Abstract: An apparatus includes a top assembly, a bottom assembly, and a diaphragm assembly. The bottom assembly is coupled to the top assembly to form an overall assembly. The diaphragm assembly includes a ring and a diaphragm flexible member that is attached to the ring. The ring forms an opening and at least one strengthening member is disposed at least partially across the opening. The at least one strengthening member is configured to provide strength and maintain a predetermined compliance of the diaphragm flexible member.

Abstract: An acoustic system includes a receiver or microphone, a tube, a barrier, and an equalization device. The receiver is capable of outputting an audio signal. The tube is in connection with the receiver and the audio signal travels along a length of the tube. The barrier is fitted along the tube and the barrier prevents moisture from passing along the tube toward the receiver. The barrier causes an amount of damping to the audio signal. The equalization device is in connection with the receiver and the equalization device counteracts the damping by the barrier. The barrier is configured to have a submersion rating greater than or equal to 7 IP.

Abstract: A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.

Abstract: An armature apparatus includes a first tine member, a second tine member, a center tine member, and a connecting portion. The first tine member has a first length and a first width and these define a first surface. The second tine member has a second length and a second width and these define a second surface. The first surface generally faces the second surface and the first surface is generally parallel relation to the second surface. The center tine member has a third length and the third length is generally parallel to the first length and the second length. The connecting portion couples the center tine member to the first surface along the first length and to the second surface along the second length. The center tine member is generally disposed in a plane extending between the first tine member and the second tine member and the plane divides the first surface of the first tine member and the second surface of the second tine member.

Abstract: The directivity pattern of a MEMS microphone is adjusted. An indication of a position of a MEMS microphone is received and the microphone includes at least one diaphragm. An adjustment to the position of the MEMS microphone is determined. Based upon the adjustment, a position of the at least one diaphragm is adjusted. The adjusting is effective to alter a directivity pattern of the microphone.

Abstract: A microphone and orientation sensor system includes a microphone and an orientation sensor. The microphone has a diaphragm. The orientation sensor includes an inertial load member having a first end and a second end opposite the first end. The sensor also includes at least one electrode positioned adjacent to the inertial load member. The sensor further includes a beam. The inertial load member pivots about the beam, and the pivoting of the load member causes a change in a distance between the first end and the electrode resulting in a change in capacitance between the first end and the electrode. The diaphragm and electrode are formed from a common layer of material.

Abstract: A strain absorption bridge for use in a MEMS package includes a first substrate that is configured to be attachable to a circuit board. A first elastically deformable element is coupled to the first substrate and the first elastically deformable element is configured to be attachable to a MEMS device. Alternatively, the MEMS device may be attached to the first substrate. The elastically deformable element at least partially absorbs and dissipates mechanical strain communicated from the circuit board before the mechanical strain can reach the MEMS device.

Abstract: A receiver is provided having a balanced armature motor mechanically interconnected to a displaceable diaphragm component. A front volume changes as the displaceable diaphragm component moves. The front volume is connected to a port. A rear volume changes oppositely to the front volume as the displaceable diaphragm moves. An acoustic channel connects to the port and is also connected to a sound outlet. The sound outlet allows acoustic energy to exit from the acoustic channel. A first acoustic pressure is generated in the front volume as the balanced armature motor moves the diaphragm. The acoustic channel and the internal volume are divided by a common wall section, wherein the common wall section is defined by at least one of the walls of the housing which also provides a portion of at least one wall for the acoustic channel.

Abstract: A microphone includes a housing; a back volume within the housing; a diaphragm within the housing; a backplate attached to the housing; and a diaphragm ring connected to the diaphragm. The diaphragm ring has a body defined by an outer perimeter and at least a first inner perimeter and a second inner perimeter adjacent the first inner perimeter. The first inner perimeter is adjacent to a top surface of the diaphragm ring. The second inner perimeter is adjacent to the bottom surface of the diaphragm ring. The second inner perimeter is smaller than the first inner perimeter.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.

Abstract: A miniature electret microphone includes a housing, a back plate/diaphragm assembly, an integrated circuit and a filter circuit. The housing for the microphone includes a sound inlet port. The back plate/diaphragm assembly is disposed within the housing and the assembly has an output responsive to sound pressure incident on the diaphragm. The integrated circuit includes a floating ground substrate and a p-n junction disposed within the housing coupled to the output. The filter circuit is formed within the integrated circuit, the filter circuit including a capacitor formed by the p-n junction.

Abstract: A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel.

Abstract: A microphone (100) and method of manufacture thereof is disclosed. The microphone (100) includes a housing (108), a diaphragm assembly (120), a spacer (134), a backplate assembly (140), a body assembly (150), and a printed circuit board (164) disposed within the housing (100). The diaphragm assembly (120) and the backplate assembly (140) constitute a variable capacitor responsive to sound pressure level changes coupled through an acoustic port (118). The base capacitance is inversely proportional to the thickness of the spacer (134). The backplate assembly (140) is disk shaped with protrusions and coupled to the body assembly (150) such that an acoustic passage (172) is formed between an outer edge of the backplate assembly (140) and an inner periphery of the hollow body assembly (150). The body assembly (150) comprises conductive mount (158) for electrically coupling the backplate assembly (140) to a first surface (166) of a circuit board (164).

Abstract: A connector assembly includes a plug and a socket. The plug includes at least one conductive pin, at least one first electrical conductor coupled to the at least one conductive pin, and a base portion and a column portion. The column portion extends from the base portion and defines at least one slot along a length of the column portion. The column portion is constructed of a compliant material and includes at least one opening that extends through the base portion. The openings and slots are aligned such that the at least one conductive pin extends through the at least one opening and is received in the at least one slot. The socket has an inner surface and includes at least one second electrical conductor that extends through the socket, and holds the plug. When the plug is received by the socket, an interference fit is formed and maintained as between the second electrical conductor and the conductive pin. The base portion of the plug and the inner surface of the socket are engaged to create a seal.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board.

Abstract: The present invention relates to a surface mount package for a silicon condenser microphone. The inventive package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate which performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the die and the package, and providing an exterior surface for making electrical connections between package and a user's printed circuit board. In some embodiments, the acoustic port is located in the substrate directly under the silicon condenser die which decreases the thickness of the inventive package.

Abstract: A miniature electret microphone includes an input buffer circuit. The input buffer circuit includes an integrated circuit including a floating ground substrate and a p-n junction. The p-n junction is coupled as a capacitor to a filter circuit of the input buffer circuit.

Abstract: A listening device for presenting at least one audio signal to a user comprises a first ear piece and a second ear piece, each of the first ear piece and the second ear piece including at least one speaker and each being adapted to block substantially all external sounds from entering an ear of a user. The device further comprises a microphone for sensing a first audio signal and a differential amplifier coupled to the microphone for amplifying the first audio signal. The differential amplifier is coupled to a first electrical ground. A switching arrangement coupled to and receiving a second audio signal from an external audio source and the external audio source having a second electrical ground that is electrically distinct from the first electrical ground.

Abstract: An armature for a receiver comprising a first and a second leg portion each having a thickness and a width and connected to each other, and a connection portion in communication with the first and second leg portions. The connection portion has a width greater than the width of the first and second leg portions individually. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions. According to one aspect of the invention, the first and second leg portions are integrally formed with the connection portion and the connection portion includes a least a portion having a thickness less than the thickness of the first and second leg portions individually to reduce the stiffness of the armature. According to another aspect of the invention, the first and second leg portions are separately formed and attached to the connection portion in a way that reduces the stiffness of the armature.

Abstract: A silicon condenser microphone package and method for manufacture are disclosed. The silicon condenser microphone package includes a silicon condenser microphone die, a substrate comprising a conductive layer, and a cover having a conductive layer, where the conductive layers of the substrate and cover are electrically connected to form an electromagnetic interference shield for the silicon condenser microphone die. The method for manufacturing the silicon condenser microphone package involves placement of a plurality of silicon condenser microphone dies on a panel of printed circuit board material, placement of covers over each of the silicon condenser microphone dies, and then separating the panel into individual packages.