Abstract: A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.

Abstract: A manufacturing time of a semiconductor device is shortened by raising and dropping a base temperature of a semiconductor wafer such as silicon wafer to a target temperature at a high speed, a semiconductor device is manufactured with high qualities by making an in-plane temperature distribution of the semiconductor wafer a desired temperature distribution with high accuracy (by uniformizing an in-plane temperature and varying the in-plane temperature distribution for each region), and furthermore, an apparatus with excellent energy efficiency can be simply configured.

Abstract: A thermoelectric module includes: a plurality of thermoelectric elements that is electrically series-connected via a plurality of electrodes; and a pair of substrates on which the plurality of electrodes are formed on facing surfaces of the pair of substrates, the pair of substrates being provided perpendicularly to a heat transfer direction with the plurality of thermoelectric elements being interposed. An electrode of an upper substrate includes a first electrode having a size enough to electrically connect the thermoelectric elements that are spaced apart from each other by a distance corresponding to an area equivalent to an adjacent pair of the thermoelectric elements. An electrode of a lower substrate is provided correspondingly to a maximum placement number of the thermoelectric elements interposed between the substrates, and also has a size enough to electrically connect the adjacent pair of the thermoelectric elements.

Abstract: A temperature regulator having a heat exchange unit and a power supply and control unit and providing a heat-exchange apparatus, which can be installed in a minimal space and yet is very easy to handle. The temperature regulator includes a heat exchange unit which has a tank, a pump and a heat exchanger, and circulates a liquid to exchange heat with circulating liquid, and a power supply and control unit which has a power supply and control device, and controls temperature of the circulating liquid. The heat exchange unit and the power supply and control unit are arranged in an interior of a main frame.

Abstract: A thermoelectric module (1) utilizing the Peltier effect, exhibiting an element-occupied area ratio of 40% or below, the element-occupied area ratio defined as the ratio of the sum of cross-sectional areas, perpendicular to the direction of electric current passage, of thermoelectric elements (5a,5b) to the area of insulating substrate (2a) being in contact with an object to be cooled via a metalized layer (4a), wherein metalized layers (4a,4b) are provided with slits. In this construction, there can be prevented breakage of thermoelectric device by thermal stress occurring at assembly, or thermal stress occurring at pre-tinning conducted in advance for attaching an object to be cooled or at attaching package, etc.

Abstract: An estimator estimates the outlet temperature of fluid at an outlet of heating tanks to which no outlet temperature sensor is provided. For a heating tank to which an outlet temperature sensor is provided, a control unit determines an manipulated variable on the basis of the outlet temperature which has been measured and a target temperature, while it determines an manipulated variable for a heating tank to which no outlet temperature sensor is provided, on the basis of the estimated temperature estimated by the estimator and a target temperature.

Abstract: A film-like temperature sensor for more accurately measuring the temperatures at plural locations on the surface of a semiconductor wafer comprises a base film made of an insulating material; plural thin-film thermal elements for sensing temperature; plural thin-film leads, connected to the thermal elements; and plural thin-film terminals connected to the ends of the leads. The thermal elements, leads, and terminals are integrally formed either on the surface or in the thickness of the base film. The base film has a flat shape like a paddle, and comprises a head portion to be attached to the surface of a semiconductor wafer, and a strip-shaped tail portion extending outwardly of the semiconductor wafer. The plural thermal elements are arranged on the head portion in the form of either a concentric circle, spiral, matrix, or raster, and the plural terminals are arranged on the tail portion.