Abstract: A controller circuit is configured to receive, from a first device, a first node voltage measured at a first node by the first device at a first time when a first current flows between the first node and a second node and receive, from a second device, a second node voltage measured at a second node by the second device at a second time when a second current flows between the first node and the second node, wherein the first time is different from the second time. The controller circuit is further configured to, responsive to a determination that the first current corresponds to the second current, calculate, using the first node voltage and the second node voltage, a resistance value for one or more electrical components electrically connecting the first node and the second node.

Abstract: A method for calibrating a receiving (Rx) channel of a frequency-modulated continuous-wave (FMCW) radar system includes: setting the Rx channel in calibration mode, where the Rx channel includes a mixer, a phase shifter coupled to a first input of the mixer, a filter coupled to an output of the mixer, and an analog-to-digital converter (ADC) coupled to an output of the filter; setting a value for a phase shifter control word of the phase shifter; sending a chirp signal to the phase shifter; sending a modulated chirp signal to a second input of the mixer, where an output signal at the output of the mixer includes a beat signal; and forming an amplitude curve based on data samples from the ADC, where the amplitude curve illustrates amplitudes of the beat signal at a plurality of frequencies within an operating frequency band of the FMCW radar system.

Abstract: The concept described herein relates to a device and a method for determining the transfer function of an angle sensor in the course of operation. For this purpose, a sequence of angle output signals of the angle sensor is received during at least one time interval in which the angle sensor is exposed to a rotating magnetic field. Furthermore, the transfer function of the angle sensor is determined on the basis of the sequence of angle output signals. The method can be carried out during regular operation of the angle sensor.

Abstract: A system for estimating a tire load of a tire includes a pressure sensor configured to generate a tire pressure signal; an acceleration sensor configured to generate a tire acceleration signal; a temperature sensor configured to generate a tire temperature signal; and at least one processor configured to calculate a duration of a contact patch based on the tire acceleration signal, calculate a vehicle speed based on the tire acceleration signal, determine at least one system model coefficient based on the tire pressure signal and the tire temperature signal, and calculate the tire load of the tire using a linear system model that relates tire pressure, the duration of the contact patch, and the vehicle speed to the tire load of the tire, where the linear system model further includes the at least one system model coefficient for calculating the tire load of the tire.

Abstract: An electronic anomaly detection unit for use in a vehicle includes an input component for capturing an input variable, wherein the input variable contains state information for at least one component of the vehicle, a memory component for storing state values based on the input variable, a selection component for selecting selected state values from the stored state values, an association component for associating the selected state values with predefined values, wherein the predefined values define a normal state of the component of the vehicle, and a decision component for deciding whether there is an anomalous behavior in the at least one component of the vehicle, based on the association, wherein one or more of the input component, the memory component, the selection component, the association component and the decision component are implemented in hardware.

Abstract: A method of manufacturing a bonded substrate stack includes: providing a first substrate having a first hybrid interface layer, the first hybrid interface layer including a first insulator and a first metal; and providing a second substrate having a second hybrid interface layer, the second hybrid interface layer including a second insulator and a second metal. The hybrid interface layers are surface-activated to generate dangling bonds on the hybrid interface layers. The surface-activated hybrid interface layers are brought into contact, such that the dangling bonds of the first hybrid interface layer and the dangling bonds of the second hybrid interface layer bond together to form first insulator to second insulator bonds and first metal to second metal bonds.

Abstract: A chip package is provided. The chip package includes an electrically conductive carrier structure, a first power chip on the carrier structure having a control contact pad and a second power chip on the carrier structure having a control contact pad. The first and second power chips are arranged with their respective control contact pad facing a redistribution layer. A logic chip is arranged with a logic contact pad facing a redistribution layer, wherein the redistribution layer connects the logic contact pad with the respective control pads of the power chips.

Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on or above the carrier, an electrically insulating and thermally conductive layer on at least part of an upper main surface of the electronic component, and a metal block on the electrically insulating and thermally conductive layer. An encapsulant at least partially encapsulates the electronic component, the carrier, the electrically insulating and thermally conductive layer and the metal block so that an upper main surface of the metal block is exposed beyond the encapsulant.

Abstract: A package for mounting on a mounting base is disclosed. In one example, the package comprises a carrier, an electronic component mounted at the carrier, leads electrically coupled with the electronic component and to be electrically coupled with the mounting base, and a linear spacer for defining a spacing with respect to the carrier.

Abstract: A semiconductor arrangement includes a controllable semiconductor element having an active region, and bonding wires arranged in parallel to each other in a first horizontal direction. The active region has a first length in the first horizontal direction and a first width in a second horizontal direction perpendicular to the first horizontal direction. Each bonding wire is electrically and mechanically coupled to the controllable semiconductor element by a first number of bond connections arranged above the active region. A first bond connection of each bonding wire is arranged at a first distance from a first edge of the active region. A second bond connection of each bonding wire is arranged at a second distance from a second edge of the active region opposite the first edge. The first and second distances are both less than the first length divided by twice the first number of bond connections.

Abstract: A clamping circuit for protection against ESD events is described. In accordance with one exemplary embodiment, the circuit comprises the following: a first transistor having a control terminal and a load current path connected between a first contact and a second contact; an amplifier circuit having an amplifier input and an amplifier output connected to the control terminal of the transistor; and a trigger circuit, which is connected between the first contact and the second contact, and comprises a second transistor. The trigger circuit is configured to generate a voltage swing at the amplifier input as a reaction to a discharge current at the first contact by virtue of the fact that at least part of the discharge current drives a control terminal of the second transistor via an intrinsic capacitance of the second transistor.

Abstract: An electrical circuit for providing an output signal based on a first input signal and a second input signal has: a mixer which is configured to receive and mix the first and second input signals in order to generate a mixer output signal and to switch on or off based on the first input signal, wherein a DC signal component of the mixer output signal depends on whether the mixer is switched on or off; and a downstream circuit which is configured to switch on or off based on the DC signal component of the mixer output signal and to provide the output signal based on the mixer output signal.

Abstract: A single-ended to differential converter includes a converter input, a first converter output, a second converter output, and an internal node, wherein the first converter output and the second converter output comprise a differential output; a non-inverting amplifier having an input coupled to the converter input, and an output coupled to the first converter output; an inverting amplifier having an input coupled to the first converter output, and an output coupled to the second converter output; a charge pump having a charge pump output capacitor coupled between the second converter output and the internal node; and a feedback capacitor coupled between the first converter output and the internal node.

Abstract: An apparatus for correcting an input signal is configured for receiving the input signal, the received input signal comprising a series of input values. The apparatus is configured for matching a series of template values to the series of input values by warping the series of template values and the series of input values relatively to each other so as to assign one or more template values to one or more input values, wherein the series of template values represents an approximation of a noise signal that is expected to be comprised in the input signal. The apparatus is configured for obtaining a series of corrected input values based on a mismatch between the input values and their respective assigned template values. The apparatus is configured for providing a corrected signal based on the series of corrected input values.

Abstract: A semiconductor module arrangement includes a housing, a first semiconductor substrate arranged inside the housing, a second semiconductor substrate arranged inside the housing, a first plurality of controllable semiconductor elements, and a second plurality of controllable semiconductor elements. During operation of the semiconductor module arrangement, each controllable semiconductor element of the first plurality of controllable semiconductor elements generates switching losses and conduction losses, the switching losses being greater than the conduction losses. Further during operation of the semiconductor module arrangement, each controllable semiconductor element of the second plurality of controllable semiconductor elements generates switching losses and conduction losses, the conduction losses being greater than the switching losses.

Abstract: An object sensor test system includes a sensor and a test bench. The sensor includes a receiver configured to receive a simulated optical signal and a processing chain that includes a plurality of processing components configured to process at least one measurement signal generated in response to the simulated optical signal to generate processed test data. The sensor also includes a test interface configured to receive a control signal, and selectively extract processed test data at a selected output of the processing chain based on the control signal. The test bench is configured to transmit the control signal to the test interface, receive the processed test data from the sensor, compare the received processed test data with expected data to generate a comparison result, and determine that a segment of the processing chain is operating normally or abnormally based on the comparison result.

Abstract: The described techniques are directed to inductive torque sensors that implement independent target coil and pickup coil systems. By utilizing the various principles of inductive angle sensors, and as a result of the specific physical arrangement of target coils, the inductive torque sensor may independently obtain a rotational position (i.e., mechanical angle) of the rotatable input shaft via one pickup coil system, and a rotational position (i.e., mechanical angle) of the rotatable output shaft via another pickup coil system. Combiner circuitry is also provided to calculate the torsion angle using the signals induced in each of two separate pickup coil systems. By using different k-fold symmetry periodicities in the target coils with respect to the coil configurations, the inductive torque sensor advantageously reduces or eliminates mutual coupling between the different target coil systems and provide robustness to stray or external electromagnetic fields.

Abstract: A method includes producing a semiconductor wafer. The semiconductor wafer includes a plurality of microelectromechanical system (MEMS) semiconductor chips, wherein the MEMS semiconductor chips have MEMS structures arranged at a first main surface of the semiconductor wafer, a first semiconductor material layer arranged at the first main surface, and a second semiconductor material layer arranged under the first semiconductor material layer, wherein a doping of the first semiconductor material layer is greater than a doping of the second semiconductor material layer. The method further includes removing the first semiconductor material layer in a region between adjacent MEMS semiconductor chips. The method further includes applying a stealth dicing process from the first main surface of the semiconductor wafer and between the adjacent MEMS semiconductor chips.

Abstract: An automotive radar arrangement includes a radar receiver configured to generate radar reception data from radio signals received by a plurality of radar receive antennas. A radar signal processor is configured to determine an estimate of an angular position of at least one object by processing the radar reception data. A communication interface is configured to receive information about a reference angular position of the at least one object. A determiner is configured to determine a compensation for the radar reception data based on the estimate of the angular position and the reference angular position of the at least one object. The radar signal processor is configured to correct the radar reception data and/or further radar reception data for the detection of a further object based on the compensation. An output interface is configured to provide information about the presence of the further object to a vehicle controller.

Abstract: A calibration circuit, including: a signal generator circuit configured to generate a modulated analog input signal, which is based on a digital input word that is modulated; an Analog-to-Digital Converter (ADC) configured to convert an analog reference signal to a digital calibration word, wherein the analog reference signal is a low-pass-filtered version of the analog input signal generated by the signal generator circuit; and a feedback circuit configured to output the digital input word by adjusting the digital calibration word depending on a digital feedback signal, which is based on a modulated version of the analog reference signal, wherein the signal generator circuit, the ADC, and the feedback circuit are provided on a same chip.