Patents Assigned to Knowles Electronics, LLC
  • MICROPHONE ASSEMBLY
    Publication number: 20140064546
    Abstract: A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.
    Type: Application
    Filed: July 30, 2013
    Publication date: March 6, 2014
    Applicant: KNOWLES ELECTRONICS, LLC
    Inventors: John B. Szczech, Gregory B. Servis, Peter Van Kessel, Peter V. Loeppert
  • Methods of manufacture of bottom port surface mount silicon condenser microphone packages
    Patent number: 8652883
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: February 18, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Microphone Assembly With Barrier To Prevent Contaminant Infiltration
    Publication number: 20140044297
    Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 13, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, Ryan M. McCall, Daniel Giesecke, Sandra F. Vos, John B. Szczech, Sung Bok Lee, Peter Van Kessel
  • Microphone Assembly
    Publication number: 20140037120
    Abstract: A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.
    Type: Application
    Filed: July 29, 2013
    Publication date: February 6, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Qing Wang, Sandra F. Vos
  • Housing And Method To Control Solder Creep On Housing
    Publication number: 20140037124
    Abstract: An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.
    Type: Application
    Filed: July 24, 2013
    Publication date: February 6, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Kurt B. Friel
  • MEMS Apparatus Disposed On Assembly Lid
    Publication number: 20140037115
    Abstract: A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.
    Type: Application
    Filed: July 29, 2013
    Publication date: February 6, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Sandra F. Vos, John B. Szczech
  • Methods of manufacture of top port multipart surface mount silicon condenser microphone package
    Patent number: 8633064
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's sprinted circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 21, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Bottom port surface mount silicon condenser microphone package
    Patent number: 8629551
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: January 14, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Top port multi-part surface mount silicon condenser microphone package
    Patent number: 8629552
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 14, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Methods of manufacture of bottom port surface mount silicon condenser microphone packages
    Patent number: 8629005
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 14, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Earphone Assembly With Moisture Resistance
    Publication number: 20140010399
    Abstract: An acoustic system includes a receiver (or microphone), a tube, or a moisture resistant screen. The receiver is capable of outputting an audio signal, while the microphone receives an audio signal. The tube is in connection with the receiver (or microphone) and the audio signal travels along a length of the tube. The moisture resistant screen is fitted at an end of the tube. The moisture resistant screen prevents moisture from passing along the tube toward the receiver, and causes an amount of damping to the audio signal. The moisture resistant screen is configured to have a submersion rating greater than or equal to 7 IP.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Timothy K. Wickstrom, William J. Ballad, Ying-Tzu Chan, Mei-Yu Lin, Jen Nan Feng
  • Top port surface mount silicon condenser microphone package
    Patent number: 8624385
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Bottom port multi-part surface mount silicon condenser microphone package
    Patent number: 8624386
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Methods of manufacture of top port surface mount silicon condenser microphone packages
    Patent number: 8623709
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Top port multi-part surface mount silicon condenser microphone package
    Patent number: 8624387
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Bottom port surface mount silicon condenser microphone package
    Patent number: 8624384
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
    Patent number: 8623710
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 7, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
    Patent number: 8617934
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 31, 2013
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Back Plate Apparatus with Multiple Layers Having Non-Uniform Openings
    Publication number: 20130343580
    Abstract: An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.
    Type: Application
    Filed: June 6, 2013
    Publication date: December 26, 2013
    Applicant: Knowles Electronics, LLC
    Inventors: Eric J. Lautenschlager, Peter V. Loeppert
  • Buffering apparatus and method
    Patent number: 8604880
    Abstract: The output impedance of an amplifier is substantially matched to an input impedance of a receiver using a buffer circuit. The buffer circuit includes a primary transistor and a secondary transistor. A first back gate terminal of the primary transistor is coupled to a second back gate terminal of the secondary transistor and the primary transistor is configured to have an output for the buffer circuit. An input signal is received from the amplifier at a gate terminal of the secondary transistor. The first back gate terminal of the primary transistor is responsively driven independently from the output of the buffer circuit to effectively adjust a transconductance of the primary transistor and substantially match an output impedance of the amplifier with an input impedance of the receiver.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: December 10, 2013
    Assignee: Knowles Electronics, LLC
    Inventor: Steven E. Boor