Patents Assigned to Genesis
  • Publication number: 20070113991
    Abstract: A barrier for a robotic work station is provided and includes a pair of upright posts, and rigid panels which are movable between a lower open position and a raised closed position. The panels are simultaneously moved between the raised and lower positions by a pneumatic cylinder and a pulley system. The movable panels are cantilevered from one of the posts, and include rollers for movement within a channel in the post. A fixed panel is provided at the bottom of the posts and extends approximately to the top of the work station table.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 24, 2007
    Applicant: GENESIS SYSTEMS GROUP, LLC
    Inventors: Jan Mangelsen, Terry Daggett, Michael Skahill
  • Patent number: 7222037
    Abstract: A method of automatic gain control in both analog and digital domain is performed by receiving an incoming analog signal, determining an overall gain factor, determining a coarse analog gain control value and a fine digital gain control value, each of which, when taken together substantially equals the already determined overall gain factor, modifying the incoming analog signal using the coarse analog gain control value to form a coarsely adjusted digital signal, digitizing the coarsely adjusted digital signal, and using the fine digital gain control value to process the coarsely adjusted digital signal to form an outgoing digital signal, wherein the outgoing digital signal has been modified in both the analog domain and subsequently in the digital domain to achieve an appropriate signal to noise ratio.
    Type: Grant
    Filed: August 10, 2005
    Date of Patent: May 22, 2007
    Assignee: Genesis Microchip Inc.
    Inventors: Venkat Chary Mushirahad, Sujan Thomas, Rajanatha Shettigara
  • Publication number: 20070110752
    Abstract: Isolated fibroblast growth factor receptor 5 (FGFR5) polypeptides are provided, together with polynucleotides encoding such polypeptides. Also provided are modulators of FGFR5 gene expression and binding molecules that specifically bind to, and agonize or antagonize, FGFR5 polypeptide finction. Binding molecules include antibodies, and functional fragments thereof, as well as scFv and Camelidae heavy chain IgG that specifically bind to FGFR5 thereby modulating the activity of FGFR5. Such binding agents and modulators of FGFR5 gene expression may be employed for the treatment of disorders including: osteopontin-mediated diseases; autoimmune diseases, such as systemic lupus erythematosus; bone disorders such as osteoporosis and osteopetrosis; and cancers, including cellular carcinomas such as hepatocellular carcinomas.
    Type: Application
    Filed: November 1, 2006
    Publication date: May 17, 2007
    Applicant: Genesis Research and Development Corporation Limited
    Inventors: J. Murison, Zhihui Cao
  • Patent number: 7217959
    Abstract: A single-chip white light emitting device, including: a substrate, a buffer layer, a first conductive cladding layer, a second conductive cladding layer, at least one broad-spectrum blue-complimentary light quantum dot emitting layer and at least one blue light emitting layer. The buffer layer is disposed over the substrate. The first conductive cladding layer is disposed over the buffer layer. The broad-spectrum blue-complimentary light quantum dot emitting layer is disposed between the first conductive cladding layer and the second conductive cladding layer. The blue-complimentary light quantum dot emitting layer includes plural quantum dots with an uneven character distribution, so as to increase FWHM of emission wavelength of the quantum dot emitting layer. The blue light emitting layers is disposed between the first and second conductive cladding layers, such that mixing of blue light and blue-complimentary light would generate white light.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: May 15, 2007
    Assignee: Genesis Photonics Inc.
    Inventor: Cheng Chuan Chen
  • Patent number: 7216575
    Abstract: A blade stabilizer device for a heavy-duty material handling demolition tool for shearing and crushing scrap material which includes a lower jaw connected to the boom structure of a hydraulic system of an excavator has an upper jaw pivotally connected to and closable upon the lower jaw at a pivot point. The blade stabilizing device consists of a wear guide pad supported by the lower jaw adjacent the pivot point slidably engaging the movable upper jaw to keep the upper jaw in close engagement with the lower jaw. The wear guide pad is mounted behind the pivot point. A second wear guide pad may be mounted in front of the pivot point on the opposite side of the upper jaw to cross-brace the upper jaw.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: May 15, 2007
    Assignee: Genesis Attachments, LLC
    Inventors: Timothy L. Alseth, Bruce E. Bacon, Ross D. Christenson
  • Patent number: 7216213
    Abstract: A processor having a limited amount of local memory for storing code and/or data utilizes a program stored in external memory. The program stored in external memory is configured into blocks which can be loaded individually into the local memory for execution. Queuing the individual blocks of code allows the program to be executed by the processor and also facilitates loading of the subsequent code to be executed. A semaphore system can be utilized to indicate which blocks of local memory are available/unavailable. A group of transfer parameters as queue entries allow code and data for an algorithm to be transferred between both local and external memory.
    Type: Grant
    Filed: November 24, 2003
    Date of Patent: May 8, 2007
    Assignee: Genesis Microchip Inc.
    Inventor: Richard K. Greicar
  • Publication number: 20070087531
    Abstract: Embodiments in accordance with the present invention relate to methods and apparatuses for bonding together substrates in a manner that suppresses the formation of voids between them. In a specific embodiment, a backside of each substrate is adhered to a front area of flexible, porous chuck having a rear area in pneumatic communication with a vacuum. Application of the vacuum causes the chuck and the associated substrate to slightly bend. Owing to this bending, physical contact between local portions on the front side of the flexed substrates may be initiated, while maintaining other portions on front side of the substrates substantially free from contact with each other. A bond wave is formed and maintained at a determined velocity to form a continuous interface joining the front sides of the substrates, without formation of voids therebetween.
    Type: Application
    Filed: October 13, 2006
    Publication date: April 19, 2007
    Applicant: Silicon Genesis Corporation
    Inventors: Harry Kirk, Francois Henley, Philip Ong
  • Patent number: 7206344
    Abstract: A method and apparatus for displaying different presentations of program material allows various presentations of a DVD movie, for example, to be displayed on a display for a user's selection. The various presentations might involve different angles from which a user must select or different chapters from which a program should begin. The selection of a presentation is facilitated by displaying the various options on a single display such that the user can quickly choose which presentation to choose. Furthermore, audio is provided with chapter presentations to assist a user in selecting a chapter from where playback should be initiated.
    Type: Grant
    Filed: April 26, 2000
    Date of Patent: April 17, 2007
    Assignee: Genesis Microchip Inc.
    Inventor: Pratish R. Desai
  • Patent number: 7206943
    Abstract: Keys (e.g., decryption key, authentication key) are stored in a non-volatile memory of a display unit. The keys are retrieved in encrypted form into an integrated circuit. The integrated circuit decrypts the keys and uses the keys. As the keys are available in decrypted form only within the integrated circuit and potentially only during use, the keys may not be available to unauthorized third parties.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: April 17, 2007
    Assignee: Genesis Microchip Inc.
    Inventors: Osamu Kobayashi, Ali Noorbakhsh, Chia-Lun Hang, Jih-Hsien Soong, Tzoyao Chan
  • Patent number: 7194189
    Abstract: A method and an apparatus for performing the method of decoding and playing in reverse MPEG encoded content. The MPEG encoded content comprises a plurality of pictures frames. The picture frames are comprised of one or more picture frame types selected from the group of picture frame types including I-frames, P-frames, and B-frames. The method and the apparatus for performing the method comprise the steps of obtaining a group of MPEG picture frames (“GOP”), determining the total number of picture frames in the GOP, and setting an index value equal to the total number of picture frames in the GOP. Next, a picture frame F that has a display order equal to the index value is decoded and displayed, and the earliest B-frame that depends upon frame F is determined. All the B-frames that depend upon frame F are decoded and displayed from highest display order to lowest display order, and the index value then is set to a value equal to one less than the display order of the earliest B-frame that depends upon frame F.
    Type: Grant
    Filed: August 23, 2004
    Date of Patent: March 20, 2007
    Assignee: Genesis Microchip Inc.
    Inventor: Matthew D. Halfant
  • Patent number: 7194613
    Abstract: A computing system comprising a host device which includes a serial communication bus and a processor for controlling communication over the serial communication bus. The computing system further comprises one or more peripheral devices connected to the communication bus. Communication between the host device and the peripheral devices is facilitated by a communication protocol, which includes a procedure for discovering whether the configuration of peripheral devices connected to the communication bus has changed. The discovery procedure starts by the host device sending a first command to all peripheral devices connected to the serial communication bus to determine if the configuration of any of the peripheral devices has changed. If a new peripheral device has been added to the communication bus, the host sends a focus command to a first comm bus port on the communication bus to focus that particular port.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: March 20, 2007
    Assignee: Genesis Microchip Inc.
    Inventor: Jude J. Katsch
  • Patent number: 7192590
    Abstract: The present invention provides polypeptides comprising an immunogenic epitope of a M. vaccae protein, polynucleotides encoding such polypeptides, and fusion proteins comprising at least one such polypeptide, together with genetic constructs comprising at least one inventive polynucleotide. Compositions comprising such polypeptides, polynucleotides, fusion proteins and/or genetic constructs may be employed in the treatment of infectious diseases and immune disorders.
    Type: Grant
    Filed: June 26, 2003
    Date of Patent: March 20, 2007
    Assignee: Genesis Research and Development Corporation, Ltd.
    Inventor: Alain Delcayre
  • Publication number: 20070051299
    Abstract: The present invention provides a method of forming a strained semiconductor layer. The method comprises growing a strained first semiconductor layer, having a graded dopant profile, on a wafer, having a first lattice constant. The dopant imparts a second lattice constant to the first semiconductor layer. The method further comprises growing a strained boxed second semiconductor layer having the second lattice constant on the first semiconductor layer and growing a sacrificial third semiconductor layer having the first lattice constant on the second semiconductor layer. The method further comprises etch annealing the third and second semiconductor layer, wherein the third semiconductor layer is removed and the second semiconductor layer is relaxed.
    Type: Application
    Filed: November 7, 2006
    Publication date: March 8, 2007
    Applicant: Silicon Genesis Corporation
    Inventors: Philip Ong, Francois Henley, Igor Malik
  • Publication number: 20070037323
    Abstract: A method for forming a strained silicon layer of semiconductor material. The method includes providing a deformable surface region having a first predetermined radius of curvature, which is defined by R(l) and is defined normal to the surface region. A backing plate is coupled to the deformable surface region to cause the deformable surface region to be substantially non-deformable. The method includes providing a first substrate (e.g., silicon wafer) having a first thickness. Preferably, the first substrate has a face, a backside, and a cleave plane defined within the first thickness. The method includes a step of overlying the backside of the first substrate on a portion of the surface region having the predetermined radius of curvature to cause a first bend within the thickness of material to form a first strain within a portion of the first thickness. The method provides a second substrate having a second thickness, which has a face and a backside.
    Type: Application
    Filed: August 12, 2005
    Publication date: February 15, 2007
    Applicant: Silicon Genesis Corporation
    Inventors: Francois Henley, Harry Kirk
  • Patent number: 7177329
    Abstract: A transmission efficient packet based display interface arranged to couple a multimedia source device to a multimedia sink device is disclosed. The transmission efficient interface includes a bi-directional auxiliary channel arranged to transfer information between the multimedia source device and the multimedia sink device and vice versa, wherein the information transferred over the auxiliary channel includes a set of packet attributes. The interface also includes a unidirectional main link arranged to carry a number multimedia data packets from the transmitter unit to the receiver unit each having a multimedia data packet header. In the described embodiment, each of the headers is substantially reduced in size over what would otherwise be necessary since the packet attributes are communicated via the auxiliary channel prior to the transmission of the main link packets over main link thereby minimizing the packet overhead and providing a very high main link efficiency.
    Type: Grant
    Filed: November 29, 2005
    Date of Patent: February 13, 2007
    Assignee: Genesis Microchip Inc.
    Inventor: Osamu Kobayashi
  • Publication number: 20070029043
    Abstract: A method for fabricating one or more devices, e.g., integrated circuits. The method includes providing a multi-layered substrate, which has a thickness of material (e.g., single crystal silicon) overlying a first debondable surface coupled to and overlying a second debondable surface. The second debondable surface is overlying an interface region of the multi-layered substrate. In a preferred embodiment, the thickness of material having a surface region. The method includes processing the surface region of the multi-layered substrate using one or more processes to form at least one device onto a portion of the surface region. The method includes forming a planarized upper surface region overlying the surface region of the thickness of material. The method includes joining the planarized upper surface region to a face of a handle substrate.
    Type: Application
    Filed: August 8, 2005
    Publication date: February 8, 2007
    Applicant: Silicon Genesis Corporation
    Inventor: Francois Henley
  • Publication number: 20070032084
    Abstract: A method for fabricating one or more devices, e.g., integrated circuits. The method includes providing a substrate (e.g., silicon), which has a thickness of semiconductor material and a surface region. The substrate also has a cleave plane provided within the substrate to define the thickness of semiconductor material. The method includes joining the surface region of the substrate to a first handle substrate. In a preferred embodiment, the first handle substrate is termed a “thin” substrate, which provides suitable bonding characteristics, can withstand high temperature processing often desired during the manufacture of semiconductor devices, and has desirable de-bonding characteristics between it and a second handle substrate, which will be described in more detail below. In a preferred embodiment, the first handle substrate is also thick enough and rigid enough to allow for cleaving according to a specific embodiment.
    Type: Application
    Filed: September 14, 2006
    Publication date: February 8, 2007
    Applicant: Silicon Genesis Corporation
    Inventor: Francois Henley
  • Publication number: 20070032044
    Abstract: A method for fabricating one or more devices using semiconductor substrate with a cleave region. The method includes providing a substrate. In a preferred embodiment, the substrate has a thickness of semiconductor material and a surface region. In a specific embodiment, the substrate also has a cleave plane (including a plurality of particles, deposited material, or any combination of these, and the like) provided within the substrate, which defines the thickness of semiconductor material. The method includes joining the surface region of the substrate to a first handle substrate. In a preferred embodiment, the method includes initiating a controlled cleaving action at a portion of the cleave plane to detach the thickness of semiconductor material from the substrate, while the thickness of semiconductor material remains joined to the first handle substrate.
    Type: Application
    Filed: August 8, 2005
    Publication date: February 8, 2007
    Applicant: Silicon Genesis Corporation
    Inventor: Francois Henley
  • Patent number: H2186
    Abstract: A video controller having a processor for processing executable instructions and associated data and a number of data ports, a method of acquiring extended display identification data (EDID) by a requesting one of the data ports is described. When on-board power supply is activated, an off-board power supply is deactivated and then the now active on-board power supply provides power to a memory device used to store the EDID and the executable instructions and associated data and to an on-board clock circuit capable of providing a high frequency clock signal. The on-board clock circuit, in turn, provides the high frequency clock signal from the on-board clock circuit to the memory device and if a memory read operation had been in progress when the on-board power supply was activated, then the memory read operation is completed.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: April 3, 2007
    Assignee: Genesis Microchip Inc.
    Inventors: Ali Noorbakhsh, David Keene, John Lattanzi, Ram Chilukuri
  • Patent number: D541058
    Type: Grant
    Filed: June 23, 2003
    Date of Patent: April 24, 2007
    Assignee: Genesis Creative Group, Inc.
    Inventor: Ronald L. Dykstra