Portion of a matrix for surface mount package leadframe

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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframes showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframes showing my new design.

Claims

The ornamental design for portion of a matrix for surface mount package leadframe, as shown and described.

Referenced Cited
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Patent History
Patent number: D505121
Type: Grant
Filed: Jan 3, 2003
Date of Patent: May 17, 2005
Assignee: GEM Services, Inc. (San Jose, CA)
Inventors: James Harnden (Hollister, CA), Richard K. Williams (Cupertino, CA), Anthony Chia (Bedok North Ave. 2), Chu Weibing (Shanghai), Allen K. Lam (Fremont, CA)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney: Townsend and Townsend and Crew LLP
Application Number: 29/173,648