Patents Assigned to Infineon Technologies AG
  • Patent number: 11039248
    Abstract: According to an embodiment, a microspeaker includes an acoustic micropump structure configured to pump at a first frequency above an upper audible frequency limit. The acoustic micropump structure is further configured to generate an acoustic signal having a second frequency by adjusting the pumping. Adjusting the pumping includes adjusting a direction of pumping for the acoustic micropump structure according to the second frequency. Adjusting the direction of pumping includes changing a direction of flow of an elastic medium through the acoustic micropump structure from a first direction to a second direction. The second frequency is below the upper audible frequency limit.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: June 15, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventor: Stefan Barzen
  • Patent number: 11038016
    Abstract: A transistor device includes a first silicon nanowire array-MOSFET and a second silicon nanowire array-MOSFET integrated with a bulk drift region. The first silicon nanowire array-MOSFET is configured as an n-MOSFET by substantially only accommodating an electron current, and the second silicon nanowire array-MOSFET is configured as a p-MOSFET by substantially only accommodating a hole electron current. A current strength of a current through the first silicon nanowire array-MOSFET caused by electrons is at least 10 times larger than a current through the first silicon nanowire array-MOSFET caused by holes in an on-state of the transistor device. Further embodiments of transistor devices are described.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: June 15, 2021
    Assignee: Infineon Technologies AG
    Inventors: Christian Philipp Sandow, Franz Josef Niedernostheide, Vera van Treek
  • Publication number: 20210173059
    Abstract: A LIDAR sensor includes a linear array of light sources each configured to controllably emit a respective light beam for scanning an environment in a field of view; a deflection system configured to deflect the light beams into the field of view according to a two-dimensional scan pattern; and a control circuit configured to selectively control emission times of the light sources. The control circuit is configured to always control the light sources to simultaneously or sequentially emit their respective light beam. The light beams illuminate a strip-shaped sub-portion of the field of view when all of the light sources are controlled to simultaneously or sequentially emit their respective light beam. The strip-shaped sub-portion longitudinally extends along a spatial axis, wherein an extension of the strip-shaped sub-portion along the spatial axis is smaller than an extension of the field of view along the spatial axis.
    Type: Application
    Filed: November 11, 2020
    Publication date: June 10, 2021
    Applicant: Infineon Technologies AG
    Inventor: Boris KIRILLOV
  • Publication number: 20210172765
    Abstract: Sensor devices and corresponding methods are provided. When a signal path output (COMP OUT) indicates no threshold crossings, diagnosis is performed with a timing based on a clock. In case threshold crossings are indicated, diagnosis is performed with a timing based on threshold crossings.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 10, 2021
    Applicant: Infineon Technologies AG
    Inventors: Dragos VOCUREK, Hans-Joerg WAGNER
  • Patent number: 11032100
    Abstract: Communication devices and methods and corresponding systems are discussed. Transmission is based on symbols, where each symbol comprises a same number of time units. A position of transition between a first signal value and a second signal value within the symbol indicates a value of the symbol.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventor: Wolfgang Scherr
  • Patent number: 11027744
    Abstract: An apparatus for controlling a sensor of an object's safety system is provided. The apparatus includes an input node configured to receive safety information about a likelihood that the sensor senses a safety-relevant event. Further, the apparatus includes a processing circuit configured to control the sensor to perform a sensor diagnosis procedure, if the safety information indicates that it is unlikely that the sensor senses the safety-relevant event within a future period of time.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventor: Dirk Hammerschmidt
  • Patent number: 11031463
    Abstract: A SiC semiconductor device includes a first load electrode, a normally-on junction field effect transistor, and an insulated gate field effect transistor. The normally-on junction field effect transistor includes a channel region electrically connected to the first load electrode. The insulated gate field effect transistor and the normally-on junction field effect transistor are electrically connected in series. The insulated gate field effect transistor includes a source region and a body region. The source region is electrically connected to a channel region of the normally-on junction field effect transistor. The body is electrically connected to the first load electrode.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventors: Andreas Huerner, Dethard Peters
  • Patent number: 11031321
    Abstract: A semiconductor device includes a semiconductor substrate, a power transistor formed in the semiconductor substrate, the power transistor including an active area in which one or more power transistor cells are formed, a first metal pad formed above the semiconductor substrate and covering substantially all of the active area of the power transistor, the first metal pad being electrically connected to a source or emitter region in the active area of the power transistor, the first metal pad including an interior region laterally surrounded by a peripheral region, the peripheral region being thicker than the interior region, and a first interconnect plate or a semiconductor die attached to the interior region of the first metal pad by a die attach material. Corresponding methods of manufacture are also described.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventors: Rainer Pelzer, Fortunato Lopez, Antonia Maglangit, Siti Amira Faisha Shikh Zakaria
  • Patent number: 11031327
    Abstract: In accordance with an embodiment of the present invention, a semiconductor chip includes a device region disposed in or over a substrate, a doped region disposed in the device region, and a through via disposed in the substrate. The through via extends through the doped region.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: June 8, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Helmut Brech, Albert Birner
  • Patent number: 11031494
    Abstract: A semiconductor device includes a trench structure extending from a first surface into a semiconductor body composed of silicon carbide. The trench structure includes an electrode and between the electrode and the first surface a gate electrode. A shielding region adjoining the electrode forms a first pn junction with a drift structure formed in the semiconductor body. A Schottky contact is formed between the drift structure and a first contact structure.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventor: Andreas Meiser
  • Patent number: 11031483
    Abstract: A method includes providing a first layer of epitaxial silicon carbide supported by a silicon carbide substrate, providing a second layer of epitaxial silicon carbide on the first layer, forming a plurality of semiconductor devices in the second layer, and separating the substrate from the second layer at the first layer. The first layer includes a plurality of voids.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Schulze, Roland Rupp, Francisco Javier Santos Rodriguez
  • Patent number: 11031973
    Abstract: A circuit for performing a near-field communication having a contactless circuit which is configured for the contactless exchange of data signals with an external contactless reading device, a security circuit which has a memory in which application identifiers are stored and which is configured to execute security-related applications, and a control circuit which is configured to execute non-security-related applications, wherein the contactless circuit, the security circuit and the control circuit are coupled with one another in such a way and, using at least one of the application identifiers, are configured in such a way that the data signals are supplied from the contactless circuit to the control circuit and vice versa exclusively by means of the security circuit. The security circuit can furthermore store bonding and authentication keys for applications in the control circuit in order to set up a secure data exchange channel for these applications.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 8, 2021
    Assignee: Infineon Technologies AG
    Inventors: Juergen Hoelzl, Josef Gruber, Walther Pachler
  • Patent number: 11030513
    Abstract: A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: June 8, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Walther Pachler, Josef Gruber, Juergen Hoelzl, Francois Poensgen, Stephan Rampetzreiter
  • Publication number: 20210164809
    Abstract: Sensor device, control system and method of communication between a sensor device and a control system. Sensor devices, control systems and methods for communication between sensor devices and control systems are provided. In these, sensor data are transmitted via first interfaces and redundant sensor data and/or other data are transmitted via second interfaces.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 3, 2021
    Applicant: Infineon Technologies AG
    Inventors: Konrad KAPSER, Romain PERON
  • Publication number: 20210166952
    Abstract: A method of manufacturing a module is disclosed. In one example, the method comprises providing at least one solder body with a base portion and an elevated edge extending along at least part of a circumference of the base portion. At least one carrier, on which at least one electronic component is mounted, is placed in the at least one solder body so that the at least one carrier is positioned on the base portion and is spatially confined by the elevated edge.
    Type: Application
    Filed: November 18, 2020
    Publication date: June 3, 2021
    Applicant: Infineon Technologies AG
    Inventors: Achim MUECKE, Arthur UNRAU
  • Publication number: 20210167036
    Abstract: A semiconductor device includes a semiconductor die, an electrical contact arranged on a surface of the semiconductor die, and a metal layer arranged on the electrical contact, wherein the metal layer includes a singulated part of at least one of a metal foil, a metal sheet, a metal leadframe, or a metal plate. When viewed in a direction perpendicular to the surface of the semiconductor die, a footprint of the electrical contact and a footprint of the metal layer are substantially congruent.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 3, 2021
    Applicant: Infineon Technologies AG
    Inventors: Oliver HELLMUND, Barbara EICHINGER, Thorsten MEYER, Ingo MURI
  • Publication number: 20210166986
    Abstract: A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, an encapsulant encapsulating at least part of the carrier and at least part of the electronic component. A compression structure is provided that applies compressive stress to at least part of the encapsulant.
    Type: Application
    Filed: November 23, 2020
    Publication date: June 3, 2021
    Applicant: Infineon Technologies AG
    Inventors: Alexander ROTH, Stefan SCHWAB, Martin MAYER
  • Patent number: 11024502
    Abstract: A method for forming a semiconductor device includes forming a mask layer with a first implantation window on a semiconductor substrate and implanting dopants with a first implantation energy into the semiconductor substrate through the first implantation window to form a first portion of a doping region of the semiconductor device. The mask layer is adapted to form a second implantation window of the mask layer. Further, dopants are implanted with a second implantation energy into the semiconductor substrate through the second implantation window. The second implantation energy differs from the first implantation energy and a lateral dimension of the first implantation window differs from a lateral dimension of the second implantation window.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: June 1, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jens Peter Konrath, Jochen Hilsenbeck
  • Patent number: 11024147
    Abstract: In accordance with an embodiment, a system for surveillance includes an audio signal analyzer, wherein the audio signal analyzer is configured to receive one or more audio microphone signals, where the audio signal analyzer is configured to determine a pattern matching result by determining whether the one or more microphone signals comprise at least one audio pattern of one or more predefined audio patterns; an air pressure change determiner, where the air pressure change determiner is configured to receive an air pressure change signal indicating an air pressure change; and an evaluator, wherein the evaluator is configured to indicate, depending on the pattern matching result and depending on the air pressure change, that a predefined event occurred.
    Type: Grant
    Filed: May 22, 2019
    Date of Patent: June 1, 2021
    Assignee: Infineon Technologies AG
    Inventors: Christian Mandl, Waldemar Marsetz
  • Patent number: 11024565
    Abstract: A semiconductor device includes a die paddle, a plurality of electrically conductive leads extending away from the die paddle, and an adhesion promoter plating material selectively formed on the electrically conductive leads such that outer portions of the leads are covered by the adhesion promoter plating material, and interior portions of the leads that are disposed between the die paddle and the respective outer portions of each lead are substantially devoid of the adhesion promoter plating material.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: June 1, 2021
    Assignee: Infineon Technologies AG
    Inventors: Jochen Dangelmaier, Kim Huat Hoa, Hazrul Alang Abd Hamid, Andreas Allmeier, Dietmar Lang