Patents Assigned to Infineon Technologies AG
  • Patent number: 11071184
    Abstract: The disclosure describes techniques for driving a plurality of light emitting diodes (LEDs) arranged in a parallel connection by using PWM (Pulse Width Modulation) dimming. The techniques of this disclosure describe the generation and application of a fixed phase shift map to a driver matrix based on pixel position. Each pixel corresponds to an LED light source. In the fixed phase shift map, each pixel will have a pre-defined phase shift calculated to induce a determined variation in turn-on time for geometrically neighbouring pixels to spread out current demand over time during PWM dimming.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 20, 2021
    Assignee: Infineon Technologies AG
    Inventors: Rosario Chiodo, Adolfo De Cicco, Pietro Vallese
  • Patent number: 11061002
    Abstract: A photoacoustic gas analyzer, including: a gas chamber to receive a gas to be analyzed; a radiation source that emits into the gas chamber electromagnetic radiation with a time-varying intensity to excite gas molecules of N mutually different gas types the concentrations of which are to be determined in the received gas, wherein the radiation source is operable in N mutually different modes, each mode having a unique emission spectrum different from the emission spectra of the other N?1 modes; an acoustic-wave sensor that detects acoustic waves generated by the electromagnetic radiation emitted into the gas to be analyzed; and a control unit to operate the radiation source in the different modes respectively to emit electromagnetic radiation with a time-varying intensity; to receive in each mode from the acoustic-wave sensor signals; and to determine from the signals received in each mode the concentrations of the N mutually different gas types.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: David Tumpold, Gueclue Onaran, Christoph Glacer
  • Patent number: 11063144
    Abstract: A semiconductor component includes a SiC semiconductor body. A drift zone of a first conductivity type and a semiconductor region are formed in the SiC semiconductor body. Barrier structures extending from the semiconductor region into the drift zone differ from the gate structures.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Roland Rupp, Larissa Wehrhahn-Kilian, Bernd Zippelius
  • Patent number: 11063142
    Abstract: A semiconductor device includes a silicon carbide body that includes a first section and a second section. The first section is adjacent to the second section. A drift region is formed in the first section and the second section. A lattice defect region is in a portion of the drift region in the second section. A first density of lattice defects, which include interstitials and vacancies in the lattice defect region, is at least double a second density of lattice defects, which include interstitials and vacancies in a portion of the drift region outside the lattice defect region.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: July 13, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Christian Hecht, Hans-Joachim Schulze, Andre Rainer Stegner
  • Patent number: 11059715
    Abstract: An apparatus comprises a passive RFID tag designed to provide information identifying at least one fuel compatible with a vehicle.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Bernhard Fehr, Benjamin Schwabe
  • Patent number: 11063583
    Abstract: A multi-sense circuit includes a transistor circuit having sense nodes and a gate node, a peak detector having inputs coupled to the sense nodes of the transistor circuit and an output, and a control circuit having a gate control node coupled to the gate node of the transistor circuit and an overcurrent protection node coupled to the output of the peak detector.
    Type: Grant
    Filed: December 19, 2017
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Marcus Nuebling, Tom Roewe
  • Patent number: 11063677
    Abstract: Embodiments relate to machines comprising a movable part, transceiver circuitry configured to transmit a radio signal towards the movable part and to receive a reflection of the radio signal from the movable part, evaluation circuitry configured to determine a position or a speed of the movable part based on at least the received radio signal. A distance between an antenna of the transceiver circuitry and the movable part is less than 5 cm.
    Type: Grant
    Filed: January 26, 2017
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Dirk Hammerschmidt, Erich Kolmhofer, Rudolf Lachner
  • Patent number: 11063000
    Abstract: A carrier having one or more conductive terminals is provided. A semiconductor die is mounted on the carrier. The semiconductor die is electrically connected to the one or more conductive terminals. The semiconductor die is encapsulated with an electrically insulating mold compound. A verification rule that tests whether inputted information satisfies authentication criteria is created. A first identification feature is formed on a metal structure that is encapsulated by the mold compound. The first identification feature comprises one or more symbols from a first data representation scheme that are covered by the mold compound. The one or more symbols of the first identification feature are selected to convey information that satisfies the authentication criteria of the verification rule.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Stefan Dankowski, Tim Gutheit, Bernhard Lippmann
  • Patent number: 11061745
    Abstract: Various embodiments discussed herein systems and methods that facilitate analysis of shared resources for a multi-core system. One example embodiment comprise a method involving identifying, via static data based on analysis of the multi-core system, shared resource(s) of the multi-core system that are subject to potential resource violation(s), wherein the static data identifies each read and write access of those shared resource(s) in a software of the multi-core system; receiving hardware trace data for the multi-core system comprising each read and write access of those shared resource(s) in the software as executed by the multi-core system; and making a determination, for each shared resource of the one or more shared resources, based on a comparison between the static data and the hardware trace data, whether at least one of the one or more associated potential resource violations of that shared resource is an associated resource violation of that shared resource.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Sumit Khandelwal, Sandeep Chandrashekar, Akhila Shamsunder, Swasati Baishya
  • Patent number: 11062761
    Abstract: A position of a memory cell to be accessed within a memory field of a memory device is identified. A region associated with the memory field within which the position is located is identified. A compensation parameter comprising a fixed electric step value for the region is identified. The compensation parameter may be selected from a set of compensation parameters or may be calculated based upon the position of the memory cell. The compensation parameter is applied to an action performed on a line connected to the memory cell during the access of the memory cell.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: July 13, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Jan Otterstedt, Wolf Allers, Christian Peters
  • Patent number: 11063014
    Abstract: A semiconductor device includes a silicon layer, a metal silicide layer arranged directly on the silicon layer, and a solder layer arranged directly on the metal silicide layer.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: July 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Michael Roesner, Gudrun Stranzl
  • Patent number: 11055423
    Abstract: A signal processor including a Pulse Width Modulation (PWM) encoder configured to encode data into a data PWM pattern; and a block encoder coupled to the PWM encoder, and configured to determine a checksum of the data PWM pattern, wherein the PWM encoder is further configured to encode the checksum into a checksum PWM pattern, and append the checksum PWM pattern on the data PWM pattern for transmission as a PWM signal.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: July 6, 2021
    Assignee: Infineon Technologies AG
    Inventor: Dirk Hammerschmidt
  • Patent number: 11053117
    Abstract: In accordance with one exemplary embodiment, a production method for a double-membrane MEMS component comprises the following steps: providing a layer arrangement on a carrier substrate, wherein the layer arrangement has a first and second membrane structure spaced apart from one another and a counterelectrode structure arranged therebetween, wherein a sacrificial material is arranged in an intermediate region between the counterelectrode structure and the first and second membrane structures respectively spaced apart therefrom, and wherein the first membrane structure has an opening structure to the intermediate region with the sacrificial material and partly removing the sacrificial material from the intermediate region in order to obtain a mechanical connection structure comprising the sacrificial material between the first and second membrane structures, which mechanical connection structure is mechanically coupled between the first and second membrane structures and is mechanically decoupled from the cou
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: July 6, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Marc Fueldner, Stefan Barzen, Alfons Dehe, Gunar Lorenz
  • Patent number: 11056458
    Abstract: A package and method of making a package is disclosed. In one example, the package includes an electronic chip having at least one pad, an encapsulant at least partially encapsulating the electronic chip, and an electrically conductive contact element extending from the at least one pad and through the encapsulant so as to be exposed with respect to the encapsulant. The electrically conductive contact element comprises a first contact structure made of a first electrically conductive material on the at least one pad and comprises a second contact structure made of a second electrically conductive material and being exposed with respect to the encapsulant. At least one of the at least one pad has at least a surface portion which comprises or is made of the first electrically conductive material.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: July 6, 2021
    Assignee: Infineon Technologies AG
    Inventors: Angela Kessler, Andreas Grassmann
  • Patent number: 11057972
    Abstract: This disclosure includes systems, methods, and techniques for controlling a plurality of light-emitting diodes (LEDs). For example, a circuit includes a switching device, where the switching device is electrically connected to an LED of the plurality of LEDs, and where the switching device is configured to control whether the LED receives an electrical signal from a power source. Additionally, the circuit includes processing circuitry configured to receive a photocurrent signal indicative of a photocurrent value corresponding to the LED, compare the photocurrent value with a threshold photocurrent value, and control, based on the comparison of the photocurrent value with the threshold photocurrent value, an output current of the LED.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: July 6, 2021
    Assignee: Infineon Technologies AG
    Inventors: Adolfo De Cicco, Rosario Chiodo, Andrea Logiudice, Dietrich Bonart, Thomas Gross
  • Patent number: 11057018
    Abstract: A notch filter includes a first inductor coupled between an input node and an output node, a dual-resonator structure coupled between the input node and the output node, and a second inductor coupled between the dual-resonator structure and ground, and a bandpass filter includes a capacitor coupled between an input node and an output node, and a dual-resonator structure coupled between the input node, the output node, and ground.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: July 6, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Hans-Joerg Timme, Ruediger Bauder, Andreas Bogner
  • Patent number: 11051384
    Abstract: This disclosure is directed to circuits for controlling voltage from a voltage source to one or more light emitting diodes. The circuit includes a first transistor comprising a power switch that is configured to define a load current path from the voltage source to the one or more light emitting diodes. The circuit also includes a second transistor, which can be controlled based on the light emitting diodes, wherein the second transistor is configured to turn off when one or more of the lights emitting diodes exhibit an electoral short. The first transistor is configured to turn off in response to the second transistor turning off so as to provide short circuit protection for the circuit.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: June 29, 2021
    Assignee: Infineon Technologies AG
    Inventors: Fausto Borghetti, Hector Moreno
  • Patent number: 11046577
    Abstract: In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: June 29, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Andre Brockmeier, Roland Rupp, Francisco Javier Santos Rodriguez
  • Patent number: 11049790
    Abstract: Method for manufacturing an electronic semiconductor package, in which method an electronic chip (100) is coupled to a carrier, the electronic chip is at least partially encapsulated by means of an encapsulation structure having a discontinuity, and the carrier is partially encapsulated, and at least one part of the discontinuity and a volume connected thereto adjoining an exposed surface section of the carrier are covered by an electrically insulating thermal interface structure, which electrically decouples at least one part of the carrier with respect to its surroundings.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: June 29, 2021
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Manfred Mengel
  • Patent number: 11050418
    Abstract: A method of operating a power switch driver circuit coupled to a power switch includes producing, by a controller of the power switch driver circuit, a first driving signal to a control terminal of the power switch to turn on the power switch; comparing, by a first comparator of the power switch driver circuit, a first voltage at the control terminal of the power switch with a first pre-determined threshold; and starting monitoring a desaturation condition of the power switch a pre-determined period of time after detecting that the first voltage is above the first pre-determined threshold, wherein monitoring the desaturation condition comprises monitoring a second voltage at a load path terminal of the power switch.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: June 29, 2021
    Assignee: Infineon Technologies AG
    Inventor: Marco Bachhuber