Patents Assigned to Intel Corporation
  • Patent number: 11971754
    Abstract: Embodiments are generally directed to a flexible overlapping display. An embodiment of a mobile device includes a processor to process data for the mobile device, a bendable and foldable display screen, one or more device sensors to sense an orientation of the mobile device, and one or more display sensors to sense a current arrangement of the display screen. The processor is to identify one or more portions of the display screen that are visible to a user based at least in part on data from the one or more device sensors and the one or more display sensors.
    Type: Grant
    Filed: January 27, 2023
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Guy M. Therien, David W. Browning, Joshua L. Zuniga
  • Patent number: 11973121
    Abstract: Discussed herein are device contacts in integrated circuit (IC) structures. In some embodiments, an IC structure may include: a first source/drain (S/D) contact; a gate contact, wherein the gate contact is in contact with a gate and with the first S/D contact; and a second S/D contact, wherein a height of the second S/D contact is less than a height of the first S/D contact.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Guillaume Bouche, Andy Chih-Hung Wei, Mwilwa Tambwe, Sean T. Ma, Piyush Mohan Sinha
  • Patent number: 11972269
    Abstract: Methods, apparatus, systems and articles of manufacture (e.g., physical storage media) to provide device enhancements for software defined silicon implementations are disclosed. Example non-transitory computer readable medium includes instructions to cause one or more processors to at least generate a first stock keeping unit, associate the first stock keeping unit with a semiconductor device, the first stock keeping unit associated with a first set of features to be provided by the semiconductor device, command the semiconductor device to activate a feature not included in the first set of features to cause the semiconductor device to provide a second set of features, generate a second stock keeping unit for the semiconductor device, and associate the second stock keeping unit with the semiconductor device and the second set of features to be provided by the semiconductor device.
    Type: Grant
    Filed: December 30, 2022
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Katalin Klara Bartfai-Walcott, Arkadiusz Berent, Vasuki Chilukuri, Mark Baldwin, Vasudevan Srinivasan, Bartosz Gotowalski
  • Patent number: 11973624
    Abstract: Examples described herein relate to link training between network connected devices. In some examples, an amount to extend link training is determined. The amount to extend link training can be determined by: receiving, by a receiver in a first device, signals over a lane from a transmitter in a second device, the signals indicating capability to extend link training time and amount to extend link training time; determining, at the first device, a link training time based on a default link training time and an amount to extend link training time; and performing link training based on the determined link training time. In some examples, the determined amount is highest common denominator of the received identified capability and transmitted indicated capability. In some examples, if the received communication indicates no ability to extend link training time, the link training time is a default link training time.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventor: Bruce McLoughlin
  • Patent number: 11973679
    Abstract: This disclosure describes systems, methods, and devices related to enhanced frame exchange. A device may generate a first subset of a plurality of fields, wherein the first subset is mandatory in a probe request frame. The device may generate a second subset of the plurality of fields, wherein the second subset is optional in the probe request frame regardless of capability information of the device. The device may generate the probe request frame comprising the first subset and the second subset. The device may cause to send the probe request frame to an access point (AP) device.
    Type: Grant
    Filed: August 3, 2021
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Robert Stacey, Daniel Bravo, Ido Ouzieli, Danny Alexander, Ofer Hareuveni
  • Patent number: 11973519
    Abstract: Examples described herein relate to an apparatus comprising a central processing unit (CPU) and an encoding accelerator coupled to the CPU, the encoding accelerator comprising an entropy encoder to determine normalized probability of occurrence of a symbol in a set of characters using a normalized probability approximation circuitry, wherein the normalized probability approximation circuitry is to output the normalized probability of occurrence of a symbol in a set of characters for lossless compression. In some examples, the normalized probability approximation circuitry includes a shifter, adder, subtractor, or a comparator. In some examples, the normalized probability approximation circuitry is to determine normalized probability by performance of non-power of 2 division without computation by a Floating Point Unit (FPU). In some examples, the normalized probability approximation circuitry is to round the normalized probability to a decimal.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Bhushan G. Parikh, Stephen T. Palermo
  • Patent number: 11973923
    Abstract: An example apparatus includes: a camera to record an image; memory to store instructions; and a processor in circuit with the memory, the processor to execute the instructions to: determine a depth based on: (a) the image and (b) a calibration parameter of the camera; and adjust the calibration parameter based on a temperature of the camera and the depth.
    Type: Grant
    Filed: September 2, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Aviad Zabatani, Sagy Bareket, Ohad Menashe, Erez Sperling, Alex Bronstein, Michael Bronstein, Ron Kimmel, Vitaly Surazhsky
  • Patent number: 11972303
    Abstract: Methods, apparatus, and systems to dynamically schedule a workload to among compute blocks based on temperature are disclosed. An apparatus to schedule a workload to at least one of a plurality of compute blocks based on temperature includes a prediction engine to determine (i) a first predicted temperature of a first compute block of the plurality of compute blocks and (ii) a second predicted temperature of a second compute block of the plurality of compute blocks. The apparatus also includes a selector to select between the first compute block and the second compute block for assignment of the workload. The selection is based on which of the first and second predicted temperatures is lower. The apparatus further includes a workload scheduler to assign the workload to the selected one of the first or second compute blocks.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Carin Ruiz, Bo Qiu, Columbia Mishra, Arijit Chattopadhyay, Chee Lim Nge, Srikanth Potluri, Jianfang Zhu, Deepak Samuel Kirubakaran, Akhilesh Rallabandi, Mark Gallina, Renji Thomas, James Hermerding, II
  • Patent number: 11972519
    Abstract: Described herein are techniques for learning neural reflectance shaders from images. A set of one or more machine learning models can be trained to optimize an illumination latent code and a set of reflectance latent codes for an object within a set of input images. A shader can then be generated based on a machine learning model of the one or more machine learning models. The shader is configured to sample the illumination latent code and the set of reflectance latent codes for the object. A 3D representation of the object can be rendered using the generated shader.
    Type: Grant
    Filed: June 24, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Benjamin Ummenhofer, Shenlong Wang, Sanskar Agrawal, Yixing Lao, Kai Zhang, Stephan Richter, Vladlen Koltun
  • Patent number: 11972545
    Abstract: The present disclosure provides an apparatus and method of guided neural network model for image processing. An apparatus may comprise a guidance map generator, a synthesis network and an accelerator. The guidance map generator may receive a first image as a content image and a second image as a style image, and generate a first plurality of guidance maps and a second plurality of guidance maps, respectively from the first image and the second image. The synthesis network may synthesize the first plurality of guidance maps and the second plurality of guidance maps to determine guidance information. The accelerator may generate an output image by applying the style of the second image to the first image based on the guidance information.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: April 30, 2024
    Assignee: INTEL CORPORATION
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Shandong Wang, Yurong Chen, Sungye Kim, Attila Tamas Afra
  • Patent number: 11973105
    Abstract: An integrated circuit structure comprises at least one metal gate formed in a first dielectric layer, the at least one metal gate comprising a workfunction layer and the gate oxide layer along sidewalls of the first dielectric layer. A field effect (FE) dielectric layer dielectric layer is above the first dielectric layer of the at least one metal gate. A precision resistor comprising a thin-film metallic material is formed on the FE dielectric layer above the at least one metal gate and extending laterally over the at least one metal gate.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Chieh-Jen Ku, Bernhard Sell, Leif Paulson, Kinyip Phoa, Shi Liu
  • Publication number: 20240135209
    Abstract: A first computing system includes a data store with a sensitive dataset. The first computing system uses a feature extraction tool to perform a statistical analysis of the dataset to generate feature description data to describe a set of features within the dataset. A second computing system is coupled to the first computing system and does not have access to the dataset. The second computing system uses a data synthesizer to receive the feature description data and generate a synthetic dataset that models the dataset and includes the set of features. The second computing system trains a machine learning model with the synthetic data set and provides the trained machine learning model to the first computing system for use with data from the data store as an input.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Priyanka Mudgal, Rita H. Wouhaybi
  • Publication number: 20240134786
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed for sparse tensor storage for neural network accelerators. An example apparatus includes sparsity map generating circuitry to generate a sparsity map corresponding to a tensor, the sparsity map to indicate whether a data point of the tensor is zero, static storage controlling circuitry to divide the tensor into one or more storage elements, and a compressor to perform a first compression of the one or more storage elements to generate one or more compressed storage elements, the first compression to remove zero points of the one or more storage elements based on the sparsity map and perform a second compression of the one or more compressed storage elements, the second compression to store the one or more compressed storage elements contiguously in memory.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Martin-Thomas Grymel, David Bernard, Niall Hanrahan, Martin Power, Kevin Brady, Gary Baugh, Cormac Brick
  • Publication number: 20240134705
    Abstract: Adjusting workload execution based on workload similarity. A processor may determine a similarity of a first workload to a second workload. The processor may adjust execution of the first workload based on execution parameters of the second workload and the similarity of the first workload to the second workload.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Niranjan Hasabnis, Patricia Mwove, Ellick Chan, Derssie Mebratu, Kshitij Doshi, Mohammad Hossain, Gaurav Chaudhary
  • Publication number: 20240136277
    Abstract: A device includes a device level having a metallization structure coupled to a semiconductor device and a transistor above the device level. The transistor has a body including a single crystal group III-V or group IV semiconductor material, a source structure on a first portion of the body and a drain structure on a second portion of the body, where the source structure is separate from the drain structure. The transistor further includes a gate structure including a first gate structure portion in a recess in the body and a second gate structure portion between the source structure and the drain structure. A source contact is coupled with the source structure and a drain contact is coupled with the drain structure. The source contact is in contact with the metallization structure in the device level.
    Type: Application
    Filed: December 22, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Gilbert Dewey, Ryan Keech, Cory Bomberger, Cheng-Ying Huang, Ashish Agrawal, Willy Rachmady, Anand Murthy
  • Publication number: 20240134527
    Abstract: Embodiments described herein provide a technique to enable access to entries in a surface state or sampler state using 64-bit virtual addresses. One embodiment provides a graphics core that includes memory access circuitry configured to facilitate access to the memory by functional units of the graphics core. The memory access circuitry is configured to receive a message to access an entry in a surface state or a sampler state associated with a parallel processing operation. The message specifies a base address for a surface state entry or sampler state entry. The circuitry can add the base address and the offset to determine a 64-bit virtual address for the entry in the surface state entry or the sampler state and submit a memory access request to the memory to access the entry of the surface state or sampler state.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Joydeep Ray, Michael Apodaca, Yoav Harel, Guei-Yuan Lueh, John A. Wiegert
  • Publication number: 20240135750
    Abstract: An initializer for circle distribution on a 2D surface using a polar coordinate system for image compression, video compression, motion detection, and posture detection. The initializer can also be used for sphere distribution in a 3D shape. The initializer uses a mixed deterministic and iterative/stochastic approach. Using the polar coordinate system for initialization enables coverage of the user space, and after parameters are initialized, the method transitions to a cartesian coordinate system. Methods for using the polar system in CPU units by applying an XNOR/AND architecture for neural network model compression are also described. The neural network includes a perceptron for supervised learning of binary classifiers. The unit responsible for multiplication in a MAC architecture can be replaced with a non-linear expressive function. Thus, a neural network having a non-linear expressive perceptron (quadtron) is described for solving circle distribution and other problems.
    Type: Application
    Filed: November 16, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Pawel Tomkiewicz, Pawel Zielonka, Lukasz Braszka, Monica Lucia Martinez-Canales
  • Publication number: 20240134644
    Abstract: Embodiments detailed herein relate to matrix operations. In particular, support for matrix (tile) addition, subtraction, and multiplication is described. For example, circuitry to support instructions for element-by-element matrix (tile) addition, subtraction, and multiplication are detailed. In some embodiments, for matrix (tile) addition, decode circuitry is to decode an instruction having fields for an opcode, a first source matrix operand identifier, a second source matrix operand identifier, and a destination matrix operand identifier; and execution circuitry is to execute the decoded instruction to, for each data element position of the identified first source matrix operand: add a first data value at that data element position to a second data value at a corresponding data element position of the identified second source matrix operand, and store a result of the addition into a corresponding data element position of the identified destination matrix operand.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Robert VALENTINE, Dan BAUM, Zeev SPERBER, Jesus CORBAL, Elmoustapha OULD-AHMED-VALL, Bret L. TOLL, Mark J. CHARNEY, Barukh ZIV, Alexander HEINECKE, Milind GIRKAR, Simon RUBANOVICH
  • Publication number: 20240133799
    Abstract: This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
    Type: Application
    Filed: October 24, 2022
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventor: Khaled AHMED
  • Publication number: 20240138006
    Abstract: This disclosure describes systems, methods, and devices related to adding or removing communication access points (APs) affiliated with an associated AP multi-link device (AP-MLD). A non-AP-MLD may identify a communication link between the non-AP-MLD and an AP-MLD, the communication link previously used by the non-AP-MLD; encode a request frame comprising a multi-link reconfiguration element indicative of a request to add or remove the communication link; cause the non-AP-MLD to transmit the request frame to the AP-MLD; and identify a response frame received from the AP-MLD, the response frame comprising the multi-link reconfiguration element and indicating whether the communication link was accepted or rejected to be added or removed.
    Type: Application
    Filed: December 29, 2023
    Publication date: April 25, 2024
    Applicant: Intel Corporation
    Inventors: Po-Kai Huang, Ido Ouzieli, Danny Alexander, Daniel Bravo, Laurent Cariou