Abstract: A two-speed transmission for an electric vehicle includes a planetary gear set selectively coupling an input shaft and an output shaft. The planetary gear set is configured to provide two forward gear ratios and neutral. The planetary gear set includes at least one sun gear, at least one pinion in meshing engagement with the at least one sun gear, at least one ring gear meshingly engaged with the at least one pinion, and a carrier. The carrier supports the at least one pinion and is connected to the output shaft such that rotation of the carrier drives the output shaft. The two-speed transmission also includes one or more elements that rotatably couple the at least sun gear, the at least one pinion, the at least one ring gear, the input shaft, and the carrier with one another and/or a ground. Examples of such elements include clutches, brakes, and mechanical diodes.

Abstract: Methods for characterizing living plants, wherein one or more beams of penetrating radiation such as x-rays are scanned across the plant under field conditions. Compton scatter is detected from the living plant and processed to derive characteristics of the living plant such as water content, root structure, branch structure, xylem size, fruit size, fruit shape, fruit aggregate volume, cluster size and shape, fruit maturity and an image of a part of the plant. Ground water content is measured using the same technique. Compton backscatter is used to guide a robotic gripper to grasp a portion of the plant such as for harvesting a fruit.

Abstract: A cloaking device with an object-side, an image-side, and a cloaked region is provided. A first object-side converging lens and a second object-side converging lens are positioned on the object-side, and a first image-side converging lens and a second image-side converging lens are positioned on the image-side. A coherent image guide with an object-side end optically aligned with the second object-side converging lens and an image-side end optically aligned with the second image-side converging lens is included. Light from an object positioned on the object-side of the cloaking device is focused in parallel onto the object-side end of the coherent image guide by the first object-side converging lens and the second object-side converging lens, propagates through the coherent image guide, and is focused in parallel by the second image-side converging lens and the first image-side converging lens to form an image of the object on the image-side of the cloaking device.

Abstract: An air pressure regulating device comprises an expansion tank having air stored therein and having an air injection/discharge port at an outside thereof; and a pressure regulation unit provided with a three-way ball valve connected to the air injection/discharge port, a pressure gauge which is installed in any one of flow paths of the three-way ball valve to check an internal pressure of the expansion tank, and a valve core which is installed in a flow path other than the flow path in which the pressure gauge is installed to be capable of injecting or discharging air into or from the expansion tank so as to be capable of controlling the internal pressure of the expansion tank.

Abstract: Detector systems for enhanced radiographic imaging incorporate x-ray CT imaging capabilities. The detector designs employ a layer of detector modules comprised of edge-on or face-on detectors, or a combination of edge-on and face-on detectors, and may employ structured detectors. The detectors can operate in a non-coincidence or coincidence detection mode.

Abstract: A step motor that provides reduced detent torque while maintaining adequate holding torque is characterized by a rotor that includes an annular ring of soft magnetic material (such as medium carbon steel) that surrounds the outer diameter of the rotor permanent magnet and is sandwiched by magnetic insulators of specified axial thickness. This provides a path within the rotor for flux from the permanent magnet in those areas where the radially adjacent stator poles are unenergized, but the magnetic flux can be pulled out by the ampere-turns of energized stator poles.

Abstract: Primary, secondary (1º,2º) alkylethylenediamine- and alkylpropylenediamine-appended variants of metal-organic framework are provided for CO2 capture applications. Increasing the size of the alkyl group on the secondary amine enhances the stability to diamine volatilization from the metal sites. Two-step adsorption/desorption profiles are overcome by minimizing steric interactions between adjacent ammonium carbamate chains. For instance, the isoreticularly expanded framework Mg2(dotpdc) (dotpdc4?=4,4?-dioxido-[1,1?:4?,1?-terphenyl]-3,3?-dicarboxylate), yields diamine-appended adsorbents displaying a single CO2 adsorption step. Further, use of the isomeric framework Mg-IRMOF-74-II or Mg2(pc-dobpdc) (pc-dobpdc4?=3,3-dioxidobiphenyl-4,4-dicarboxylate, pc=para-carboxylate) also leads to a single CO2 adsorption step with bulky diamines.

Abstract: A substrate structure includes a chip attach area and an upper side rail surrounding the chip attach area. The upper side rail includes an upper stress relief structure and an upper reinforcing structure. The upper stress relief structure surrounds the upper chip attach area. The upper reinforcing structure surrounds the upper stress relief structure. A stress relieving ability of the upper stress relief structure is greater than a stress relieving ability of the upper reinforcing structure. A structural strength of the upper reinforcing structure is greater than a structural strength of the upper stress relief structure.

Abstract: A lead frame includes a die pad having a pad top surface and a pad bottom surface opposite to the top pad surface, a plurality of leads, each having a top lead surface and a bottom lead surface opposite to the top lead surface and disposed around the die pad, and a first molding compound disposed between the die pad and each of the leads. The first molding compound exposes the top pad surface of the die pad by covering a portion of the periphery of the top pad surface of the die pad. A method for manufacturing the lead frame is also disclosed.

Abstract: The present disclosure relates to controlling a capacitor bank using current measurements from different current sensors depending on the power flow direction. For example, the system may perform capacitor bank control operations using current measurements from a first current sensor coupled to the power line between an initial source and the capacitor bank when power is flowing in a first power flow direction on the power line. The system may determine that power flow on the power line has changed from flowing in the first power flow direction to flowing in a second power flow direction from an updated source, different from the initial source. The system may, upon detecting the change in the power flow direction perform control operations of the capacitor bank using current measurements from a second current sensor between an updated source and the capacitor bank.

Abstract: A semiconductor device package includes a circuit layer and a first antenna structure. The circuit layer includes a first surface, and a second surface opposite to the first surface. The first antenna structure is disposed on the first surface and electrically connected to the circuit layer. The first antenna structure includes a first patch, a second patch, a third patch, a first dielectric layer and a second dielectric layer. The second patch is disposed on the first patch. The first dielectric layer has a first dielectric constant (Dk), and is disposed between the first patch and the second patch. The third patch is disposed on the second patch. The second dielectric layer has a second dielectric constant and is disposed between the second patch and the third patch. The first dielectric constant is smaller than the second dielectric constant.

Abstract: A device control system includes a control request issuing unit for issuing a control request defining a position of a moving object and the device control according to operation of a user; a determination plan generation unit configured to, based on the control request, generating a condition; a determination unit for determining whether a condition of the control request related to the moving object is satisfied and issuing an identifier of the control request; at least one condition determination generated by the determination plan generation unit; an execution plan generation unit for generating a control execution unit configured to receive the identifier of the control request, identifying a device that is a control target according to a control rule defined in the control request, and transferring a control command according to a control procedure, and one or a plurality of control execution units generated by the execution plan generation unit.

Abstract: A power amplifier circuit includes a current generator and a current mirror driver. The current generator has a first input connected to a first voltage supply and an output configured to generate a first current. The current generator includes a first transistor, a second transistor, a first resistor and a second resistor. The first transistor has an emitter connected to ground. The second transistor has a base connected to a base of the first transistor and an emitter connected to ground. The first resistor is connected between the first voltage supply and a collector of the first transistor. The second resistor is connected between the first voltage supply and a collector of the second transistor. The current mirror drive has a first input connected to the output of the current generator to receive the first current and an output configured to generate a second current.

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A plant according to an embodiment includes a gas turbine; a heat recovery unit that includes a primary heat recovery steam generator in which a primary heat exchanging unit generates primary steam by exchanging heat that is the thermal energy of the flue gas from the gas turbine, and a secondary heat recovery steam generator that is installed independently from the primary heat exchanging unit, and in which a secondary heat exchanging unit generates secondary steam by exchanging heat that is the thermal energy of the flue gas partly having exchanged heat in the primary heat exchanging unit included in the primary heat recovery steam generator; a primary steam turbine; a CO2 recovery unit; and a first reboiler heat supply line.

Abstract: A semiconductor package structure includes a semiconductor die surface having a narrower pitch region and a wider pitch region adjacent to the narrower pitch region, a plurality of first type conductive pillars in the narrower pith region, each of the first type conductive pillars having a copper-copper interface, and a plurality of second type conductive pillars in the wider pitch region, each of the second type conductive pillars having a copper-solder interface. A method for manufacturing the semiconductor package structure described herein is also disclosed.

Abstract: A semiconductor device package and a method for packaging the same are provided. A semiconductor device package includes a carrier, an electronic component, a buffer layer, a reinforced structure, and an encapsulant. The electronic component is disposed over the carrier and has an active area. The buffer layer is disposed on the active area of the electronic component. The reinforced structure is disposed on the buffer layer. The encapsulant encapsulates the carrier, the electronic component and the reinforced structure.

Abstract: A semiconductor package may include a substrate; a microelectromechanical device disposed on the substrate; an interconnection structure connecting the substrate to the microelectromechanical device; and a metallic sealing structure surrounding the interconnection structure.

Abstract: A semiconductor device package includes a substrate, a semiconductor device and an encapsulant. The substrate includes a passivation layer, a first conductive layer and a barrier layer. The passivation layer has a substantially vertical sidewall. The first conductive layer is disposed on the passivation layer. The barrier layer is disposed on the passivation layer and the first conductive layer. The barrier layer includes a substantially slant sidewall.

Abstract: A technology is for writing different information depending on an object into an electronic tag. The above problem is solved by an electronic tag writing system including a writing device that writes write information into an electronic tag, and an information acquisition section that acquires write information related to an object associated with the electronic tag, in which the write information acquired by the information acquisition section is written into the electronic tag using the writing device.