Patents Assigned to Infineon Technologies AG
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Patent number: 11831325Abstract: A method of operating a pipelined analog-to-digital converter (ADC) having a plurality of output stages includes: performing a first calibration process for the pipelined ADC to update a parameter vector of the pipelined ADC, where components of the parameter vector are used for correcting nonlinearity of the pipelined ADC, where performing the first calibration process includes: providing an input signal to the pipelined ADC; converting, by the pipelined ADC, the input signal into a first digital output; providing a scaled version of the input signal to the pipelined ADC, where the scaled version of the input signal is generated by scaling the input signal by a scale factor; converting, by the pipelined ADC, the scaled version of the input signal into a second digital output; and calibrating the pipelined ADC using the first digital output and the second digital output.Type: GrantFiled: January 19, 2022Date of Patent: November 28, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Matthias Wagner, Thomas Bauernfeind, Oliver Lang
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Patent number: 11831159Abstract: A microcontroller powered by a power management integrated circuit (PMIC) includes a plurality of cores. A first core of the microcontroller can be configured to implement a system power transient management component. One or more other or second cores of the microcontroller can be configured to implement one or more applications. The system power transient management component implemented by the first core can be configured to dynamically identify an expected load transient event to occur in the microcontroller, determine power control data to optimize a response to the identified expected load transient event, the power control data comprising a power control mode and associated parameters, and provide the power control data to the power management integrated circuit (PMIC).Type: GrantFiled: January 25, 2022Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Surya Kiran Musunuri, Eswar Goda
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Patent number: 11832070Abstract: A microphone device includes a number N of at least two serially coupled microphones forming a microphone chain. The microphones are configured to transmit data to a controller via the microphone chain. The microphone chain is configured to output time-multiplexed data transmitted by the microphones.Type: GrantFiled: December 16, 2021Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Victor Popescu-Stroe, Matthias Boehm
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Patent number: 11831279Abstract: In accordance with an embodiment, a method for operating a millimeter-wave power amplifier including an input transistor having an output node coupled to a load path of a cascode transistor includes: receiving a millimeter-wave transmit signal at a control node of the input transistor; amplifying the millimeter-wave transmit signal to form an output signal; providing the output signal to a load coupled to an output node of the cascode transistor; and adjusting a first DC bias current of the input transistor to form a substantially constant second DC bias current of the cascode transistor.Type: GrantFiled: April 12, 2021Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: David Seebacher, Matteo Bassi, Dmytro Cherniak, Fabio Padovan
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Patent number: 11831208Abstract: A device includes a substrate with an excitation coil configured to generate a magnetic field in reaction to an input signal fed in, and with a pickup coil arrangement configured to generate an output signal in reaction to a magnetic field. The excitation coil includes one or more turns arranged around the pickup coil arrangement in a ring-shaped manner in a plan view of the substrate plane. The device further includes a chip package comprising at least one electrical connection connected to the pickup coil arrangement by means of a signal-carrying conductor. In accordance with the concept described herein, the chip package is positioned on the substrate in such a way that the signal-carrying conductor and the one or more turns of the excitation coil do not overlap in a plan view of the substrate plane.Type: GrantFiled: April 16, 2021Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventor: Udo Ausserlechner
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Patent number: 11828625Abstract: The described techniques address issues associated with hybrid current or magnetic field sensors used to detect both low- and high-frequency magnetic field components. The hybrid sensor implements a DC component rejection path in the high-frequency magnetic field component path. Both digital and analog implementations are provided, each functioning to generate a DC component cancellation signal to at least partially cancel a DC component of a current signal generated via the high-frequency magnetic field component path. The hybrid sensor provides a high-bandwidth, high-accuracy, and low DC offset hybrid current solution that also eliminates the need for DC decoupling capacitors in the high-frequency path. A modification is also described for implementing a Sigma-Delta (??) quantization noise reduction path to reduce the quantization noise and to improve accuracy.Type: GrantFiled: April 5, 2022Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Mario Motz, Amirhossein Jouyaeian, Kofi Makinwa
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Patent number: 11830835Abstract: A semiconductor chip includes a chip pad arranged at a surface of the semiconductor chip. A dielectric layer is arranged at the surface of the semiconductor chip. The dielectric layer has an opening within which a contact portion of the chip pad is exposed, the opening having at least one straight side. The dielectric layer includes a solder flux outgassing trench arranged separate from and in the vicinity of the at least one straight side of the opening and that extends laterally beyond sides of the opening adjoining the straight side.Type: GrantFiled: August 17, 2021Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Michael Stadler, Paul Armand Asentista Calo
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Patent number: 11831148Abstract: A method for operating an electronic switch is described hereinafter. According to one exemplary embodiment, the method (for an electronic switch in the switched on state) comprises detecting whether there is an undervoltage condition at a supply voltage node and providing an undervoltage signal which indicates an undervoltage condition. The method further comprises switching off the electronic switch if the undervoltage signal indicates an undervoltage condition and switching (back) on the electronic switch if the undervoltage signal no longer indicates an undervoltage condition. If the undervoltage signal indicates an undervoltage condition during a switch-on process of the electronic switch, the electronic switch is switched off again and switching back on is prevented for a defined period of time, irrespective of the undervoltage signal. Moreover, a corresponding circuit is described.Type: GrantFiled: September 2, 2021Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventor: Michael Asam
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Patent number: 11828835Abstract: A radio frequency (RF) device includes a display screen and a flexible substrate. The display screen is configured to transmit visible light at a first side of the display screen. The flexible substrate includes a first portion overlapping the first side, and a second portion overlapping an opposite second side of the display screen. The RF device further includes a plurality of antennas disposed over the first portion of the flexible substrate and the first side, and a transmission line disposed on a bent region of the flexible substrate between the first and second portions. The plurality of antennas is configured to transmit/receive RF signals on the first side of the display screen. The display screen is opaque to the RF signals. The transmission line is configured to propagate the RF signals between the first portion and the second portion on the opposite second side of the display screen.Type: GrantFiled: August 12, 2020Date of Patent: November 28, 2023Assignee: INFINEON TECHNOLOGIES AGInventors: Ashutosh Baheti, Saverio Trotta
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Patent number: 11831306Abstract: According to an example, an electronic device includes a component, a supply line providing a supply voltage, a transistor with a control input, a linear first control loop, and a non-linear second control loop. The transistor outputs an output voltage to the component depending on a signal applied to the control input. The linear first control loop includes an ADC to convert an analog output voltage level into a digital measurement signal, a controller to generate a digital control signal for the transistor depending on the digital measurement signal, and a DAC to convert the digital control signal into a first analog control signal. The non-linear second control loop is configured to generate a second analog control signal depending on the analog output voltage level. The second analog control signal is superimposed with the first analog control signal and the combined control signals are fed to the control input of the transistor.Type: GrantFiled: June 9, 2022Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Mihail Jefremow, David Zipperstein, Juergen Schaefer, Holger Dienst, Markus Bichl, Ralph Mueller-Eschenbach, Arndt Voigtlaender
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Patent number: 11829227Abstract: A method for configuring a storage circuit, including: writing data via an input line into the storage circuit by a software write access; writing a bit-wise inverted form of the data via the input line into the storage circuit by a subsequent software write access; and generating an error signal if a comparison based on the written data and the written bit-wise inverted form of the data indicates a storage circuit configuration error, wherein the storage circuit permits hardware read access and lacks software read access.Type: GrantFiled: August 5, 2020Date of Patent: November 28, 2023Assignee: Infineon Technologies AGInventors: Veit Kleeberger, Rafael Zalman
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Publication number: 20230375825Abstract: A light steering system includes: a reflective structure configured to tilt about a first axis; a frame that includes a frame recess over which the reflective structure is suspended; and a suspension assembly that includes a piezoelectric corrugated structure coupled to and between the reflective structure and the frame. The piezoelectric corrugated structure includes a first corrugated surface including concentric rings of alternating peaks and valleys; a second corrugated surface arranged opposite to the first corrugated surface; a plurality of peak electrodes, each peak electrode being coupled to a respective peak of the first corrugated surface; a plurality of valley electrodes, each valley electrode being coupled to a respective valley of the first corrugated surface; and a common electrode layer coupled to the second corrugated surface, wherein the common electrode layer is arranged counter to the plurality of peak electrodes and to the plurality of valley electrodes.Type: ApplicationFiled: May 20, 2022Publication date: November 23, 2023Applicant: Infineon Technologies AGInventors: Christian BRETTHAUER, Malika BELLA
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Patent number: 11824478Abstract: A sensor device includes a first sensor element that generates a first sensor signal based on a varying magnetic field; a second sensor element that generates a second sensor signal based on the varying magnetic field; a signal processing circuit configured to generate a first pulsed signal based on the first sensor signal and generate a second pulsed signal based on the second sensor signal; a fault detector that detects a fault and generates an error signal indicating the fault; and an output generator that receives the error signal based on a first condition that the fault detector detects the fault, and simultaneously outputs a first output signal and a second output signal. In response to the first condition being satisfied, the output generator maintains the first output signal in a steady state and outputs the second pulsed signal as the second output signal.Type: GrantFiled: July 8, 2020Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Stephan Leisenheimer, Konrad Kapser, Rainer Kling, Sebastian Maerz, Romain Peron
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Patent number: 11823970Abstract: A radar chip package includes a radar monolithic microwave integrated circuit (MMIC) having a backside, a frontside arranged opposite to the backside, and lateral sides that extend between the backside and the frontside, wherein the radar MIMIC comprises a recess that extends from the backside at least partially towards the frontside; a plurality of electrical interfaces coupled to the frontside of the radar MIMIC; at least one antenna arranged at the frontside of the radar MIMIC; and a lens formed over the recess and the at least one antenna, wherein the lens is coupled to the backside of the radar MMIC.Type: GrantFiled: May 5, 2021Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Bernhard Rieder, Thomas Kilger
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Patent number: 11821944Abstract: An apparatus for measuring a device current of a device under test (DUT) includes a first circuit including a first terminal for coupling to a first connection terminal of the DUT. The first circuit is configured to supply a first test voltage for the first terminal and to output a first output voltage sensed at the first terminal. The apparatus further includes a second circuit having a second terminal for coupling to a second connection terminal of the DUT. The second circuit is configured to supply a second test voltage for the second terminal and to output a second output voltage sensed at the second terminal. The apparatus further includes a third circuit configured to determine the device current of the DUT based on the first output voltage, the second output voltage, the first test voltage and the second test voltage. The first circuit and the second circuit are identical.Type: GrantFiled: February 25, 2022Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Josef-Paul Schaffer, Joost Adriaan Willemen
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Patent number: 11821760Abstract: By a relative movement between an arrangement of at least three magnetic field sensors and a magnetic field generator, different discrete positional relationships can be produced between the same. A first signal is calculated as a first linear combination using at least two of three sensor signals. It is checked whether the first signal uniquely indicates one of the different discrete positional relationships. If yes, it is determined that the arrangement is located in the one discrete positional relationship. If no, a second signal is calculated as a second linear combination using at least two of the three sensor signals, at least one of which differs from the sensor signals used in the calculation of the first signal, and at least the second signal is used to determine in which of the different discrete positional relationships the arrangement is located relative to the magnetic field generator.Type: GrantFiled: February 7, 2022Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Dirk Hammerschmidt, Robert Hermann
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Patent number: 11821935Abstract: In some examples, this disclosure describes a method of operating a circuit. The method may comprise performing a circuit function under normal operating conditions, wherein performing the circuit function under the normal operating conditions includes performing at least a portion of the circuit functions via a characteristic circuit, performing at least the portion of the circuit function under enhanced stress conditions via a characteristic circuit replica, and predicting a potential future problem with the circuit function under the normal conditions based on an evaluation of operation of the characteristic circuit relative to operation of the characteristic circuit replica.Type: GrantFiled: December 1, 2021Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Dirk Hammerschmidt, Bernhard Gstoettenbauer, Rafael Zalman, Thomas Zettler, Georg Georgakos, Ludwig Rossmeier, Veit Kleeberger
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Patent number: 11824019Abstract: A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.Type: GrantFiled: June 24, 2021Date of Patent: November 21, 2023Assignee: Infineon Technologies AGInventors: Tuncay Erdoel, Walter Hartner, Ulrich Moeller, Bernhard Rieder, Ernst Seler, Maciej Wojnowski
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Publication number: 20230366767Abstract: A capacitive sensor includes a first conductive structure and a second conductive structure that form a first capacitor having a first capacitance that changes in response to an external force acting thereon and includes a MEMS output configured to output a first sense signal representative of the first capacitance; a second capacitor coupled to the MEMS output and configured to output a second sense signal based on the first sense signal; an amplifier comprising an amplifier input and configured to output an amplified signal based on the second sense signal; and a diagnostic circuit configured to receive two measurement signals, generate an offset measurement based on the two measurement signals, and detect a fault on a condition that the offset measurement is outside of a threshold range.Type: ApplicationFiled: May 11, 2022Publication date: November 16, 2023Applicant: Infineon Technologies AGInventors: Constantin CRISU, Dan-Ioan-Dumitru STOICA, Cesare BUFFA, Alessandro CASPANI
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Patent number: 11815532Abstract: The described techniques address issues associated with coreless current sensors by implementing a current sensor solution that may use as few as two, two-dimensional (2D) linear sensors. The discussed techniques provide a coreless current sensor solution that is independent of the sensor position with respect to a current-carrying conductor. An algorithm is also described for auto-calibration of sensor position with respect to a current-carrying conductor to calculate the current flowing through the conductor. The calculation of current may be performed independent of the position of the current-carrying conductor with respect to the sensor, and thus the disclosed techniques provide additional advantages regarding installation flexibility without sacrificing measurement accuracy.Type: GrantFiled: November 24, 2021Date of Patent: November 14, 2023Assignee: Infineon Technologies AGInventors: Milan Agrawal, Dominik Durner, Wolfgang Raberg