Patents Assigned to Engineering
  • Systems and methods for determining engine start time during predicted acceleration events
    Patent number: 10946852
    Abstract: A method may include predicting an acceleration event of a vehicle. The method may further include predicting a maximum speed of the predicted acceleration event. The method may also include determining an engine start time based on the predicted maximum speed. The method may still further include starting an engine of the vehicle at the engine start time.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: March 16, 2021
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Colorado State University Research Foundation
    Inventors: Joshua Payne, Heraldo Stefanon, Benjamin Geller, Takanori Aoki, Thomas Bradley, Zachary Asher, David Trinko
  • Vehicular body structural arrangements
    Patent number: 10946905
    Abstract: A vehicle includes a frame rail, a crossbeam resting atop the frame rail, a deck panel resting atop the crossbeam, an adaptor resting inside the crossbeam, and a fastener extending from atop the adaptor to the frame rail through the adaptor and the crossbeam. The deck panel includes an aperture and a bordering area around the aperture. The adaptor rises through the aperture and overtop the bordering area. The fastener overhangs the bordering area and is engaged with the adaptor overtop the bordering area, and is secured to the frame rail. The fastener thereby secures the adaptor to the frame rail against the crossbeam without tightening against the deck panel at the bordering area.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: March 16, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Matthew A. Jansma, Christopher M. Higgins
  • Method for operating a haptic operating device and for operating electronic equipment with the haptic operating device
    Patent number: 10948031
    Abstract: Electronic devices, such as consumer electronics devices and control systems in vehicles are controlled by way of a haptic operating device with a rotating unit. Selectable menu items are displayed on a display unit, and a menu item is selected by rotating the rotating unit. The rotating unit latches at a number of haptically perceptible latching points during rotation. The number and rotational position of the haptically perceptible latching points is dynamically changed in accordance with a specific menu item selected by the user.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: March 16, 2021
    Assignee: INVENTUS Engineering GmbH
    Inventor: Stefan Battlogg
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210076510
    Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
  • PARTIALLY-AUTONOMOUS ROAD VEHICLE CONTROL VIA A SINGLE-EXTREMITY INTERFACE
    Publication number: 20210070301
    Abstract: Methods and systems may provide for technology to control a road vehicle in a partially-autonomous mode along a default path and change a speed of the road vehicle in response to a first actuation event. The technology may also automatically deviate the road vehicle from a current lane on the default path in response to a second actuation event if a distance condition is satisfied with response to one or more of a future lane change or a future turn on the default path, wherein the first actuation event and the second actuation event are associated with a single-extremity user operation.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 11, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Vladimeros Vladimerou, Miles J. Johnson
  • SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20210074669
    Abstract: A semiconductor device package includes a connection structure having a first portion and a second portion extending from the first portion, the second portion having a width less than the first portion; and a dielectric layer surrounding the connection structure, wherein the dielectric layer and the second portion of the connection structure defines a space.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shun-Tsat TU, Pei-Jen LO, Fong Ren SIE, Cheng-En WENG, Min Lung HUANG
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210074664
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: September 9, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20210074676
    Abstract: A semiconductor device package includes a first conductive layer, a second conductive layer and a third conductive layer. The first conductive layer has a first pitch. The second conductive layer has a second pitch and is arranged at two different sides of the first conductive layer. The third conductive layer has a third pitch and is disposed above the first conductive layer and the second conductive layer. The third conductive layer is electrically connected to the first conductive layer. The first pitch is smaller than the third pitch, and the third pitch is smaller than the second pitch.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 11, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tang-Yuan CHEN, Meng-Kai SHIH, Teck-Chong LEE, Shin-Luh TARNG, Chih-Pin HUNG
  • INLINE TOOL HOLDERS
    Publication number: 20210069840
    Abstract: An inline tool holder including a shaft collar, a mounting plate, a first enclosure, and a second enclosure. The mounting plate is concentrically arranged around the shaft collar and includes a first surface, a second surface, and an attachment mechanism. The first enclosure is removably coupled to the first surface of the mounting plate and the second enclosure is removably coupled to the second surface of the mounting plate. The attachment mechanism of the mounting plate extends radially beyond an outer edge of both the first enclosure and the second enclosure.
    Type: Application
    Filed: September 5, 2019
    Publication date: March 11, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: David A. Britton, Charlie H. Reynolds
  • Vibration isolator with a vertically effective pneumatic spring
    Patent number: 10941833
    Abstract: A vibration isolator with a pneumatic spring that is effective only in vertical direction, the pneumatic spring including a working space in which a vertically effective actuator is disposed.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 9, 2021
    Assignee: Integrated Dynamics Engineering GmbH
    Inventors: Arndt Evers, Frank Hofmann
  • Integrated circuit authentication from a die material measurement
    Patent number: 10942215
    Abstract: The various technologies presented herein relate to measuring a signal generated by a die-based test circuit incorporated into an IC and utilizing the measured signal to authenticate the IC. The signal can be based upon a sensor response generated by the test circuit fabricated into the die, wherein the sensor response is based upon a property of the die material. The signal can be compared with a reference value obtained from one or more test circuit(s) respectively located on one or more reference dies, wherein the reference dies are respectively cut from different wafers, and the location at which the reference dies were cut is known. If the measured signal matches the reference value, the die is deemed to be from the same cut location as the dies from which the reference value was obtained. If the measured signal does not match the reference value, the die is not authenticated.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: March 9, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventors: William A. Zortman, Ryan Helinski, Jason Hamlet
  • Haptic operating device and method
    Patent number: 10942538
    Abstract: A haptic operating device has a base, a stationary central part connected thereto, a rotary knob which can be rotated about the stationary central part and which has a hollow design, and a magnetorheological transmission device for influencing the rotational movement of the rotary knob in a controlled manner. The transmission device has two components which can be rotated relative to each other and one component of which is designed as a brake component that can be rotated relative to the base. The stationary central part is secured to the base by way of a support arm. The transmission device and the support arm are adjacent one another and both are received radially within the rotary knob. The rotary knob is rotationally fixed to the rotatable brake component via a coupling device.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: March 9, 2021
    Assignee: INVENTUS Engineering GmbH
    Inventor: Stefan Battlogg
  • Cooling systems comprising fluid diodes with variable diodicity for two-phase flow control
    Patent number: 10945354
    Abstract: A microchannel two-phase cooling apparatus includes a cooling manifold and a fluid diode array. The cooling manifold includes one or more fluid inlets, one or more fluid outlets, and a plurality of fluid channels extending between and fluidly coupling the one or more fluid inlets and the one or more fluid outlets. The fluid diode array includes a plurality of fluid diodes positioned within the cooling manifold. Individual fluid diodes of the fluid diode array are fluidly coupled to individual fluid channels. The fluid diode array includes a first set of fluid diodes having a first average diodicity and a second set of fluid diodes having a second average diodicity. The first average diodicity is greater than the second average diodicity and each individual fluid diode of the first set of fluid diodes has a greater diodicity than any individual fluid diode of the second set of fluid diodes.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: March 9, 2021
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventor: Ercan Mehmet Dede
  • System and method for the prediction of leakage in a pipeline
    Patent number: 10942083
    Abstract: This invention relates to a method for assessing the condition of at least a portion of a pipeline to predict the possibility of occurrence of leakage from the pipeline. The method includes the steps of identifying at least one portion of the pipeline to be assessed, undertaking an assessment of the wall of the portion to identify defects located thereon and the assessment includes identifying the depth, width and length of identified defects and including reference to a value for the pressure of the fluid passing through the pipeline portion. This allows the condition of the pipeline at the portions of the same which are most critical to be identified and this is used to provide an indication of the pipeline as a whole without the need to investigate the entire pipeline.
    Type: Grant
    Filed: May 25, 2016
    Date of Patent: March 9, 2021
    Assignee: Advanced Engineering Solutions Ltd
    Inventors: Malcolm Wayman, Richard J. Treece
  • Single piece expansion sealing plug
    Patent number: 10940661
    Abstract: A single piece expansion plug and method of using the same in connection with a tool is provided. The plug has an inner recess extending partially into a top of the plug, the inner recess defining a tapered inner wall. The plug is installed with a tool having a tapered end at a greater angle with respect to the taper inner wall. The tool presses against the tapered inner wall to expand the plug against a hole. The tool includes a pin that retracts against a spring to seat the plug in the hole to be sealed such that the pin contacts the plug prior to the tapered inner wall and tapered end coming into contact.
    Type: Grant
    Filed: June 1, 2020
    Date of Patent: March 9, 2021
    Assignee: Engineered Inserts & Systems, Inc.
    Inventors: Victor Kirilichin, David P. Turechek
  • Central alarm station interface for situation awareness
    Patent number: 10943467
    Abstract: A method for analyzing security alarms is provided. The method comprising receiving alarm data from a number of security sensors generating alarms, wherein the alarm data includes spatio-temporal data regarding where and when an alarm is triggered. The alarm data is displayed on a user interface. The alarm data is analyzed for spatio-temporal relationships among the alarms according to a number of pattern recognition algorithms. The alarms are identified as genuine alarms if a discernable pattern is recognized among the alarms.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: March 9, 2021
    Assignee: National Technology & Engineering Solutions of Sandia, LLC
    Inventor: Ann E. Speed
  • Modular underdrain systems
    Patent number: 10941050
    Abstract: A modular underdrain system is disclosed. The modular underdrain system may comprise an intermediate modular component having a first peripheral side including a first mating portion and a second peripheral side including a second mating portion. The second mating portion may be sized and shaped to engage with a first mating portion of an adjacent modular component. A modular component chamber may be bounded by an underdrain floor side and an internal side. The underdrain floor side may comprise a plurality of slots. The metering pipe is sized to be positioned within a metering pipe opening in the internal side with a distributor head positioned within the modular component chamber. The metering pipe may comprise a set of one or more remote orifices and a set of one or more proximate orifices.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: March 9, 2021
    Assignee: WesTech Engineering, Inc.
    Inventors: Rand S Faaborg, Clifford Dale Barber, Darrell Wayne Christianson, Brian Leo Brink, Scott Allen Pallwitz, Chad Allen Carpenter
  • Cellulase complex, and glycosidase hydrolases thereof, and methods of using thereof
    Patent number: 10941388
    Abstract: The present invention provides for a purified or isolated cellulase complex comprising two or more glycosidase hydrolase, or enzymatically active fragment thereof, selected from the group consisting of a GH9 polypeptide, a GH48 polypeptide, a GH10 polypeptide, and a GH6 polypeptide, and optionally a GH10_2 polypeptide and/or an AA10 polypeptide.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: March 9, 2021
    Assignees: The Regents of the University of California, National Technology & Engineering Solutions of Sandia, LLC
    Inventors: Steven W. Singer, Sebastian D. Kolinko, Evelyn Denzel, Jennifer Hiras, John M. Gladden
  • Door component comprising a controllable damping system
    Patent number: 10941601
    Abstract: A method for damping a movement of a door system of a vehicle that is equipped with a damping system having an adjustable and controllable damping action. A movement of the door system between a closed position and an open position is damped in a controlled manner. A measurement of the change in speed of the speed of movement of the door system is calculated and if the change in speed exceeds a predefined limit value, a set, gentle damping action is changed over to a greater damping action.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: March 9, 2021
    Assignee: INVENTUS Engineering GmbH
    Inventors: Stefan Battlogg, Markus Mayer
  • Electrical equipment diagnostic systems
    Patent number: 10942211
    Abstract: An electrical equipment diagnostic system can include an electrical equipment and a sensor device controlled by a user that takes a first measurement of a first parameter of the electrical equipment while the electrical equipment is operating. The system can also include a controller communicably coupled to the sensor device, where the controller includes a storage repository, where the storage repository includes at least one threshold value and at least one algorithm. The controller can receive the first measurement from the sensor device, and process the at least one first algorithm using the first measurement. The controller can also identify a problem with the electrical equipment based on results of the at least one first algorithm, and instruct the user to perform specific tasks to correct the problem with the electrical equipment.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: March 9, 2021
    Assignee: Bowtie Engineering
    Inventors: John Welch, Cason Rogers