Patents Assigned to Infineon Technologies AG
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Patent number: 12368448Abstract: A digital microphone includes a log amplifier having an input for receiving an analog signal; an analog-to-digital converter (ADC) coupled to the log amplifier; a digital low-pass filter coupled to the ADC; a digital decompression component coupled to the digital low-pass filter; and a predictor filter coupled to the digital decompression component, the predictor filter having an output for generating a digital signal. The digital low-pass filter is a positive group delay filter and the predictor filter is a negative group delay filter. The digital microphone has an improved Signal-to-Noise Ratio (SNR) due to filtering, but without increasing overall group delay.Type: GrantFiled: March 24, 2023Date of Patent: July 22, 2025Assignee: Infineon Technologies AGInventors: Dietmar Straeussnigg, Simon Grünberger
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Patent number: 12366615Abstract: A current sensor includes a current rail and a magnetic field sensor. The magnetic field sensor is configured to measure a magnetic field induced by a current flowing through the current rail. A first insulation layer and a second insulation layer are arranged between the current rail and the magnetic field sensor. An interface between the first insulation layer and the second insulation layer is free of a contact with the current rail and/or is free of a contact with the magnetic field sensor. A portion of the current rail extends into the second insulation layer and the portion of the current rail is encapsulated by the second insulation layer.Type: GrantFiled: November 1, 2023Date of Patent: July 22, 2025Assignee: Infineon Technologies AGInventors: Rainer Markus Schaller, Volker Strutz, Jochen Dangelmaier
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Patent number: 12368421Abstract: A logarithmic amplifier includes programmable gain amplifiers each having a different gain, wherein an input of each of the programmable gain amplifiers is coupled to an input of the logarithmic amplifier; and a summing circuit having inputs coupled to a corresponding output of each of the programmable gain amplifiers and an output coupled to an output of the logarithmic amplifier, wherein the summing circuit generates a logarithmic transfer function having piecewise linear segments.Type: GrantFiled: April 21, 2022Date of Patent: July 22, 2025Assignee: Infineon Technologies AGInventors: Jose Luis Ceballos, Fulvio CiCiotti, Dietmar Straeussnigg, Andreas Wiesbauer
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Patent number: 12368413Abstract: A circuit for biasing a transistor is provided. The circuit includes an output terminal configured to be coupled to a gate terminal of the transistor and circuitry. In a first state, the circuitry is configured to output a control signal at a first voltage level for setting the transistor to a first transistor state. In a second state, the circuitry is configured to first output the control signal at a second voltage level different from the first voltage level following by changing the control signal from the second voltage level towards a third voltage level different from the first and second voltage level over time.Type: GrantFiled: February 21, 2023Date of Patent: July 22, 2025Assignee: Infineon Technologies AGInventors: Herwig Wappis, Peter Singerl, Martin Mataln, Gerhard Maderbacher
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Patent number: 12366616Abstract: The present disclosure relates to a magnetic field sensor, in particular an angle sensor, including a magnetoresistive sensor component and a spin-orbit torque, SOT, sensor component.Type: GrantFiled: October 20, 2022Date of Patent: July 22, 2025Assignee: Infineon Technologies AGInventors: Milan Agrawal, Juergen Zimmer
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Patent number: 12360936Abstract: An interconnect connects a first device running a first application and with a first interface and a second device running a second application and with a second interface. The first device has a safety guard which may be used in an operations mode to send safety relevant data from the first application to the second application. Safety information is added to the safety relevant data to create safety marked data. The safety marked data is transmitted to the second application. The safety marked data is also looped back through interconnect to the safety guard which checks the loop back data using the safety information in the loop back data, and when the checking indicates an error, transmits an error notification signal to the first application and/or the second application.Type: GrantFiled: March 6, 2023Date of Patent: July 15, 2025Assignee: Infineon Technologies AGInventor: Lin Li
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Patent number: 12360363Abstract: A method of synchronizing a first oscillation about a first axis with a second oscillation about a second axis includes: generating a first position signal that indicates a position of the first oscillation about the first axis; generating a second position signal that indicates a position of the second oscillation about the first axis; determining a phase difference between the first and the second position signals; comparing the phase difference to a threshold value to generate a comparison result; generating a reference signal having a first frequency; synchronizing the first oscillation to the first frequency; and triggering a start of the reference signal responsive to the comparison result indicating that the phase difference is less than the threshold value.Type: GrantFiled: March 7, 2024Date of Patent: July 15, 2025Assignee: Infineon Technologies AGInventors: Norbert Druml, Alberto Garcia Izquierdo
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Publication number: 20250226297Abstract: A package and method is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant at least partially encapsulating the electronic component and partially encapsulating the carrier. At least a portion of a bottom surface and at least a portion of a sidewall of the carrier are exposed beyond the encapsulant. Said at least portion of the bottom surface and said at least portion of the sidewall are covered at least partially by a plating structure.Type: ApplicationFiled: December 26, 2024Publication date: July 10, 2025Applicant: Infineon Technologies AGInventors: Kok Yau CHUA, Soon Lock GOH, Chee Hong LEE, Swee Kah LEE, Luay Kuan ONG, Norbert PIELMEIER
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Patent number: 12352777Abstract: A control circuit for a wheel speed sensor is provide. The control circuit includes an input interface configured to receive high-resolution wheel speed data and low-resolution wheel speed data; and circuitry configured to determine information on a functional state of the wheel speed sensor using the high-resolution data and the low-resolution data. The circuitry is configured to detect a failure state of the wheel speed sensor if a number of signal events which are signaled by the high-resolution wheel speed data between a first signal event and a second signal event deviates from an expected number. The first signal event and the second signal event are signaled by the low-resolution wheel speed data.Type: GrantFiled: March 10, 2023Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Simone Fontanesi, Filippo Grillotti, Alessandro Petri, Massimiliano Zilli
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Patent number: 12352831Abstract: A current sensor arrangement includes a first conductor structure extending in a first direction and configured to carry a first current along the first direction; a second conductor structure extending in a second direction perpendicular to the first direction and configured to carry a second current along the second direction; and a magnetic field sensor arranged between the first conductor structure and the second conductor structure and configured to receive a first magnetic field produced by the first current and a second magnetic field produced by the second current. The first conductor structure and the second conductor structure overlap with the magnetic field sensor in a third direction that is perpendicular to the first and second directions. The magnetic field sensor includes a first sensor element sensitive to the first magnetic field and a second sensor element sensitive to the second magnetic field.Type: GrantFiled: October 19, 2022Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Stephan Leisenheimer, Richard Heinz
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Patent number: 12355274Abstract: A device includes a first electronic component and a case, wherein the case includes a first charging compartment configured to accommodate and charge the first electronic component. The device further includes a first magnet included in the first electronic component and a 3D magnetic field sensor included in the case. The device further includes a detection unit configured to detect a position of the first electronic component relative to the first charging compartment based on a magnetic field sensed by the 3D magnetic field sensor.Type: GrantFiled: June 9, 2022Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Lifeng Guan, Wai Keung Frankie Chan
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Patent number: 12355340Abstract: A circuit includes a switching signal generator and synchronization circuitry configured to determine a first time of a switching period based on a switching signal. The circuit further includes a comparison signal generator configured to generate a comparison signal with a first constant rate of change after the first time. The synchronization circuitry is further configured to determine a second time of the switching period based on when current at the inductive element changes from a positive current to a negative current. The comparison signal generator is further configured to generate the comparison signal with a second constant rate of change after the second time. The circuit further includes a threshold detector configured to compare a value of the comparison signal at the end of a target switching period with a threshold value.Type: GrantFiled: April 27, 2023Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Marco Flaibani, Stefano Zampieri, Giovanni Bisson
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Patent number: 12354936Abstract: A semiconductor device includes a semiconductor die including a first side and an opposing second side, a first metallization layer arranged on the first side, a Ni including layer arranged on the second side, wherein the Ni including layer further includes one or more of Si, Cr and Ti, and a SnSb layer arranged on the Ni comprising layer, wherein an amount of Sb in the SnSb layer is in the range of 2 wt % to 30 wt %.Type: GrantFiled: August 30, 2022Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Oliver Schilling, Roman Immel, Joachim Seifert, Altan Toprak, Frank Wagner, Ulrich Wilke, Lars Boewer, Paul Frank
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Patent number: 12352802Abstract: In some examples, a circuit comprises a function unit configured to perform a circuit function, and one or more in situ monitors configured to measure internal data associated with the circuit. The circuit may further comprise a memory configured to store one or more limit values associated with the one or more in situ monitors, and a lifetime model unit configured to determine whether the circuit has reached an end-of-life threshold based on the measured internal data from the one or more in situ monitors and the limit values.Type: GrantFiled: December 1, 2021Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Georg Georgakos, Bernhard Gstoettenbauer, Dirk Hammerschmidt, Veit Kleeberger, Ludwig Rossmeier, Rafael Zalman, Thomas Zettler
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Patent number: 12345551Abstract: A sensor system may include a magnet arranged such that a linear position of the magnet corresponds to a position of a trigger element on a substantially linear trajectory, and such that an angular position of the magnet corresponds to a selected position of a selection element, the selected position being one of a plurality of selected positions. The sensor system may include a magnetic sensor to determine the position of the trigger element based on a strength of a first magnetic field component and a strength of a second magnetic field component, and determine the selected position of the selection element based on a strength of a third magnetic field component and the strength of the second magnetic field component. The first magnetic field component, the second magnetic field component, and the third magnetic field component may be perpendicular to each other.Type: GrantFiled: April 18, 2023Date of Patent: July 1, 2025Assignee: Infineon Technologies AGInventors: Sebastian Ladurner, Richard Heinz, Sigmund Zaruba, Severin Neuner
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Patent number: 12348644Abstract: A wallet including an electronic data storage unit for storing wallet information, and a data interface configured to provide a read access to the electronic data storage unit. A controller of the wallet is configured to control the wallet at a first point in time in a first operating mode, in which there is a restriction for the read access to the wallet information, and to control the wallet at a later second point in time in a second operating mode, in which the restriction to the read access is cancelled. The transition from the first operating mode to the second operating mode is irreversible.Type: GrantFiled: September 27, 2022Date of Patent: July 1, 2025Assignee: Infineon Technologies AGInventor: Walther Pachler
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Patent number: 12339975Abstract: A device includes a safety domain having a processing unit and a memory and is configured to provide at least one functionality and to implement one more safety measures for detecting faults. The safety domain is configured to transmit at least one alarm signal indicating one or more detected errors in response to detecting the faults. The device further includes a security domain having a processing unit and a memory and is configured to provide cryptographic services and to obtain alarm signals. The security domain is configured to perform security-related operations in a secure state in response to obtaining an alarm signal from the safety domain.Type: GrantFiled: March 22, 2022Date of Patent: June 24, 2025Assignee: Infineon Technologies AGInventors: Joerg Syassen, Avni Bildhaiya, Andreas Graefe, Albrecht Mayer, Manuela Meier, Viola Rieger
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Patent number: 12337854Abstract: An electronic control unit includes a signal input circuit configured to receive a sensor signal from a radar sensor or from a lidar sensor and a processing circuit configured to determine a first condition based on a first representation of the sensor signal, and to generate an activation signal in response to the first condition.Type: GrantFiled: August 29, 2022Date of Patent: June 24, 2025Assignee: Infineon Technologies AGInventors: Andre Roger, Farhan Bin Khalid, Romain Ygnace
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Patent number: 12340843Abstract: A memory device is provided. The memory device comprises at least one non-volatile memory cell, a write circuit configured to write to the at least one memory cell, and a read circuit configured to read from the at least one memory cell, wherein the memory device is configured to be operable in a test operating mode, in which at least one test path can be tested, and wherein the test path comprises at least a portion of the write circuit and at least a portion of the read circuit, and bypasses the at least one memory cell.Type: GrantFiled: February 20, 2023Date of Patent: June 24, 2025Assignee: Infineon Technologies AGInventors: Thomas Kern, Sebastian Kiesel
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Patent number: RE50485Abstract: A semiconductor module includes a semiconductor die, a mold compound encasing the semiconductor die, a plurality of terminals electrically connected to the semiconductor die and protruding out of the mold compound, wherein a first one of the terminals has a constricted region covered by the mold compound, wherein the mold compound has a recess or an opening near the constricted region of the first terminal, and a coreless magnetic field sensor disposed in the recess or the opening of the mold compound and isolated from the first terminal by the mold compound. The coreless magnetic sensor is configured to generate a signal in response to a magnetic field produced by current flowing in the constricted region of the first terminal. The magnitude of the signal is proportional to the amount of current flowing in the constricted region of the first terminal. A method of manufacturing the module also is described.Type: GrantFiled: March 25, 2022Date of Patent: July 8, 2025Assignee: Infineon Technologies AGInventors: Juergen Hoegerl, Leo Aichriedler, Christian Schweikert, Gerald Wriessnegger