Patents Assigned to Enthone Inc.
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Patent number: 7998859Abstract: A method is disclosed for metallizing a substrate comprising an interconnect feature in the manufacture of a microelectronic device, wherein the interconnect feature comprises a bottom, a sidewall, and a top opening having a diameter, D. The method comprises the following steps: depositing a barrier layer on the bottom and the sidewall of the interconnect feature, the barrier layer comprising a metal selected from the group consisting of ruthenium, tungsten, tantalum, titanium, iridium, rhodium, and combinations thereof; contacting the substrate comprising the interconnect feature comprising the bottom and sidewall having the barrier layer thereon with an aqueous composition comprising a reducing agent and a surfactant; and depositing copper metal onto the bottom and the sidewall of the interconnect feature having the barrier layer thereon.Type: GrantFiled: September 25, 2008Date of Patent: August 16, 2011Assignee: Enthone Inc.Inventors: Qingyun Chen, Xuan Lin, Vincent Paneccasio, Jr., Richard Hurtubise, Joseph A. Abys
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Publication number: 20110192638Abstract: A process used during manufacture of printed circuit boards comprises protecting metal pads and/or through-holes to provide a tarnish-resistant and solderable coating. In the method, the pads and/or through-holes are bright-etched, metal plated, preferably by an immersion process, and treated with a tarnish inhibitor. The tarnish inhibitor may be incorporated into the immersion plating bath. The metal plating is usually with silver or bismuth and the pads and/or through-holes comprise copper.Type: ApplicationFiled: April 22, 2011Publication date: August 11, 2011Applicant: ENTHONE INC.Inventors: Andrew McIntosh Soutar, Peter Thomas McGrath
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Publication number: 20110180415Abstract: A cyanide-free electrolyte composition for the galvanic deposition of a copper layer on substrate surfaces and a method for the deposition of such layers. The electrolyte composition comprises at least copper(II) ions, a hydantoin and/or hydantoin derivative, a di- and/or tricarboxylic acid or salts thereof, and a metalate of an element of the group consisting of molybdenum, tungsten and vanadium and/or a cerium compound.Type: ApplicationFiled: July 15, 2009Publication date: July 28, 2011Applicant: ENTHONE INC.Inventor: Stefan Schäfer
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Patent number: 7972655Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.Type: GrantFiled: November 21, 2007Date of Patent: July 5, 2011Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Patent number: 7968455Abstract: A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper.Type: GrantFiled: October 17, 2007Date of Patent: June 28, 2011Assignee: Enthone Inc.Inventors: Xuan Lin, Richard Hurtubise, Vincent Paneccasio, Qingyun Chen
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Publication number: 20110140035Abstract: A pickling solution for the surface pre-treatment of plastic surfaces in preparation for metallization, the solution comprising a source of Mn(VII) ions; and an inorganic acid; wherein the pickling solution is substantially free of chromium (VI) ions, alkali ions, and alkaline-earth ions.Type: ApplicationFiled: August 11, 2008Publication date: June 16, 2011Applicant: ENTHONE INC.Inventors: Mark Peter Schildmann, Ulrich Prinz, Christoph Werner
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Publication number: 20110097597Abstract: A method is provided for depositing a whisker resistant tin-based coating layer on a surface of a copper substrate. The method is useful for preparing an article comprising a copper substrate having a surface; and a tin-based coating layer on the surface of the substrate, wherein the tin-based coating layer has a thickness between 0.5 micrometers and 1.5 micrometers and has a resistance to formation of copper-tin intermetallics, wherein said resistance to formation of copper-tin intermetallics is characterized in that, upon exposure of the article to at least seven heating and cooling cycles in which each cycle comprises subjecting the article to a temperature of at least 217° C. followed by cooling to a temperature between about 20° C. and about 28° C., there remains a region of the tin coating layer that is free of copper that is at least 0.25 micrometers thick.Type: ApplicationFiled: October 28, 2009Publication date: April 28, 2011Applicant: ENTHONE INC.Inventors: Yung-Herng Yau, Xingping Wang, Cai Wang, Robert Farrell, Pingping Ye, Edward J. Kudrak, JR., Karl F. Wengenroth, Joseph A. Abys
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Patent number: 7883738Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an aromatic heterocycle comprising nitrogen; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: GrantFiled: April 18, 2007Date of Patent: February 8, 2011Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, Jr.
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Publication number: 20100319572Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.Type: ApplicationFiled: June 18, 2008Publication date: December 23, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Edward J. Kudrak, JR., Katrin Zschintzsch, Theodore Antonellis
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Patent number: 7846316Abstract: Method and plating bath apparatus for setting the ionic strength of a plating composition using Donnan dialysis by flowing the plating composition along a first surface of a membrane while simultaneously flowing a deposition metal ion exchange composition along a second surface of the membrane such that the deposition metal ion crosses the membrane from the deposition metal ion exchange composition to the plating composition while an exchange cation different from the deposition metal ion crosses the membrane from the plating composition to the deposition metal ion exchange composition.Type: GrantFiled: May 25, 2006Date of Patent: December 7, 2010Assignee: Enthone Inc.Inventors: Axel Koenig, Andreas Möbius, Franz-Josef Stark
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Patent number: 7846503Abstract: The invention concerns an electrolyte for electroless deposition of metal layers with internal compressive stresses containing a metal base salt, a reducing agent, a complexing agent, an accelerator and a stabilizer. In order to make available an electrolyte of the said kind, from which uniform pore-free and crack-free metal-phosphorus coatings can be deposited with constant layers properties and high phosphorus contents at an elevated deposition rate over a long period of time, it is proposed by means of the invention that the electrolyte contain as metal base salt a metal salt whose anions contain at least one carbon atom and that is present in a starting concentration from 0.01 to 0.3 mol/L. At least one salt consisting of metal acetate, metal formate, metal oxalate, metal propionate, metal citrate and metal ascorbate, especially preferably metal acetate, is used as the metal salt whose anion contains at least one carbon atom.Type: GrantFiled: October 3, 2003Date of Patent: December 7, 2010Assignee: Enthone Inc.Inventors: Franz-Josef Stark, Helmut Horsthemke, Ulrich Treuner
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Publication number: 20100294669Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.Type: ApplicationFiled: December 10, 2008Publication date: November 25, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Edward J. Kudrak, JR., Jingye Li, Chen Xu, Chonglun Fan
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Publication number: 20100291303Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.Type: ApplicationFiled: November 21, 2007Publication date: November 18, 2010Applicant: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun, Theodore Antonellis
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Publication number: 20100285660Abstract: A method for plating copper onto a semiconductor integrated circuit device substrate by forming an initial metal deposit in the feature which has a profile comprising metal on the bottom of the feature and a segment of the sidewalls having essentially no metal thereon, electrolessly depositing copper onto the initial metal deposit to fill the feature with copper. A method for plating copper onto a semiconductor integrated circuit device substrate by forming a deposit comprising a copper wettable metal in the feature, forming a copper-based deposit on the top-field surface, and depositing copper onto the deposit comprising the copper wettable metal to fill the feature with copper.Type: ApplicationFiled: October 17, 2007Publication date: November 11, 2010Applicant: ENTHONE INC.Inventors: Xuan Lin, Richard Hurtubise, Vincent Paneccasio, JR., Qingyun Chen
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Patent number: 7815785Abstract: The present invention relates to an improved method for the direct metallization of non-conductive substrate surfaces, in particular polyimide surfaces, that is characterized by the process steps of etching the substrate surface with an acidic etching solution that contains peroxide; contacting the etched substrate surface with an acidic treatment solution that contains permanganate; activating the treated substrate surface in an acidic activation solution that contains peroxide; contacting the activated substrate surface with an acidic catalytic solution that contains at least a thiophene derivate and at least a sulfonic acid derivate; metallization of the thus treated substrate surface in an acidic galvanic metallization bath.Type: GrantFiled: May 31, 2007Date of Patent: October 19, 2010Assignee: Enthone Inc.Inventors: Walter Kronenberg, Jürgen Hupe
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Patent number: 7815786Abstract: An electrolytic plating method and composition for electrolytically plating Cu onto a semiconductor integrated circuit substrate having submicron-sized interconnect features. The composition comprises a source of Cu ions and a suppressor compound comprising polyether groups. The method involves superfilling by rapid bottom-up deposition at a superfill speed by which Cu deposition in a vertical direction from the bottoms of the features to the top openings of the features is substantially greater than Cu deposition on the side walls.Type: GrantFiled: August 28, 2007Date of Patent: October 19, 2010Assignee: Enthone Inc.Inventors: Vincent Paneccasio, Jr., Xuan Lin, Paul Figura, Richard Hurtubise
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Patent number: 7794531Abstract: An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.Type: GrantFiled: January 8, 2007Date of Patent: September 14, 2010Assignee: Enthone Inc.Inventors: Joseph A. Abys, Shenliang Sun
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Publication number: 20100151263Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a device comprising a copper or copper alloy substrate and at least one metal-based layer on a surface of the substrate. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; an organic compound comprising a nitrogen-containing functional group; and a solvent having a surface tension less than about 50 dynes/cm as measured at 25° C.Type: ApplicationFiled: April 18, 2008Publication date: June 17, 2010Applicant: ENTHONE INC.Inventors: Joseph A. Abys, Shenliang Sun, Chonglun Fan, Edward J. Kudrak, JR., Cai Wang
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Publication number: 20100126872Abstract: A method for metallizing a via feature in a semiconductor integrated circuit device substrate, wherein the semiconductor integrated circuit device substrate comprises a front surface, a back surface, and the via feature and wherein the via feature comprises an opening in the front surface of the substrate, a sidewall extending from the front surface of the substrate inward, and a bottom. The method comprises contacting the semiconductor integrated circuit device substrate with an electrolytic copper deposition chemistry comprising (a) a source of copper ions and (b) a leveler compound, wherein the leveler compound is a reaction product of a dipyridyl compound and an alkylating agent; and supplying electrical current to the electrolytic deposition chemistry to deposit copper metal onto the bottom and sidewall of the via feature, thereby yielding a copper filled via feature.Type: ApplicationFiled: November 26, 2008Publication date: May 27, 2010Applicant: ENTHONE, INC.Inventors: Vincent Paneccasio, JR., Xuan Lin, Richard Hurtubise, Qingyun Chen
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Publication number: 20100116677Abstract: The preceding invention concerns a galvanic bath as well as a method for depositing a zinc-bearing layer onto a substrate surface. According to the invention, it is provided that the galvanic bath be divided into at least two cell chambers, in which the division occurs by means of a cation-exchange membrane and one cell chamber includes an acidic deposition-electrolyte and the other cell chamber includes a neutral or acidic anolyte. The acidic anolyte here is at least partially removed from the cell chamber containing it and is stripped of the foreign metal ions contained in it by means of a cation-exchange arrangement.Type: ApplicationFiled: November 12, 2009Publication date: May 13, 2010Applicant: ENTHONE INC.Inventor: Axel Fuhrmann