Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A thermoelectric module is a thermoelectric module that performs temperature control on a temperature control target object, the thermoelectric module including: a plurality of thermoelectric elements that are provided between the temperature control target object and a substrate that is disposed to face the temperature control target object in a first direction; and a plurality of electrodes that are provided on each of a substrate side and a temperature control target object side of the thermoelectric element and configured to electrically connect the thermoelectric elements adjacent to each other in a second direction intersecting the first direction, in which the electrode includes two electrode base portions that are spaced apart from each other in the second direction, and each of which is connected to a corresponding thermoelectric element, and a connecting portion connecting the two electrode base portions.

Abstract: This thermoelectric material has a matrix in which a chemical formula is represented by A2B3, A in the chemical formula is one or more elements selected from the group consisting of Bi and Sb, and B in the chemical formula is one or more elements selected from the group consisting of Te, Se and S, in at least one of crystal grains of the matrix and crystal grain boundaries of the matrix, oxide particles containing one or more elements selected from a group C consisting of Zn, Nb and Al and telluride particles containing one or more elements selected from the group C are precipitated.

Abstract: A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.

Abstract: A substrate support device includes a placement part formed in a plate shape which extends in a horizontal direction and having a placement surface on which a substrate is placed, and a movable part which makes the placement surface conform to the substrate by moving according to a warpage of the substrate placed on the placement surface. The movable part includes an arm part including an expansion and contraction part which expands and contracts in the horizontal direction according to the warpage of the substrate placed on the placement surface, an arm body having a longitudinal direction in a vertical direction in a state in which the substrate is not placed on the placement surface, and an arm connection part which connects a lower end of the arm body to an outer end of the expansion and contraction part in the horizontal direction.

Abstract: An electrode connection structure includes a first electrode unit that includes first electrodes formed concentrically, and a second electrode unit that includes a second electrode formed into a needle shape axially movable forward and rearward and is electrically connectable to the first electrode unit, and in the electrode connection structure, the second electrode unit includes a plurality of the second electrodes that is arranged in a circumferential direction and arranged at different radial positions, and the plurality of the second electrodes is electrically connected to the first electrodes arranged at different radial positions, respectively.

Abstract: A residual charge removal device includes: a power storage unit; a first switching unit that is connected to a target to which electric power is supplied from a power supply device, and operates to remove a residual charge of the target by electric power supplied from the power storage unit; and a second switching unit that operates to supply electric power from the power storage unit to the first switching unit when electric power supply to the target is stopped.

Abstract: A thermoelectric module includes: a lower substrate; an upper substrate that is disposed above the lower substrate and faces the lower substrate; a plurality of p-type and n-type thermoelectric elements that are disposed between the lower substrate and the upper substrate; a first electrode that is disposed on an upper surface of the lower substrate and a lower surface of the upper substrate and forms a series circuit by alternately and sequentially connecting the p-type and n-type thermoelectric elements; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end portion of the series circuit and a post. The post includes a post main body that is formed of titanium, and a titanium passive film that covers a side surface of the post main body.

Abstract: A temperature control system includes: first adjusting the temperature of fluid in a first portion the fluid having a first temperature determined based on a second temperature higher than the first temperature or the second temperature; second adjusting the temperature of the fluid supplied to a target at a second portion between the first portion and the target; first detecting the temperature of first fluid supplied from the first to second portion; second detecting the temperature of the fluid or the target at a predetermined position between an outlet of the second portion and an inlet of the first portion; controlling the first adjusting based on the first detected value such that the temperature of the first fluid becomes a first temperature; and controlling the second adjusting based on a the second detected such that the temperature of the fluid becomes a second temperature at the predetermined position.

Abstract: A processing liquid temperature control apparatus includes a block body with an integral structure made of a silicon carbide sintered body, the block body having a flow path through which a semiconductor processing liquid flows, and a temperature adjustment portion provided at the block body to adjust a temperature of the semiconductor processing liquid flowing through the flow path. Accordingly, it is possible to reduce the number of parts and achieve compactness and cost reduction. In addition, it is possible to enhance heat conduction between the processing liquid and the temperature adjustment portion, and improve heat exchange efficiency.

Abstract: A state estimation system includes a thermal load detection unit that detects a thermal load of a device as an object, and an estimation unit that estimates a state of the device on the basis of the thermal load of the device detected by the thermal load detection unit.

Abstract: A temperature control device of the present invention includes: a top plate which is formed in a disk shape centered on an axis and has a placement surface for placing an object thereon; a Peltier member that is disposed in contact with the top plate from the direction of the axis; a cooling plate which is disposed on the Peltier member on the side opposite to the top plate in the direction of the axis to come into contact with the Peltier member and allows a refrigerant to flow therein; a cover plate which forms an accommodation space accommodating the Peltier member and the cooling plate between the top plate and the cover plate; and a pressure reducing device which reduces the pressure within the accommodation space, wherein the top plate and the cooling plate are not in contact with each other.

Abstract: A thermoelectric generation device includes: a first substrate having a first surface; a second substrate having a second surface facing the first surface; a plurality of thermoelectric generation modules each of which has a plurality of thermoelectric elements and electrodes connecting the thermoelectric elements and which is arranged between the first surface and the second surface; and wiring that is arranged on the first surface and that connects the plurality of thermoelectric generation modules.

Abstract: A substrate processing apparatus includes a chamber which has a processing room in which a substrate is processed, a cover which is provided in the processing room and is provided between the substrate and the chamber, and a heater which is provided only on the cover among the chamber and the cover and heats the cover.

Abstract: A thermoelectric module includes a thermoelectric element disposed between a pair of electrodes, and an anchor layer disposed between the electrode and the thermoelectric element and connected with the thermoelectric element.

Abstract: A temperature control device for a wafer includes: a mounting unit in which a mounting surface on which a wafer is mountable is partitioned into a plurality of areas; a temperature adjusting unit configured to adjust temperatures of the plurality of areas; temperature sensors configured to detect the temperatures of the plurality of areas; a temperature control unit configured to control the temperatures of the plurality of areas; a disturbance detecting unit configured to detect application of disturbance to the corresponding area; and a switching unit configured to feed only the detected temperature of the temperature sensor provided in the area to which application of disturbance has been detected back to the temperature control unit. The temperature adjusting unit adjusts the temperatures of the plurality of areas on the basis of the detected temperature fed back by the switching unit.

Abstract: A thermoelectric power generation device includes: a high-temperature plate having an upper face; a low-temperature plate having a lower face; a thermoelectric module disposed between the upper face and the lower face; a sealing portion disposed between the upper and lower faces, the sealing portion sealing the thermoelectric module at a circumferential portion of the upper face and a circumferential portion of the lower face; a first positioning portion disposed at the circumferential portion of the upper face; and a second positioning portion disposed at the circumferential portion of the lower face. The first positioning portion positions the sealing portion at the circumferential portion of the upper face, and the second positioning portion positions the sealing portion at the circumferential portion of the lower face.

Abstract: A temperature control device includes: a top plate that supports a substrate; a base plate connected to the top plate so as to form an internal space with the top plate; a thermoelectric module plate arranged in the internal space; a heat exchange plate that is arranged in the internal space and exchanges heat with the thermoelectric module plate; and a sealing member that comes into contact with each of the top plate and the base plate.

Abstract: A thermoelectric generator module includes a first base material that is formed into a sheet and that has a thermoplastic layer, a second base material that is formed into a sheet and that has a thermoplastic layer, a plurality of thermoelectric conversion elements arranged between the first base material and the second base material, a plurality of first electrodes arranged between the first base material and the thermoelectric conversion elements, a plurality of second electrodes arranged between the second base material and the thermoelectric conversion elements, and a joint that joins the first base material to the second base material. The thermoelectric conversion elements, the plurality of first electrodes, and the plurality of second electrodes are sealed by the joint.

Abstract: A temperature adjustment device includes: a placement portion having a placement surface on which an object to be controlled temperature thereof is placed; a bottom portion facing the placement portion; a first support portion sandwiched between the placement portion and the bottom portion and supporting a center portion of the placement portion; a heat source portion disposed between the placement portion and the bottom portion and is allowed to heat and cool the object via the placement portion; a heat radiation portion disposed between the heat source portion and the bottom portion and exchanging heat with the heat source portion; and a second support portion disposed between the placement portion and the bottom portion and disposed close to the axis, wherein the second support portion supports an end portion of the heat radiation portion so as to separate the heat radiation portion from the bottom portion.