Patents Assigned to Kemet Electronics
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Patent number: 9312074Abstract: A method for preparing a solid electrolytic capacitor and an improved solid electrolytic capacitor is provided. The method includes providing an anode, forming a dielectric on the anode and forming a cathode on the dielectric wherein the cathode comprises interlayers. At least one interlayer comprises a monomer, oligomer or polymer with multifunctional or multiple reactive groups and an adjacent layer comprises a molecule with crosslinkable functionality. The oligomer or polymer with multifunctional or multiple reactive groups on one layer react with the crosslinkable functionality in the adjacent layer.Type: GrantFiled: February 26, 2013Date of Patent: April 12, 2016Assignee: Kemet Electronics CorporationInventors: Antony P. Chacko, Danny Yiu Kai Hui
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Patent number: 9293263Abstract: An outer insulation member made of a first resin packs a part of an anode terminal. The packed part of the anode terminal has a predetermined section. All surfaces of the predetermined section consist of a front surface, a back surface and edges connecting between the front surface and the back surface. The front surface includes a connection area. An anode lead wire is connected to the connection area while being not connected to the anode terminal other than the connection area. The all surfaces of the predetermined section are completely covered with a mask layer made of a second resin except for the connection area. The second resin is different from the first resin in at least one of composition thereof, content of an inclusion, size of an inclusion and shape of an inclusion.Type: GrantFiled: January 29, 2014Date of Patent: March 22, 2016Assignees: KEMET Electronics Corporation, NEC Tokin CorporationInventors: Yanming Liu, Yuji Yoshida, Hayato Ueda, Daisuke Takada, Satoshi Iwai, Takashi Mizukoshi
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Patent number: 9287844Abstract: An improved electronic filter is provided with capacitance and integral inductance properties. The filter has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes. A third termination is provided and a conductive trace on a surface of the capacitor is between the third termination and the first termination. A ferromagnetic or ferrimagnetic material is coupled to the conductive trace.Type: GrantFiled: July 5, 2012Date of Patent: March 15, 2016Assignee: KEMET Electronics CorporationInventors: John Bultitude, Mark R. Laps, James R. Magee, Lonnie G. Jones
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Patent number: 9190214Abstract: An improved capacitor, and method for making the capacitor, is described. The capacitor has an anode and a dielectric on the anode. A cathode layer is on the dielectric wherein the cathode layer comprises at least one conductive layer and an insulative adhesion enhancing layer.Type: GrantFiled: July 30, 2009Date of Patent: November 17, 2015Assignee: KEMET ELECTRONICS CORPORATIONInventors: Antony P. Chacko, Debra L. Naramore
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Patent number: 9171672Abstract: A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations.Type: GrantFiled: June 26, 2012Date of Patent: October 27, 2015Assignee: Kemet Electronics CorporationInventors: John E. McConnell, John Bultitude, Lonnie Jones, Alan Webster
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Patent number: 9147530Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.Type: GrantFiled: September 4, 2013Date of Patent: September 29, 2015Assignee: KEMET Electronics CorporationInventors: Steven C. Hussey, Yuri Freeman, Philip M. Lessner, Qingping Chen, Javaid Qazi
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Patent number: 9142353Abstract: A discharge capacitor for use in electronic circuits is described. The discharge capacitor has first internal electrodes in electrical contact with a first external termination and second internal electrodes parallel to and interleaved with the first internal electrodes wherein the second internal electrodes are in electrical contact with a second external termination. A dielectric is between the first internal electrodes and adjacent second internal electrodes. A first discharge gap is between at least one first internal electrode of said first internal electrodes and said second external termination.Type: GrantFiled: April 28, 2014Date of Patent: September 22, 2015Assignee: KEMET Electronics CorporationInventors: John Bultitude, Mark R. Laps, Lonnie G. Jones
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Publication number: 20150213961Abstract: An outer insulation member made of a first resin packs a part of an anode terminal. The packed part of the anode terminal has a predetermined section. All surfaces of the predetermined section consist of a front surface, a back surface and edges connecting between the front surface and the back surface. The front surface includes a connection area. An anode lead wire is connected to the connection area while being not connected to the anode terminal other than the connection area. The all surfaces of the predetermined section are completely covered with a mask layer made of a second resin except for the connection area. The second resin is different from the first resin in at least one of composition thereof, content of an inclusion, size of an inclusion and shape of an inclusion.Type: ApplicationFiled: January 29, 2014Publication date: July 30, 2015Applicants: NEC TOKIN CORPORATION, Kemet Electronics CorporationInventors: Yanming Liu, Yuji Yoshida, Hayato Ueda, Daisuke Takada, Satoshi Iwai, Takashi Mizukoshi
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Patent number: 9087648Abstract: An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.Type: GrantFiled: March 25, 2013Date of Patent: July 21, 2015Assignee: Kemet Electronics CorporationInventors: John Bultitude, Lonnie G. Jones, James R. Magee, Kitae Park
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Patent number: 9053866Abstract: An improved solid electrolytic capacitor and method of forming a solid electrolytic capacitor is described. The method includes forming an anode comprising a valve metal or conductive oxide of a valve metal wherein an anode lead extension protrudes from the anode. A dielectric is formed on the anode and a cathode layer is formed on the dielectric. The anode, dielectric, and cathode layer are encased in a non-conducting material and the anode lead extension is exposed outside of the encasement at a side surface. A conductive metal layer is adhered to the anode lead extension which allows termination preferably by electrically connecting a preformed solid metal terminal, most preferably an L shaped terminal, to the conductive metal layer at the side surface.Type: GrantFiled: May 15, 2013Date of Patent: June 9, 2015Assignee: Kemet Electronics CorporationInventors: Brandon Summey, Jeffrey Poltorak, Philip M. Lessner, Yongjian Qiu, Randolph S. Hahn, David Jacobs, Keith R. Brenneman, Albert K. Harrington, Chris Stolarski
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Patent number: 9030806Abstract: A improved process for preparing a conductive polymer dispersion is provided as is an improved method for making capacitors using the conductive polymer. The process includes providing a monomer solution and shearing the monomer solution with a rotor-stator mixing system comprising a perforated stator screen having perforations thereby forming droplets of said monomer. The droplets of monomer are then polymerized during shearing to form the conductive polymer dispersion.Type: GrantFiled: January 25, 2013Date of Patent: May 12, 2015Assignee: Kemet Electronics CorporationInventors: Antony P Chacko, Yaru Shi, John Ols
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Patent number: 9030807Abstract: A process for preparing a solid electrolytic capacitor comprising application of coverage enhancing catalyst followed by application of a conducting polymer layer wherein the conductive polymeric cathode comprises the coverage enhancement catalyst wherein the conductive polymeric layer has improved coverage of the corners and edges. Coverage enhancing catalyst is removed after coating and curing.Type: GrantFiled: February 15, 2012Date of Patent: May 12, 2015Assignee: Kemet Electronics CorporationInventors: Antony P. Chacko, Qingping Chen, Yang Jin, Philip M. Lessner, Randolph S. Hahn, Yongjian Qiu, Keith R. Brenneman
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Patent number: 9025311Abstract: An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.Type: GrantFiled: April 23, 2013Date of Patent: May 5, 2015Assignee: Kemet Electronics CorporationInventors: John Bultitude, John E. McConnell, Abhijit Gurav
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Patent number: 8988857Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.Type: GrantFiled: December 13, 2011Date of Patent: March 24, 2015Assignee: Kemet Electronics CorporationInventors: John E. McConnell, Alan P. Webster, Lonnie G. Jones, Garry L. Renner, Jeffrey Bell
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Patent number: 8982536Abstract: A capacitor with improved ESR and improved volumetric efficiency. The capacitor has an anode body wherein the anode body comprises a face and an inward offset which is inset from the face by a distance. An anode wire extends from a front side of the anode body wherein the front side is adjacent the face. A dielectric is on the anode body and a conductive cathode layer is on the dielectric. A cathode lead is in the inward offset and in electrical contact with the conductive cathode layer wherein the conductive cathode layer is between the cathode lead and the inward offset.Type: GrantFiled: October 12, 2012Date of Patent: March 17, 2015Assignee: Kemet Electronics CorporationInventors: Joao Candeias, John T Kinard
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Patent number: 8947852Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.Type: GrantFiled: May 30, 2013Date of Patent: February 3, 2015Assignee: Kemet Electronics CorporationInventors: Lonnie G. Jones, John Bultitude, Mark R. Laps, James R. Magee, Jeffrey W. Bell
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Publication number: 20150029642Abstract: A capacitor with improved electronic properties is described. The capacitor has an anode, a dielectric on said anode and a cathode on the dielectric. The cathode has a conductive polymer defined as —(CR1R2CR3R4—)x— wherein at least one of R1, R2, R3 or R4 comprises a group selected from thiophene, pyrrole or aniline with the proviso that none of R1, R2, R3 or R4 contain —SOOH or COOH; a organofunctional silane; and an organic compound with at least two functional groups selected from the group consisting of carboxylic acid and epoxy.Type: ApplicationFiled: July 23, 2014Publication date: January 29, 2015Applicant: Kemet Electronics CorporationInventors: Yaru Shi, Antony P. Chacko, Edgar White
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Patent number: 8910356Abstract: A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.Type: GrantFiled: May 24, 2010Date of Patent: December 16, 2014Assignee: Kemet Electronics CorporationInventors: Michael S. Randall, Chris Wayne, John McConnell
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Patent number: 8904609Abstract: A capacitor with a combined with a resistor and/or fuse is described. This safe capacitor can rapidly discharge through the resistor when shorted. The presence of a fuse in series with the capacitor and results in a resistive failure when this opens during and overcurrent condition. Furthermore, the presence of a resistor in parallel to the capacitor allows the energy to be rapidly dissipated when a failure occurs.Type: GrantFiled: December 8, 2011Date of Patent: December 9, 2014Assignee: Kemet Electronics CorporationInventors: John Bultitude, John E. McConnell
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Patent number: 8902567Abstract: A capacitor with an anode and a dielectric over the anode. A first conductive polymer layer is over the dielectric wherein the first conductive polymer layer comprises a polyanion and a first binder. A second conductive polymer layer is over the first conductive polymer layer wherein the second conductive polymer layer comprises a polyanion and a second binder and wherein the first binder is more hydrophilic than the second binder.Type: GrantFiled: May 24, 2012Date of Patent: December 2, 2014Assignee: Kemet Electronics CorporationInventor: Antony Chacko