineering, at the Univeristy of Southern CaliforniaInventor: Ramez Emile Necola Shehada
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Publication number: 20040230381Abstract: A method of properly correcting a base line. A concept of flexibility of a base line is introduced as an input index and a gravitation is presumed between the base line and signal data which is measured, thereby constructing a method of correcting the base line which changes gentler than a change in signal With respect to time in a peak area and which is sensitive to an area where a value of the signal data is small. A base line like a natural and smooth curve which isn't easily influenced by a local change in signal such as noise or the like can be set by an input of the flexibility.Type: ApplicationFiled: October 28, 2003Publication date: November 18, 2004Applicants: Hitachi, Ltd., Hitachi Instruments Engineering Co., Ltd.Inventors: Masahito Ito, Kisaburo Deguchi, Yoshiaki Seki
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Publication number: 20040227252Abstract: A flip chip package comprises a substrate, a chip, a plurality of electrically conductive bumps and reinforced bumps. The chip has an active surface having a central area and a peripheral area surrounding the central region. The electrically conductive bumps are disposed at the peripheral region of the chip to electrically connect to the substrate. In addition, the reinforced bumps are disposed at the central area of the chip. In such manner, it can enhance the connection between the chip and the substrate.Type: ApplicationFiled: March 26, 2004Publication date: November 18, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Sung-Fei Wang
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Publication number: 20040226743Abstract: A bumpless assembly package mainly comprises a substrate, and a chip. The substrate has an upper surface and an opposite lower surface, a plurality of first contacts and a plurality of second contacts formed on the upper surface of the substrate, wherein one of the first contacts is electrically connected to one of the second contacts. The chip has an active surface and a boding pad formed on the active surface and is disposed in the opening, Moreover, an electrically conductive layer is disposed above the upper surface of the substrate and the active surface of the chip, and extended from the upper surface of the substrate to the active surface of the chip so as to electrically connect the chip and the substrate. In addition, a protective layer is provided to dispose above the electrically conductive layer and expose the second contacts so that the second contacts can electrically connect to external electronic devices.Type: ApplicationFiled: November 12, 2003Publication date: November 18, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Jen-Kuang Fang
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Publication number: 20040230132Abstract: The present invention is directed to devices and methods of using a surgical drain, and more particularly to a surgical drain having at least one sensor for monitoring and/or recording the condition of the anatomical site or fluid emitted from the site where the surgical drain is placed. The invention may also include modifications of the surgical drain to improve stabilization or immobilization in the proximity of the anatomical site to be monitored.Type: ApplicationFiled: February 9, 2004Publication date: November 18, 2004Applicants: Alfred E. Mann Institute for Biomedical Engineering at the, University of Southern CaliforniaInventor: Ramez Emile Necola Shehada
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Publication number: 20040230118Abstract: The present invention is directed to devices and methods of using a surgical drain, and more particularly to a surgical drain having at least one sensor for monitoring and/or recording the condition of the anatomical site or fluid emitted from the site where the surgical drain is placed. The invention may also include modifications of the surgical drain to improve stabilization or immobilization in the proximity of the anatomical site to be monitored.Type: ApplicationFiled: February 9, 2004Publication date: November 18, 2004Applicant: Alfred E. Mann Institute for Biomedical Engineering at the University of Southern CAInventors: Ramez Emile Necola Shehada, Nicolas Jabbour
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Publication number: 20040228748Abstract: A diaphragm pump which overcomes the problem of diaphragm failure due to overfill of the oil transfer chamber. An overfill preventive element in the form of a mechanical stop, a fully closed coil spring, or a valve system, or alternatives are provided.Type: ApplicationFiled: May 16, 2003Publication date: November 18, 2004Applicant: Wanner Engineering, Inc.Inventors: Kenneth Eugene Lehrke, Richard D. Hembree
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Publication number: 20040227955Abstract: There are provided a thickness-measuring method and apparatus capable of measuring thicknesses of respective layers of a multilayer thin film used in functional resin films or information electronic materials at a still higher accuracy and instantaneously, which are also applicable to a sample in production line non-destruct. In the thickness-measuring method for the multilayer thin film, a reflected or transmitted light obtained by irradiating a white light onto a sample (7) having the multilayer thin film is spectrally dispersed to obtain a spectrum thereof; and the obtained spectrum is transformed into a frequency signal which is then subjected to wavelet processing to remove components other than coherence signals from the frequency signal, and then the resultant signal is subjected to frequency analysis to detect the thicknesses of layers of the thin film.Type: ApplicationFiled: April 8, 2004Publication date: November 18, 2004Applicant: Mitsubishi Chemical Engineering CorporationInventors: Shigeki Kudou, Kouji Eki, Eita Mure
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Patent number: 6819406Abstract: An aligner which enables a uniform close contact between a photo mask and a printed circuit board is provided. The aligner includes: a photo mask (20) provided with tapered portions (21); a mask holder (2) for supporting the photo mask (20) at the tapered portions; a copy frame (1) for supporting the mask holder (2); a load regulating system (3); and a Z-axis moving system (8) having supporting arms (80) on which the mask holder (2) is placed through the load regulating system (3); and a guide system (4) having a guide shaft (40), so that the photo mask (20) can be moved relative to a printed circuit board (B) while maintaining the position in X and Y directions by the guidance of the guide system (4). The photo mask (20) closely contacts with a printed circuit board (B) by a tare weight of the copy frame (1), mask holder (2), and the photo mask (20), and the contact pressure is regulated by the load regulating system (3).Type: GrantFiled: July 9, 2002Date of Patent: November 16, 2004Assignee: Adtec Engineering Co., Ltd.Inventor: Masatoshi Asami
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Patent number: 6819429Abstract: A polarization independent optical spectrum analyzer comprises an inherently polarization sensitive angle-tuned filter element and polarization-maintaining multi-pass optics for directing a light beam to and fro through the tunable filter element while maintaining its linear state of polarization. The optical spectrum analyzer comprises such a tunable optical filter in combination with a polarization control unit for decomposing a light beam for analysis into first and second beams having mutually orthogonal states of polarization (SOPs) and then adjusting one or both SOPs so that they are parallel to each other and to one of the principal axes of the angle-tuned filter which selects different wavelengths of the first and second light beams. The first and second light beams are passed through the filter repeatedly by multi-pass polarization-maintaining optics.Type: GrantFiled: April 6, 2001Date of Patent: November 16, 2004Assignee: EXFO Electro-Optical Engineering Inc.Inventors: Gang He, Daniel GariƩpy, Gregory Walter Schinn, Martin Lamonde
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Patent number: 6818400Abstract: The present invention aims at producing a biochip by an inkjet system without wasting a DNA solution. A biochip-producing solution is prepared to contain a combination of a DNA solution 6 to be spotted on a plate 5 and a low-cost buffer solution 7 to be remained in the device after the production. The buffer solution 7 used has a different specific gravity from that of the DNA solution 6 and thus is not mixed therewith.Type: GrantFiled: May 3, 2001Date of Patent: November 16, 2004Assignee: Hitachi Software Engineering Co., Ltd.Inventors: Toshiaki Ito, Kenji Yamamoto, Junji Yoshii, Atsumi Tsujimoto, Hisanori Nasu
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Patent number: 6819002Abstract: An under-ball-metallurgy layer between a bonding pad on a chip and a solder bump made with tin-based material is provided. The under-ball-metallurgy layer at least includes an adhesion layer over the bonding pad, a nickel-vanadium layer over the adhesion layer, a wettable layer over the nickel-vanadium layer and a barrier layer over the wettable layer. The barrier layer prevents the penetration of nickel atoms from the nickel-vanadium layer and reacts with tin within the solder bump to form inter-metallic compound. This invention also provides an alternative under-ball-metallurgy layer that at least includes an adhesion layer over the bonding pad, a wettable layer over the adhesion layer and a nickel-vanadium layer over the wettable layer. The nickel within the nickel-vanadium layer may react with tin within the solder bump to form an inter-metallic compound.Type: GrantFiled: August 18, 2003Date of Patent: November 16, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: William Tze-You Chen, Ho-Ming Tong, Chun-Chi Lee, Su Tao, Jeng-Da Wu, Chih-Huang Chang, Po-Jen Cheng
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Patent number: 6818045Abstract: The liquid separator with integral sight glass separates liquids, if present, from gases and allows a technician to visually confirm the presence or absence of liquids in the gas. The present invention is typically used when taking a spot sample from a natural gas pipeline. Spot samples of natural gas are often analyzed by gas chromatographs which do not tolerate the presence of liquids in a sample. If the technician visually confirms the presence of liquids, adjustments to the spot sampling technique can be made to possibly eliminate the creation of such liquids due to poor technique.Type: GrantFiled: November 5, 2002Date of Patent: November 16, 2004Assignee: Welker Engineering CompanyInventor: Brian H. Welker