Patents Assigned to Infineon Technologies AG
  • Publication number: 20220201264
    Abstract: An image projection system includes a first transmitter configured transmit pixel light pulses along a transmission path to be projected onto an eye to render a projection image thereon; a second transmitter configured to generate infrared (IR) light pulses transmitted along the transmission path to be projected onto the eye and reflected back therefrom as reflected IR light pulses on a reception path; a coaxial scanning system arranged along the transmission and reception paths; an eye-tracking sensor configured to generate a retina image of the eye based on reflected IR light pulses, and process the retina image to determine a fovea region location of the eye; and a system controller configured to render the projection image based on the fovea region location, wherein the projection image is rendered with a higher resolution in the fovea region and is rendered with a lower resolution outside of the fovea region.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventor: Boris KIRILLOV
  • Publication number: 20220199481
    Abstract: A circuit arrangement has a chip arrangement in the form of an embedded Wafer Level Ball Grid Array (eWLB) arrangement with solder contacts on one side and a thermal interface on a side of the chip arrangement facing away from the solder contacts which is designed to dissipate heat from the semiconductor chip. In examples, the thermal interface has a thermally and electrically conductive material, wherein in a top view of the chip arrangement, a contact area in which the thermally and electrically conductive material is in thermal contact with the chip arrangement is limited to the fan-out area. In examples, the thermal interface has at least one RF absorption layer which is designed to absorb electromagnetic radiation at an operating frequency of the semiconductor chip.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventors: Raphael HELLWIG, Philip AMOS, Walter HARTNER
  • Publication number: 20220196796
    Abstract: A radio frequency (RF) system includes a radar monolithic microwave integrated circuit (MIMIC), which includes: a phase detector including a test input port, and a monitoring input port, wherein the phase detector is configured to generate an output signal that represents a phase difference between a test signal received at the test input port and a monitoring signal received at the monitoring input port; a test signal path including at least one active component, the test signal path configured to receive a local oscillator signal and provide the local oscillator signal as the test signal to the test input port during a first measurement interval; and a passive signal path configured to receive the local oscillator signal and provide the local oscillator signal to the monitoring input port as the monitoring signal during the first measurement interval.
    Type: Application
    Filed: December 21, 2020
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventor: Vincenzo FIORE
  • Publication number: 20220197015
    Abstract: An oscillator system includes an oscillator structure configured to oscillate about a first axis according to a first oscillation and oscillate about a second axis according to a second oscillation; a first driver configured to drive the first oscillation, detect first zero-crossing events of the first mirror, and generate a first position signal based on the detected first zero-crossing events; a second driver configured to drive the second oscillation, detect second zero-crossing events of the second mirror, and generate a second position signal based on the detected second zero-crossing events; and a synchronization controller configured to receive the first and the second position signals, and synchronize at least one of a phase or a frequency of the second oscillation with at least one of a phase or a frequency of the first oscillation, respectively, based on the first and the second position signals.
    Type: Application
    Filed: March 9, 2022
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventors: Norbert DRUML, Philipp GREINER, Boris KIRILLOV, Ievgeniia MAKSYMOVA, Maksym SLADKOV, Hendrikus VAN LIEROP
  • Publication number: 20220196379
    Abstract: An exemplary embodiment relates to a device for training a neural network for determining a rotation angle of an object. The device is configured to receive system data via a sensor system for measuring a magnetic field in order to determine the rotation angle. The device is also configured to generate error data which includes at least one deviation of the system data from a target state of the sensor system or the strength of the components of a superimposed external magnetic field. Furthermore, the device is configured to create training data using the system data and the error data and to train the neural network using the training data.
    Type: Application
    Filed: December 14, 2021
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventors: Richard HEINZ, Andrea HEINZ, Stephan LEISENHEIMER
  • Publication number: 20220196434
    Abstract: The present disclosure relates to an apparatus for position detection, including a multipole magnet with pole pairs extending along a multipole extension direction, a magnetoresistive sensor including a first sensor bridge sensitive for a first in-plane magnetic field component and a second sensor bridge sensitive for a second in-plane magnetic field component, wherein the first sensor bridge and the second sensor bridge are arranged in-plane and are spaced apart along a sensor axis, wherein the multipole extension direction and the sensor axis are rotated by a rotation angle larger than 20° and less than 70° to each other.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 23, 2022
    Applicant: Infineon Technologies AG
    Inventors: Joo ll PARK, Dirk HAMMERSCHMIDT, Hyun Jeong KIM
  • Patent number: 11367775
    Abstract: A semiconductor device includes: a SiC substrate; a device structure in or on the SiC substrate and subject to an electric field during operation of the semiconductor device; a current-conduction region of a first conductivity type in the SiC substrate below and adjoining the device structure; and a shielding region of a second conductivity type laterally adjacent to the current-conduction region and configured to at least partly shield the device structure from the electric field. The shielding region has a higher net doping concentration than the current-conduction region, and has a length (L) measured from a first position which corresponds to a bottom of the device structure to a second position which corresponds to a bottom of the shielding region. The current-conduction region has a width (d) measured between opposing lateral sides of the current-conduction region, and L/d is in a range of 1 to 10.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Michael Hell, Rudolf Elpelt, Caspar Leendertz
  • Patent number: 11366199
    Abstract: A method for a radar system is described. In accordance with one example implementation, the method comprises generating a frequency-modulated RF oscillator signal and feeding the RF oscillator signal to a first transmitting channel and a second transmitting channel. The method further comprises generating a first RF transmission signal in the first transmitting channel based on the RF oscillator signal, emitting the first RF transmission signal via a first transmitting antenna, receiving a first RF radar signal via a receiving antenna, and converting the first RF radar signal to a baseband, as a result of which a first baseband signal is obtained, which has a first signal component having a first frequency and a first phase, where the first signal component is assignable to direct crosstalk from the first transmitting antenna. This procedure is repeated for the second transmitting channel.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Oliver Lang, Michael Gerstmair, Alexander Melzer, Alexander Onic, Christian Schmid
  • Patent number: 11367654
    Abstract: A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: June 21, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad, Michael Roesner
  • Patent number: 11366198
    Abstract: A method for processing a radar signal includes adjusting a processing clock signal, wherein the processing clock signal determines an operation period of a signal processing circuit, wherein the processing clock signal is determined based on a time window, wherein the size of the time window is determined based on the maximum time available for processing a portion of the radar signal and wherein the end of the time window is determined such that it does not occur during an active transmission portion of the radar system.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Markus Bichl, Ljudmil Anastasov, Romain Ygnace
  • Patent number: 11367683
    Abstract: A silicon carbide device includes a silicon carbide substrate, a contact layer including nickel, silicon and aluminum, a barrier layer structure including titanium and tungsten, and a metallization layer including copper. The contact layer is located on the silicon carbide substrate. The contact layer is located between the silicon carbide substrate and at least a part of the barrier layer structure. The barrier layer structure is located between the silicon carbide substrate and the metallization layer.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Martin Gruber, Jochen Hilsenbeck, Dethard Peters, Roland Rupp, Wolfgang Scholz
  • Publication number: 20220187054
    Abstract: A magneto-resistive angle sensor system for measuring a rotational angle of a rotating component in an out-of-shaft configuration. The magneto-resistive angle sensor system including a magnet, which is attached to the rotating component. The magneto-resistive angle sensor system further including a magneto resistive sensor. A sensitive plane of the magneto-resistive sensor is positioned with an offset to the center of the magnet in an offset direction.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Joo ll PARK, Hyun Jeong KIM, Sehwan KIM
  • Publication number: 20220187590
    Abstract: A scanning system includes a microelectromechanical system (MEMS) scanning structure configured with a desired rotational mode of movement based on a driving signal; a plurality of comb-drives configured to drive the MEMS scanning structure according to the desired rotational mode of movement based on the driving signal, each comb-drive including a rotor comb electrode and a stator comb electrode that form a capacitive element that has a capacitance that depends on the deflection angle of the MEMS scanning structure; a driver configured to generate the at least one driving signal; a sensing circuit selectively coupled to at least a subset of the plurality of comb-drives for receiving sensing signals therefrom, wherein each sensing signal is representative of the capacitance of a corresponding comb-drive; and a processing circuit configured to determine a scanning direction of the MEMS scanning structure in the desired rotational mode of movement based on the sensing signals.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: David BRUNNER, Stephan Gerhard ALBERT, Franz Michael DARRER, Georg SCHITTER, Richard SCHROEDTER, Han Woong YOO
  • Publication number: 20220189855
    Abstract: An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Christian FEUERBAUM, Thomas STOEK
  • Publication number: 20220191006
    Abstract: A sender device includes: a first sequence generator configured to generate a first sequence of bits having a bit pattern that incudes first bit values and second bit values; a first parsing processor configured to receive a first plurality of data blocks and the first sequence of bits, and select a first subset of data blocks and a second subset of data blocks from the first plurality of data blocks based on the bit pattern; an encryption processor configured to encrypt the selected first subset of data blocks received from the first parsing processor to generate encrypted data blocks and output the encrypted data blocks to an output terminal that is configured to output the encrypted data blocks and the selected second subset of data blocks as unencrypted data blocks from the sender device.
    Type: Application
    Filed: March 2, 2022
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Alexander ZEH, Marcus JANKE
  • Patent number: 11362684
    Abstract: A method for detecting a code word is proposed, wherein the code word is a code word of one of at least two codes, wherein n states are read from memory cells of a memory, respectively. The n states are determined in a time domain for each of the at least two codes, wherein additionally n states are read from further memory cells and at least one reference value is determined therefrom and wherein the at least one reference value is taken as a basis for determining which of the at least two codes is the correct code. A corresponding device is furthermore specified.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Kern, Michael Goessel
  • Patent number: 11362651
    Abstract: This disclosure is directed to circuits and techniques for protecting a body diode of a power switch from an inductive load when the power switch is turned OFF. A driver circuit may detect whether the power switch is in a desaturation mode when the power switch is turned ON and disable the power switch in response to detecting that the power switch is in the desaturation mode. In addition, the driver circuit may detect whether the body diode of the power switch needs protection when the power switch is turned OFF, and in response to detecting that the body diode needs protection, control the power switch according to a body diode protection scheme.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Michael Krug, Marco Bachhuber, Tommaso Bacigalupo, Benedikt Hanelt, Marcus Nuebling
  • Patent number: 11360185
    Abstract: In an embodiment, a method of operating a radar includes: generating a set of chirps; transmitting the set of chirps; receiving chirps corresponding to the transmitted set of chirps; using a finite state machine (FSM) to apply a phase shift to each of the transmitted chirps or each of the received chirps based on a code; and demodulating the received chirps based on the code.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Reinhard-Wolfgang Jungmaier, Christoph Rumpler, Avik Santra, Saverio Trotta, Raghavendran Vagarappan Ulaganathan
  • Patent number: 11360911
    Abstract: A cryptographic accelerator may include an input buffer to store first data, including a first portion of a message, in a first address range and second data, including a second portion of the message, in a second address range. The cryptographic accelerator may include one or more components to determine lengths of the first and second portions, read the first portion from the first address range, discard any dummy data in the first address range based on an indication of an endpoint of the first data in the first address range, read the second portion from the second address range, and discard any dummy data in the second address range based on an indication of an endpoint of the second data in the second address range. The cryptographic accelerator may include a cryptographic engine to perform a cryptographic operation using the first portion and the second portion.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Manuela Meier, Andreas Graefe
  • Patent number: 11362023
    Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan, Arivindran Navaretnasinggam, Kai Yang Tan, Lee Shuang Wang