Patents Assigned to Infineon Technologies AG
  • Patent number: 11367775
    Abstract: A semiconductor device includes: a SiC substrate; a device structure in or on the SiC substrate and subject to an electric field during operation of the semiconductor device; a current-conduction region of a first conductivity type in the SiC substrate below and adjoining the device structure; and a shielding region of a second conductivity type laterally adjacent to the current-conduction region and configured to at least partly shield the device structure from the electric field. The shielding region has a higher net doping concentration than the current-conduction region, and has a length (L) measured from a first position which corresponds to a bottom of the device structure to a second position which corresponds to a bottom of the shielding region. The current-conduction region has a width (d) measured between opposing lateral sides of the current-conduction region, and L/d is in a range of 1 to 10.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Michael Hell, Rudolf Elpelt, Caspar Leendertz
  • Patent number: 11367683
    Abstract: A silicon carbide device includes a silicon carbide substrate, a contact layer including nickel, silicon and aluminum, a barrier layer structure including titanium and tungsten, and a metallization layer including copper. The contact layer is located on the silicon carbide substrate. The contact layer is located between the silicon carbide substrate and at least a part of the barrier layer structure. The barrier layer structure is located between the silicon carbide substrate and the metallization layer.
    Type: Grant
    Filed: June 26, 2019
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Ravi Keshav Joshi, Ralf Siemieniec, Thomas Basler, Martin Gruber, Jochen Hilsenbeck, Dethard Peters, Roland Rupp, Wolfgang Scholz
  • Patent number: 11366198
    Abstract: A method for processing a radar signal includes adjusting a processing clock signal, wherein the processing clock signal determines an operation period of a signal processing circuit, wherein the processing clock signal is determined based on a time window, wherein the size of the time window is determined based on the maximum time available for processing a portion of the radar signal and wherein the end of the time window is determined such that it does not occur during an active transmission portion of the radar system.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: June 21, 2022
    Assignee: Infineon Technologies AG
    Inventors: Markus Bichl, Ljudmil Anastasov, Romain Ygnace
  • Patent number: 11367654
    Abstract: A system and method for manufacturing a packaged component are disclosed. An embodiment comprises forming a plurality of components on a carrier, the plurality of components being separated from each other by kerf regions on a front side of the carrier and forming a metal pattern on a backside of the carrier, wherein the metal pattern covers the backside of the carrier except over regions corresponding to the kerf regions. The method further comprises generating the component by separating the carrier.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: June 21, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad, Michael Roesner
  • Publication number: 20220189855
    Abstract: An integrated circuit package includes a leadframe with a die pad and a lead. A semiconductor die is attached to a top surface of the die pad. A clip has a lead contact area with a surface pattern on a bottom surface of the clip that is proximate to a first end of the clip. A portion of the surface pattern is attached to a top surface of a terminal pad of the lead. The clip includes a die contact area on the bottom surface of the clip that is proximate to a second end of the clip. The die contact area of the clip is attached to a top contact on the semiconductor die. The surface pattern has a length in a longitudinal direction of the clip in a direction parallel with a plane of the bottom surface of the die pad that is greater than a length of the top surface of the terminal pad of the lead.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Christian FEUERBAUM, Thomas STOEK
  • Publication number: 20220187590
    Abstract: A scanning system includes a microelectromechanical system (MEMS) scanning structure configured with a desired rotational mode of movement based on a driving signal; a plurality of comb-drives configured to drive the MEMS scanning structure according to the desired rotational mode of movement based on the driving signal, each comb-drive including a rotor comb electrode and a stator comb electrode that form a capacitive element that has a capacitance that depends on the deflection angle of the MEMS scanning structure; a driver configured to generate the at least one driving signal; a sensing circuit selectively coupled to at least a subset of the plurality of comb-drives for receiving sensing signals therefrom, wherein each sensing signal is representative of the capacitance of a corresponding comb-drive; and a processing circuit configured to determine a scanning direction of the MEMS scanning structure in the desired rotational mode of movement based on the sensing signals.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: David BRUNNER, Stephan Gerhard ALBERT, Franz Michael DARRER, Georg SCHITTER, Richard SCHROEDTER, Han Woong YOO
  • Publication number: 20220187054
    Abstract: A magneto-resistive angle sensor system for measuring a rotational angle of a rotating component in an out-of-shaft configuration. The magneto-resistive angle sensor system including a magnet, which is attached to the rotating component. The magneto-resistive angle sensor system further including a magneto resistive sensor. A sensitive plane of the magneto-resistive sensor is positioned with an offset to the center of the magnet in an offset direction.
    Type: Application
    Filed: December 2, 2021
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Joo ll PARK, Hyun Jeong KIM, Sehwan KIM
  • Publication number: 20220191006
    Abstract: A sender device includes: a first sequence generator configured to generate a first sequence of bits having a bit pattern that incudes first bit values and second bit values; a first parsing processor configured to receive a first plurality of data blocks and the first sequence of bits, and select a first subset of data blocks and a second subset of data blocks from the first plurality of data blocks based on the bit pattern; an encryption processor configured to encrypt the selected first subset of data blocks received from the first parsing processor to generate encrypted data blocks and output the encrypted data blocks to an output terminal that is configured to output the encrypted data blocks and the selected second subset of data blocks as unencrypted data blocks from the sender device.
    Type: Application
    Filed: March 2, 2022
    Publication date: June 16, 2022
    Applicant: Infineon Technologies AG
    Inventors: Alexander ZEH, Marcus JANKE
  • Patent number: 11362823
    Abstract: A device is provided comprising a first memory for storing a first key, a second memory for storing a second key, the device being capable of conducting a first cryptographic algorithm, wherein the first cryptographic algorithm uses the first key, the device being capable of conducting a second cryptographic algorithm, wherein the second cryptographic algorithm uses the second key, and a selection unit, which is programmable to use either the first cryptographic algorithm or the second cryptographic algorithm. Also, a method for operating such device is provided.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Viola Rieger, Alexander Zeh
  • Patent number: 11362651
    Abstract: This disclosure is directed to circuits and techniques for protecting a body diode of a power switch from an inductive load when the power switch is turned OFF. A driver circuit may detect whether the power switch is in a desaturation mode when the power switch is turned ON and disable the power switch in response to detecting that the power switch is in the desaturation mode. In addition, the driver circuit may detect whether the body diode of the power switch needs protection when the power switch is turned OFF, and in response to detecting that the body diode needs protection, control the power switch according to a body diode protection scheme.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Michael Krug, Marco Bachhuber, Tommaso Bacigalupo, Benedikt Hanelt, Marcus Nuebling
  • Patent number: 11362684
    Abstract: A method for detecting a code word is proposed, wherein the code word is a code word of one of at least two codes, wherein n states are read from memory cells of a memory, respectively. The n states are determined in a time domain for each of the at least two codes, wherein additionally n states are read from further memory cells and at least one reference value is determined therefrom and wherein the at least one reference value is taken as a basis for determining which of the at least two codes is the correct code. A corresponding device is furthermore specified.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Kern, Michael Goessel
  • Patent number: 11358518
    Abstract: A vehicle headlamp control circuit may be configured to control a vehicle headlamp comprising a plurality of lighting elements. The vehicle headlamp control circuit may comprise a first communication interface configured to receive a first signal comprising a first set of values for driving the plurality of lighting elements, and a second communication interface configured to receive a second signal comprising an intensity threshold. The circuit may be configured to determine a composite intensity associated with the first set of values and drive the plurality of lighting elements using the first set of values if the composite intensity associated with the first set of values satisfies the intensity threshold.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Gernot Unterweger, Adolfo De Cicco, Pietro Vallese, Andrea Scenini
  • Patent number: 11362023
    Abstract: A lead frame includes a die pad, a first lead extending away from the die pad, a peripheral structure mechanically connected to the first lead and the die pad, and a first groove in an outer surface of the first lead. The first groove extends longitudinally along the first lead away from the die pad.
    Type: Grant
    Filed: July 12, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jayaganasan Narayanasamy, Meng How Chong, Elmer Senorin Holgado, Chee Ming Lam, Sanjay Kumar Murugan, Arivindran Navaretnasinggam, Kai Yang Tan, Lee Shuang Wang
  • Patent number: 11360911
    Abstract: A cryptographic accelerator may include an input buffer to store first data, including a first portion of a message, in a first address range and second data, including a second portion of the message, in a second address range. The cryptographic accelerator may include one or more components to determine lengths of the first and second portions, read the first portion from the first address range, discard any dummy data in the first address range based on an indication of an endpoint of the first data in the first address range, read the second portion from the second address range, and discard any dummy data in the second address range based on an indication of an endpoint of the second data in the second address range. The cryptographic accelerator may include a cryptographic engine to perform a cryptographic operation using the first portion and the second portion.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Manuela Meier, Andreas Graefe
  • Patent number: 11360185
    Abstract: In an embodiment, a method of operating a radar includes: generating a set of chirps; transmitting the set of chirps; receiving chirps corresponding to the transmitted set of chirps; using a finite state machine (FSM) to apply a phase shift to each of the transmitted chirps or each of the received chirps based on a code; and demodulating the received chirps based on the code.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: June 14, 2022
    Assignee: Infineon Technologies AG
    Inventors: Reinhard-Wolfgang Jungmaier, Christoph Rumpler, Avik Santra, Saverio Trotta, Raghavendran Vagarappan Ulaganathan
  • Publication number: 20220178725
    Abstract: Methods and apparatuses for comparing redundant signals in functional safe systems are provided, including methods for mitigating differing signal path delays and for signal weighting of the redundant signals are proposed. An Apparatus includes a first signal path for a first measurement signal of a physical quantity, the first signal path having a first signal propagation delay; a second signal path for a second measurement signal of the physical quantity, the second signal path having a second signal propagation delay different from the first signal propagation delay; a delay compensation circuit configured to compensate for a difference between the first and second signal propagation delays to generate delay-compensated first and second measurement signals; and comparison circuitry configured to compare the delay-compensated first and second measurement signals.
    Type: Application
    Filed: December 6, 2021
    Publication date: June 9, 2022
    Applicant: Infineon Technologies AG
    Inventors: Benjamin KOLLMITZER, Wolfgang GRANIG, Christof MICHENTHALER, Mario MOTZ, Peter Slama
  • Patent number: 11355460
    Abstract: A molded semiconductor package includes: a semiconductor die attached to a substrate, the semiconductor die having a bond pad at a first side of the semiconductor die which faces away from the substrate and an insulating layer covering the first side; an electrical conductor attached to a part of the bond pad exposed by an opening in the insulating layer; a mold compound encasing the semiconductor die; and an electrically insulative material filling the opening in the insulating layer and sealing the part of the bond pad exposed by the opening in the insulating layer. The electrically insulative material separates the mold compound from the part of the bond pad exposed by the opening in the insulating layer. A breakdown voltage of the electrically insulative material is greater than a breakdown voltage of the mold compound.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: June 7, 2022
    Assignee: Infineon Technologies AG
    Inventors: Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, J├╝rgen Schredl, Woon Yik Yong
  • Patent number: 11353547
    Abstract: A radar system is provided. The radar system includes a first radar chip, a second radar chip and a third radar chip. Further, the second radar chip includes a first coupling circuit. Additionally, the third radar chip includes a second coupling circuit. A control circuit is configured to control the first coupling circuit and the second coupling circuit. The first radar chip includes an analysis circuit configured to determine information indicating a reflected wave component. The analysis circuit is further configured to determine, based on the determined information, whether distributions of the oscillation signal to the first and second input nodes via the first and second signal lines are equal.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: June 7, 2022
    Assignee: Infineon Technologies AG
    Inventor: Grigory Itkin
  • Patent number: 11355838
    Abstract: A packaged radar includes laminate layers, a ground plane associated with at least one of the laminate layers, a transmit antenna and a receive antenna associated with at least one of the laminate layers, and an electromagnetic band gap structure between the transmit antenna and the receive antenna for isolating the transmit antenna and the receive antenna, the electromagnetic band gap structure including elementary cells forming adjacent columns each coupled to the ground plane, and each elementary cell including a conductive planar element and a columnar element coupled to the conductive planar element.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: June 7, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Ashutosh Baheti, Marwa Abdel-Aziz, Mustafa Dogan, Muhammad Tayyab Qureshi, Saverio Trotta, Maciej Wojnowski
  • Patent number: 11354392
    Abstract: A dual interface smart card having a smart card body, a contact-based interface for contact-based communications, a first security chip which is arranged in the smart card body and is electrically conductively coupled to the contact-based interface, a fingerprint sensor arranged in the smart card body, a second security chip, which is coupled to the fingerprint sensor and is configured to carry out a fingerprint verification by means of fingerprint signals detected by the fingerprint sensor, and an antenna coupled to the second security chip.
    Type: Grant
    Filed: October 21, 2020
    Date of Patent: June 7, 2022
    Assignee: Infineon Technologies AG
    Inventors: Timo Lisk, Wolfgang Schindler