Patents Assigned to Infineon Technologies AG
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Patent number: 12689384Abstract: In accordance with an embodiment, a circuit includes an amplifier comprising a first input coupled to a reference voltage node, a first buffer having an input coupled to an output of the amplifier, a second buffer having an input coupled to the output of the amplifier, and a capacitor. A method of operating the circuit includes during a first phase of operation: forming a first closed loop including the amplifier and the first buffer and excluding the capacitor and the second buffer, and sampling a voltage difference between an output of the second buffer and the reference voltage node across the capacitor; and during a second phase of operation, forming a second closed loop including the amplifier, the first buffer, and the capacitor with the sampled voltage difference stored thereon, and excluding the second buffer.Type: GrantFiled: March 1, 2024Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Giulia Mocchiutti, Enrico Caruso
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Patent number: 12687531Abstract: What is disclosed is a hydrogen sensor (100) having a housing (101) that includes a cavity (102) and has a passage opening (103) from the cavity (102) to a gas connection of the hydrogen sensor (100) or an environment, having a first hydrogen sensor element (104), disposed in the cavity (102), for measurement of a hydrogen content in the cavity (102), having a first sorption element (105) for sorption of water and/or water vapor, especially an adsorption element (105) for adsorption of water and/or water vapor, and having a first heater (106) for bakeout of the first sorption element (105), wherein the first sorption element (105) has open pores and is disposed in the passage opening (103).Type: GrantFiled: July 5, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Rainer Markus Schaller, Klaus Elian
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Patent number: 12690102Abstract: A lighting circuit may comprise a receiver circuit configured to receive information from a processor, wherein the information comprises a first bitmap associated with a first set of lighting elements and a second bitmap associated with a second set of lighting elements, and a driver circuit connected to the receiver circuit via a first communication interface, wherein the driver circuit is configured to receive the information from the receiver circuit via the first communication interface. The driver circuit may be configured to extract the first bitmap and the second bitmap from the information, store the first bitmap for driving the first set of lighting elements, and output the second bitmap via a second communication interface to another circuit for driving the second set of lighting elements.Type: GrantFiled: September 27, 2024Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Adolfo De Cicco, Gernot Unterweger, Andrea Scenini, Pietro Vallese, Salvatore Sanna
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Patent number: 12690486Abstract: A method of forming a semiconductor package includes providing a baseplate, mounting a semiconductor die on the baseplate with a main surface of the semiconductor die facing away from the baseplate, forming vertical interconnect elements on the main surface of the semiconductor die, forming an encapsulant on the baseplate that encapsulates the semiconductor die, exposing the vertical interconnect elements at an upper surface of the encapsulant, forming a first level metal pad on the upper surface of the encapsulant that contacts the exposed vertical interconnect elements, and forming structured metal regions on the upper surface of the encapsulant, wherein forming the structured metal regions includes structuring the first level metal pad.Type: GrantFiled: March 17, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Pei Luan Pok, Swee Kah Lee, Soon Lock Goh, Chee Hong Lee, Samsun Paing, Chee Chiew Chong
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Patent number: 12689140Abstract: A semiconductor device includes an electronics carrier, an electrically conductive receptacle attached to a first pad of the electronics carrier, and an electrically conductive press-fit connector including a flange and a base portion extending from the flange to a first end of the press-fit connector, wherein the press-fit connector is in a secured position whereby the base portion is disposed within and securely retained by the receptacle, and wherein the base portion of the press-fit connector is configured to maintain vertical separation between the flange and an upper end of the receptacle in the secured position.Type: GrantFiled: July 28, 2022Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Regina Nottelmann, Alexander Herbrandt
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Patent number: 12689343Abstract: A transimpedance amplifier includes: a first operational amplifier; a second operational amplifier; a first resistor coupled between a first input terminal of the first operational amplifier and a first output terminal of the first operational amplifier; a second resistor coupled between the first output terminal of the first operational amplifier and a first input terminal of the second operational amplifier; and a first capacitor-resistor-capacitor (CRC) network coupled between the first input terminal of the second operational amplifier and a first output terminal of the second operational amplifier, where the first CRC network is a first reconfigurable filter that is configured to function as a first-order high-pass filter or a second-order high-pass filter based on a first control signal applied to the first CRC network.Type: GrantFiled: August 21, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventor: Peter Unterkircher
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Patent number: 12688963Abstract: An operating element having haptic feedback is proposed, having a membrane deflectable using a magnetic field, having a coil for generating a magnetic field for deflecting the membrane, and having a touch sensor element including at least one touch sensor electrode.Type: GrantFiled: November 14, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Klaus Elian, Derek Debie
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Patent number: 12687575Abstract: One exemplary embodiment relates to a circuit which is integrated into a semiconductor substrate and which comprises a lateral field effect transistor having a drift region and a field plate electrode, which is isolated from the drift region by an isolation zone. The integrated circuit further comprises a first terminal, which is coupled to the field plate electrode, for applying a test voltage to the field plate electrode in a test operating mode. An electronic switch is configured to connect the field plate electrode to a circuit node that is at a reference voltage in a normal operating mode of the integrated circuit. The integrated circuit further comprises a second terminal, which is connected to a control terminal of the electronic switch and is configured to receive a control signal for switching on or off the electronic switch.Type: GrantFiled: December 22, 2023Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Till Schloesser, Axel Reithofer, Jens Barrenscheen
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Patent number: 12687593Abstract: A sensor system includes a sensor package including an integrated circuit and a plurality of external terminals including a first supply terminal, a second supply terminal, and an output terminal configured to provide an output signal. The integrated circuit includes a sensor circuit configured to modulate the output signal based on a sensor signal; a current path coupled between the first supply terminal and the second supply terminal and configured to enable a current to flow along the current path from the first supply terminal to the second supply terminal; a current modulator component arranged in the current path and configured to modulate the current flowing along the current path; and a diagnostic circuit configured to generate diagnostic information based on one or more conditions of the integrated circuit, and control the current modulator component such that the current is modulated based on the diagnostic information.Type: GrantFiled: February 23, 2024Date of Patent: July 21, 2026Assignee: Infineon Technologies AGInventors: Joo Il Park, Se Hwan Kim, Rainer Kling, Thomas Cemernek, Dragos Vocurek
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Patent number: 12681082Abstract: According to some embodiments, an electronic device is described, having a counter circuit which is configured to detect first pulses in a received first output signal and to determine a number of the detected first pulses, a counter circuit which is configured to detect second pulses in a received second output signal and to determine a number of the detected second pulses, and an error detection circuit configured to register a first difference between the number of first pulses detected in a first time interval and the number of second pulses detected in the first time interval, determine a second difference between the number of first pulses detected in a second time interval and the number of second pulses detected in the second time interval and indicate an error if the first difference and the second difference differ from one another by at least one predefined threshold value.Type: GrantFiled: November 7, 2024Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Wei Wang, Michael Augustin, Jürgen Schäfer, Henning Behrmann, Jörg Schreiner
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Patent number: 12681787Abstract: This disclosure is directed to circuits and techniques for configuring a driver circuit for a power switch when entering a fail-safe state. The driver circuit includes a volatile memory connected to a plurality of independent power supplies, the volatile memory configured to store a fail-safe configuration for the driver circuit. The driver circuit includes driver logic connected to the volatile memory that is configured to determine to enter a fail-safe state and, in response to determining to enter the fail-safe state, configure the driver circuit or a power switch according to the fail-safe configuration stored in the volatile memory.Type: GrantFiled: July 18, 2024Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Klaus Hoermaier, Martin Ringswirth, Gernot Unterweger
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Patent number: 12683118Abstract: A method of determining sample information associated with a sample is provided. In an embodiment, when a sample has a first temperature, a first measure of electrons of the sample is determined. When the sample has a second temperature different than the first temperature, a second measure of electrons of the sample is determined. Sample information associated with the sample is determined based upon the first measure of electrons and the second measure of electrons. The sample information includes a dopant concentration of the sample, a measure of electric field strength of the sample, a defect concentration of the sample, a Fermi level of the sample and/or an indication of a space charge region of the sample.Type: GrantFiled: July 12, 2023Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Maximilian Alexander Moser, Gregor Bernhard Pobegen, Michael Nelhiebel
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Patent number: 12683590Abstract: In accordance with an embodiment, A device includes: a first node configured to be coupled to a component to be tuned; a second node configured to be coupled to an inductor; a path including a capacitor coupling the first node and the second node; and a first switch coupled between the second node and a ground node.Type: GrantFiled: October 27, 2023Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventor: Kun Wang
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Patent number: 12684789Abstract: A semiconductor device includes a semiconductor body having first and second opposite surfaces along a vertical direction, and an active diode area. The active diode area includes: a p-doped anode region adjoining the first surface; an n-doped drift region between the anode region and the second surface; an n-doped cathode contact region adjoining the second surface; a p-doped injection region adjoining the second surface and the cathode contact region; and a p-doped auxiliary region between the drift region and the cathode contact region. The auxiliary region includes first and second sub-regions. In a top view, the first sub-region covers at least part of the injection region and the second sub-region covers at least part of the cathode contact region. In the top view, the auxiliary region includes a plurality of openings covering from 0.1% to an 20% of a surface area of the active diode area at the second surface.Type: GrantFiled: November 2, 2023Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Benedikt Stoib, Hans-Joachim Schulze, Marten Müller, Daniel Schlögl, Moriz Jelinek, Holger Schulze
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Patent number: 12681292Abstract: An oscillator system includes a oscillator structure configured to oscillate about an axis; a driver configured to generate a driving signal to drive an oscillation of the oscillator structure about the axis with an oscillation phase and an oscillation frequency, wherein the driver includes a phase detector configured to generate a phase error signal representative of a phase error between a measured oscillation of the oscillator structure about the axis and an expected oscillation having the oscillation phase; and a phase controller configured to receive the phase error signal and generate an actuation value based on the phase error signal, wherein the phase controller is configured to adjust the actuation value based on the phase error signal to adjust an actuation phase of the oscillator structure about the axis to minimize the phase error. The driver is configured to generate the driving signal based on the actuation value.Type: GrantFiled: March 30, 2022Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Norbert Druml, Philipp Greiner
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Patent number: 12684346Abstract: The present disclosure relates to an in-vehicle network end node and secure ways for the in-vehicle end node to access a server in order to off-load complex tasks from the in-vehicle end node thereby enhancing its function despite the scarce resources of the in-vehicle end node.Type: GrantFiled: June 12, 2023Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Alexander Zeh, Thomas Liebetrau
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Patent number: 12681471Abstract: A computer-implemented method of monitoring a process includes obtaining a sample data distribution. The sample data represents one or more parameters of a process. The sample data is collected by one or a plurality of sampling units. The method further includes calculating a control limit based on an evaluation of at least one difference of percentiles near an upper edge of the sample data distribution or a lower edge of the sample data distribution.Type: GrantFiled: July 10, 2023Date of Patent: July 14, 2026Assignee: Infineon Technologies AGInventors: Andreas Kluwe, Stefan Jank, Christian Knöll
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Patent number: 12673865Abstract: A MEMS device includes a substrate having a cavity and a membrane structure mechanically connected to the substrate and configured for deflecting out-of-plane with regard to a substrate plane and with a frequency in an ultrasonic frequency range to cause a fluid motion of the fluid in the cavity. The MEMS device includes a valve structure sandwiching the cavity together with the membrane structure, wherein the valve structure includes a planar perforated structure and a shutter structure opposing the perforated structure and arranged movably in-plane and with a frequency in the ultrasonic frequency range and with regard to the substrate plane and between a first position and a second position. The shutter structure is arranged to provide a first fluidic resistance for the fluid in the first position and a second, higher fluidic resistance for the fluid in the second position.Type: GrantFiled: June 14, 2023Date of Patent: July 7, 2026Assignee: Infineon Technologies AGInventors: Christian Bretthauer, Marco Haubold, Hans-Jörg Timme, Dominik Mayrhofer
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Patent number: 12677100Abstract: A linearized system includes a nonlinear system configured for receiving an input signal; a digital nonlinear compensation component having an input coupled to an output of the nonlinear system, and having an output for generating an output signal; a low pass filter having an input coupled to the output of the digital nonlinear compensation component; a first summer having a first input configured for receiving a digital reference value and a second input coupled to an output of the low pass filter; and an error minimization component having an input coupled to an output of the first summer, and an output coupled to the digital nonlinear compensation component.Type: GrantFiled: March 11, 2022Date of Patent: July 7, 2026Assignee: Infineon Technologies AGInventor: Dietmar Straeussnigg
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Patent number: 12674821Abstract: This disclosure concerns a sensor device including an electric conductor including a flat elongated shape. The electric conductor includes at least one cutout portion extending along the width of the electric conductor (200), the cutout portion extending from a first longitudinal side of the electric conductor towards an opposite second longitudinal side of the electric conductor, wherein a residual portion of the electric conductor remains between the cutout portion and the second longitudinal side of the electric conductor. A magnetic sensor is provided for measuring a magnetic field emanating from the electric current flowing through the electric conductor, wherein the magnetic sensor is arranged next to the electric conductor opposite the cutout portion.Type: GrantFiled: February 2, 2024Date of Patent: July 7, 2026Assignee: Infineon Technologies AGInventors: Dietmar Spitzer, Gaetano Formato, Giampiero Ciammetti, Takeshi Wakii