Abstract: A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.

Abstract: A temperature control system includes: first adjusting the temperature of fluid in a first portion the fluid having a first temperature determined based on a second temperature higher than the first temperature or the second temperature; second adjusting the temperature of the fluid supplied to a target at a second portion between the first portion and the target; first detecting the temperature of first fluid supplied from the first to second portion; second detecting the temperature of the fluid or the target at a predetermined position between an outlet of the second portion and an inlet of the first portion; controlling the first adjusting based on the first detected value such that the temperature of the first fluid becomes a first temperature; and controlling the second adjusting based on a the second detected such that the temperature of the fluid becomes a second temperature at the predetermined position.

Abstract: A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.

Abstract: A state estimation system includes a thermal load detection unit that detects a thermal load of a device as an object, and an estimation unit that estimates a state of the device on the basis of the thermal load of the device detected by the thermal load detection unit.

Abstract: A temperature control device of the present invention includes: a top plate which is formed in a disk shape centered on an axis and has a placement surface for placing an object thereon; a Peltier member that is disposed in contact with the top plate from the direction of the axis; a cooling plate which is disposed on the Peltier member on the side opposite to the top plate in the direction of the axis to come into contact with the Peltier member and allows a refrigerant to flow therein; a cover plate which forms an accommodation space accommodating the Peltier member and the cooling plate between the top plate and the cover plate; and a pressure reducing device which reduces the pressure within the accommodation space, wherein the top plate and the cooling plate are not in contact with each other.

Abstract: A thermoelectric generation device includes: a first substrate having a first surface; a second substrate having a second surface facing the first surface; a plurality of thermoelectric generation modules each of which has a plurality of thermoelectric elements and electrodes connecting the thermoelectric elements and which is arranged between the first surface and the second surface; and wiring that is arranged on the first surface and that connects the plurality of thermoelectric generation modules.

Abstract: A substrate processing apparatus includes a chamber which has a processing room in which a substrate is processed, a cover which is provided in the processing room and is provided between the substrate and the chamber, and a heater which is provided only on the cover among the chamber and the cover and heats the cover.

Abstract: A thermoelectric module includes a thermoelectric element disposed between a pair of electrodes, and an anchor layer disposed between the electrode and the thermoelectric element and connected with the thermoelectric element.

Abstract: A temperature control device for a wafer includes: a mounting unit in which a mounting surface on which a wafer is mountable is partitioned into a plurality of areas; a temperature adjusting unit configured to adjust temperatures of the plurality of areas; temperature sensors configured to detect the temperatures of the plurality of areas; a temperature control unit configured to control the temperatures of the plurality of areas; a disturbance detecting unit configured to detect application of disturbance to the corresponding area; and a switching unit configured to feed only the detected temperature of the temperature sensor provided in the area to which application of disturbance has been detected back to the temperature control unit. The temperature adjusting unit adjusts the temperatures of the plurality of areas on the basis of the detected temperature fed back by the switching unit.

Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; and a sealing member that comes into contact with each of the top plate and the base plate.

Abstract: A thermoelectric generator module includes a first base material that is formed into a sheet and that has a thermoplastic layer, a second base material that is formed into a sheet and that has a thermoplastic layer, a plurality of thermoelectric conversion elements arranged between the first base material and the second base material, a plurality of first electrodes arranged between the first base material and the thermoelectric conversion elements, a plurality of second electrodes arranged between the second base material and the thermoelectric conversion elements, and a joint that joins the first base material to the second base material. The thermoelectric conversion elements, the plurality of first electrodes, and the plurality of second electrodes are sealed by the joint.

Abstract: A temperature adjustment device includes: a placement portion having a placement surface on which an object to be controlled temperature thereof is placed; a bottom portion facing the placement portion; a first support portion sandwiched between the placement portion and the bottom portion and supporting a center portion of the placement portion; a heat source portion disposed between the placement portion and the bottom portion and is allowed to heat and cool the object via the placement portion; a heat radiation portion disposed between the heat source portion and the bottom portion and exchanging heat with the heat source portion; and a second support portion disposed between the placement portion and the bottom portion and disposed close to the axis, wherein the second support portion supports an end portion of the heat radiation portion so as to separate the heat radiation portion from the bottom portion.

Abstract: A thermoelectric module includes a substrate, a plurality of electrodes arranged on a surface of the substrate, a plurality of thermoelectric elements respectively connected to the plurality of electrodes, and at least three terminals respectively connected to the different electrodes and connected to one or both of a first load and a second load.

Abstract: A fluid heating device includes a container in which fluid is supplied between an inner surface of an outer cylindrical member and outer surfaces of the inner cylindrical members, lamp heaters arranged in an inner cylindrical members, a nozzle member arranged on a leading end side of the lamp heaters and having an air supply port, and a guide mechanism that guides gas supplied from the air supply port of the nozzle member. The inner cylindrical members include a central inner cylindrical member arranged at a center of the outer cylindrical member, and peripheral inner cylindrical members arranged around the central inner cylindrical member. The lamp heaters include a central lamp heater arranged in the central inner cylindrical member and peripheral lamp heaters respectively arranged in the peripheral inner cylindrical members. The guide mechanism guides the gas to a leading end side of the central lamp heater.

Abstract: A temperature adjustment device includes: a pair of flow path plates, each of the pair of flow path plates including a flow path groove provided on a front surface of the each of the pair of flow path plates and at least a part of the front surface; a spacer member that includes a support surface projecting from the front surface, and connects the pair of flow path plates such that a back surface of one of the pair of flow path plates and a back surface of the other of the pair of flow path plate face each other; and a heat transfer plate that faces the flow path groove, and is supported by the support surface.

Abstract: A thermoelectric generator includes a thermoelectric generation module, a power storage unit configured to store electric charge generated from the thermoelectric generation module, a switching unit configured to switch between supply and stop of discharge to a transceiver (transmission/reception unit) driven by discharge from the power storage unit, and a determination unit configured to determine stop of discharge from the power storage unit, in which the determination unit determines stop of discharge before completion of discharge from the power storage unit.

Abstract: A temperature adjustment device includes a flow path plate that includes a flow path groove, a heat transfer plate that faces the flow path groove, and a thermoelectric module plate that is connected to the heat transfer plate. A surface roughness of the flow path plate is 0.20 ?m or more and 0.25 ?m or less.

Abstract: A detection device that is capable of being attached to a through hole includes a main body portion, a detection portion, a cover portion, an insulation portion, and an oscillation portion. The main body portion has an insertion portion and a head portion. The detection portion is arranged in the insertion portion and detects the state of a fluid. The cover portion is arranged so as to form a gap with the head portion. The insulating portion has a lateral wall having a cylindrical shape. An oscillation portion is accommodated inside the insulation portion, and performs a wireless output of a detection result of the detection portion by using the head portion, the cover portion and the gap as a slot antenna.

Abstract: A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.