Abstract: Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

Abstract: Actuators can be used in controlling a seat surface of a vehicle seat. The actuators can have an outer skin in connection with a hinge assemblies. The actuators can include a shape-memory material (SMM) member operatively connected to the hinge assemblies. The SMM member can be a shape-memory alloy (SMA) wire. The SMM member can change from a first configuration to the second configuration in response to an activation input, such as heat. The input can be delivered to the SMM member upon detecting an activation condition, such as detection of lateral acceleration. The actuators are operatively positioned relative to a seat surface such that, when the SMM member changes configuration, actuator causes the seat surface to morph.

Abstract: An active downhole antenna located in a borehole receives electromagnetic (EM) telemetry transmissions from sources in adjacent boreholes. The antenna comprises a processor operable do decode and measure signal to noise ratio of received transmissions. Data received at the active antenna is transmitted to surface using a high-speed data communication network. The active antenna may handle data communications from multiple downhole EM telemetry transmitters.

Abstract: The present invention discloses a SAR radiation-free mobile terminal body, a SAR radiation-free external communication body and a SAR radiation-free mobile terminal. The SAR radiation-free mobile terminal comprises the SAR radiation-free mobile terminal body. The SAR radiation-free external communication body is disposed outside the SAR radiation-free mobile terminal body and is connected with the SAR radiation-free mobile terminal body through optical fibers. The SAR radiation-free external communication body comprises a communication module connecting with a communication base station without affecting the compatibility and normal radiation power of communication equipment; inter-conversion between electric signals and optical signals is realized through a photoelectric conversion module.

Abstract: A semiconductor device package includes a dielectric layer and a stacking conductive structure. The dielectric layer includes a first surface. The stacking conductive structure is disposed on the first surface of the dielectric layer. The stacking conductive structure includes a first conductive layer disposed on the first surface of the dielectric layer, and a second conductive layer stacked on the first conductive layer. A first surface roughness of the first surface of the dielectric layer is larger than a second surface roughness of a top surface of the first conductive layer, and the second surface roughness of the top surface of the first conductive layer is larger than a third surface roughness of a top surface of the second conductive layer.

Abstract: A system for guiding an object using a robot is provided. The system includes a server and a robot. The server is configured to receive a request and a location of an object from a device of the object, instruct a vehicle to move to a first location based on the location of the object in response to receiving the request, obtain information about a second location related to a robot, and transmit information about the second location to the device of the object. The robot is configured to identify the object at the second location, and guide the object from the second location to the first location in response to identifying the object at the second location.

Abstract: A semiconductor device package includes a carrier, a patterned passivation layer and a first patterned conductive layer. The patterned passivation layer is disposed on the carrier. The first patterned conductive layer is disposed on the carrier and surrounded by the patterned passivation layer. The first patterned conductive layer has a first portion and a second portion electrically disconnected from the first portion. The first portion has a first surface adjacent to the carrier and exposed by the patterned passivation layer. The second portion has a first surface adjacent to the carrier exposed by the patterned passivation layer. The first surface of the first portion is in direct contact with an insulation medium.

Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.

Abstract: A hook assembly for mounting to a body component having a pair of openings is provided. The hook assembly includes a pin member and a hook housing. The pin member includes a base portion and a pair of insertion pins extending upwardly from the base portion. The hook housing includes a top surface and a pair of interior channels. A pair of clip prongs are positioned at each opening of the pair of interior channels. A hook member extends outwardly from the hook housing. The hook housing is coupled to the body component by inserting the pair of clip prongs into the openings formed in the body component in a clip prong insertion direction. The pair of insertion pins are inserted into the pair of interior channels in a pin insertion direction to secure the pin member and the hook housing to the body component.

Abstract: The present disclosure relates to a capacitor bank controller that automatically determines the size of a capacitor bank. For example, the capacitor bank controller may obtain voltage and current measurements while the capacitor bank is disconnected from the power line. Further, the capacitor bank controller may obtain voltage and current measurements while the capacitor bank is connected to the power line. The capacitor bank controller may determine the size of the capacitor bank based on impedances from the voltage and current measurements while the capacitor bank is connected and disconnected.

Abstract: A controller for delivering an item is provided. The controller includes one or more processors, one or more memory modules, and machine readable instructions stored in the one or more memory modules. The controller is configured to determine a location or a traveling schedule of a first vehicle and a location of a second device, determine a zone where the first vehicle and the second device are expected to be proximate each other based on traffic information, the location or the traveling schedule of the first vehicle, and the location of the second device, instruct the first vehicle to move to the zone, and instruct the second device to transfer an item to the first vehicle in response to determining that the first vehicle and the second device are proximate each other at the zone.

Abstract: The present disclosure relates to a capacitor bank control system that uses a combination of line post sensors and wireless current sensors for control operations. For example, a capacitor bank controller may include one or more inputs that electrically couple to a line post sensor to allow the capacitor bank controller to obtain line post sensor measurements. The capacitor bank controller may include a transceiver that receives wireless current sensor measurements from first and second wireless current sensors. The capacitor bank controller may include a processor that controls one or more switching devices of a capacitor bank based at least in part on a combination of line post sensor measurements and wireless current sensor measurements.

Abstract: Various embodiments provide a method of simulating a leak in a pipeline. The method includes: receiving a fluid stream from a fluid supply; and outputting the received fluid stream through an outlet such that the received fluid stream hits an outer surface of the pipeline at a location opposite the outlet such that a vibration is caused in the pipeline. Some other embodiments provide a corresponding system for simulating a leak in a pipeline, and a corresponding outlet for coupling a conduit to a pipeline.

Abstract: Systems and methods of chemical process simulation providing improved methods and systems for expressing the composition of a stream in a chemical process model in a manner that is not immediately indicative of the underlying composition, providing for improved accuracy of allocation of a process output stream to the appropriate source(s), avoiding duplication of components or other inaccurate component representations in relation to critical calculations, and improving the operation of a computer or other computing system for performing chemical process modeling and simulation. The systems or methods provide for three distinct layers of interaction, separating mixed species displayed to the user from individual species used in calculations, while providing transformation objects between dataset layers to provide for accurate modeling, calculation, and display.

Abstract: The present disclosure pertains to a line-powered current measurement system to mount to an electrical conductor and related methods. In one embodiment, a system may comprise a current transformer to electrically couple to an electrical conductor and to generate a secondary current proportional to a primary current in the conductor. A power harvesting subsystem may harvest power from the secondary current in a first configuration. A switching subsystem may transition the line-powered current measurement device between the first configuration and a second configuration, in which a current measurement subsystem generates a measurement of the secondary current. The switching subsystem may provide the secondary current to the power harvesting subsystem in the first configuration and may bypasses the power harvesting subsystem in the second configuration. A communication subsystem may transmit the measurement of the secondary current to a receiver device.

Abstract: A semiconductor device package includes a first electronic component, a plurality of first conductive traces, a second electronic component, a plurality of second conductive traces and a plurality of first conductive structures. The first electronic component has a first active surface. The first conductive traces are disposed on and electrically connected to the first active surface. The second electronic component is stacked on the first electronic component. The second electronic component has an inactive surface facing the first active surface, a second active surface opposite the inactive surface, and at least one lateral surface connecting the second active surface and the inactive surface. The second conductive traces are electrically connected to the second active surface, and extending from the second active surface to the lateral surface. The first conductive structures are electrically connecting the second conductive traces to the first conductive traces, respectively.

Abstract: A method and system for conducting a non-contact survey of an overhead crane runway system using a survey apparatus that is alternately located in the crane bay or on a crane bridge girder. Disclosed more particularly are a method and system for testing an overhead crane runway beam 3D alignment or an overhead crane runway rail 3D alignment using a 3D laser scanner.

Abstract: A method of installing a seat belt buckle that includes inserting the seat belt buckle into a rear end of a seat belt opening, such that an engagement slot of the seat belt buckle faces a front end of the seat belt opening. The method further includes engaging the engagement slot of the seat belt buckle with a seat belt tongue of a seat belt buckle installation jig and translating the seat belt buckle from an embedded position within the seat belt opening to an extended position with the seat belt buckle installation jig, wherein the seat belt buckle is nearer to the rear end of the seat belt opening in the embedded position than in the extended position. The seat belt buckle installation jig comprises a body comprising a first distal end and a second distal end, and the seat belt tongue is coupled to the first distal end.

Abstract: A gravity-driven tire delivery apparatus includes a base and a tire delivery chute that extends vertically from the base. The tire delivery chute includes a wall including a braking projection mounted to the wall that extends into a travel path of a tire through the tire delivery chute. The braking projection is sized to allow the tire to pass by the braking projection once the tire is moved laterally by the braking projection.

Abstract: A connector to easily and correctly join an electrical component to a printed circuit board is provided. The connector comprises a generally C-shaped electrically conductive element that provides for connection alternatively to the positive and negative terminals of a device depending on the orientation of the connector. In this way, one connector is made that can be used to alternatively satisfy connection to both positive and negative terminals and thereby simplify the construction of the element. Because of the shapes of the ends of the connector, a device can only be plugged in one way. The connector can be made from a single sheet of electrically conductive material bent generally into a “C” shape, with specific tabs and cuts made therein.