Patents Assigned to GEM Service, Inc.
  • Space-efficient package for laterally conducting device
    Publication number: 20040173881
    Abstract: Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond wire from the ground contact of the device. The supplemental diepad portion may occupy area at the end or side of the package formerly occupied by non-integral leads. By receiving the substrate downbond wire, the supplemental diepad portion allows a greater area of the main diepad to be occupied by a die having a larger area, thereby enhancing space efficiency of the package.
    Type: Application
    Filed: December 12, 2003
    Publication date: September 9, 2004
    Applicant: GEM Services, Inc.
    Inventors: James Harnden, Allen K. Lam, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D505121
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: May 17, 2005
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
  • Portion of a matrix for surface mount package leadframe
    Patent number: D505122
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: May 17, 2005
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
  • Surface mount package
    Patent number: D471165
    Type: Grant
    Filed: May 15, 2001
    Date of Patent: March 4, 2003
    Assignee: GEM Services, Inc.
    Inventors: Richard K. Williams, James Harnden, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D483336
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 9, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D483337
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: December 9, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484103
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: December 23, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484104
    Type: Grant
    Filed: November 25, 2002
    Date of Patent: December 23, 2003
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484858
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: January 6, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D484859
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: January 6, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D485243
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: January 13, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D485244
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: January 13, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D485808
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: January 27, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
  • Portion of a matrix for surface mount package leadframe
    Patent number: D486802
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: February 17, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D487431
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: March 9, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
  • Portion of a matrix for surface mount package leadframe
    Patent number: D487432
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: March 9, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D488136
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: April 6, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing, Allen K. Lam
  • Portion of a matrix for surface mount package leadframe
    Patent number: D491900
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: June 22, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D492266
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: June 29, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing
  • Portion of a matrix for surface mount package leadframe
    Patent number: D494939
    Type: Grant
    Filed: December 17, 2002
    Date of Patent: August 24, 2004
    Assignee: GEM Services, Inc.
    Inventors: James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing