Patents Assigned to INFINEON
  • Process to suppress lithography at a wafer edge
    Publication number: 20040166677
    Abstract: Damage to the rim of a semiconductor wafer caused by etching processes is reduced by forming a rim of photoresist or other material around the outer edge of the wafer that has a thickness such that images projected on the rim are sufficiently out of focus that they do not develop, so that etching takes place only in the interior.
    Type: Application
    Filed: February 24, 2003
    Publication date: August 26, 2004
    Applicants: International Business Machines Corporation, INFINEON
    Inventors: Wolfgang Bergner, Linda Chen, Stephan Kudelka, Franz X. Zach