Abstract: The claim invention is directed at a MEMS microphone die fabricated using CMOS-based technologies. In particular, the claims are directed at various aspects of a MEMS microphone die having anisotropic springs, a backplate, a diaphragm, mechanical stops, and a support structure, all of which are fabricated as stacked metallic layers separated by vias using CMOS fabrication technologies.

Abstract: A test fixture includes a first barrier structure, a second barrier structure, a gap between the first barrier structure and the second barrier structure, at least one isolator disposed in the gap that is configured to couple the first barrier structure to the second barrier structure, and a test bed disposed within the second barrier structure and configured to have acoustic devices coupled thereto. The first barrier structure, the second barrier structure, the gap, and the at least one isolator act and are effective to dampen vibrations of the fixture and provide an acoustic isolation for the acoustic devices at the test bed from acoustic or vibrational energy originating from outside the fixture.

Abstract: Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates. Each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.

Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, each substrate having an acoustic port, and each MEMS microphone die is substrate-mounted and acoustically coupled to its respective acoustic port. Individual covers are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die. The completed panel is singulated to form individual MEMS microphones.

Abstract: A top port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover with an acoustic port, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: At a processing device, a first signal from a first microphone and a second signal from a second microphone are received. The first signal indicates whether a voice signal has been determined at the first microphone, and the second signal indicates whether a voice signal has been determined at the second microphone. When the first signal indicates potential voice activity or the second signal indicates potential voice activity, the processing device is activated to receive data and the data is examined for a trigger word. When the trigger word is found, a signal is sent to an application processor to further process information from one or more of the first microphone and the second microphone. When no trigger word is found, the processing device is reset to deactivate data input and allowing the first microphone and the second microphone to enter or maintain an event detection mode of operation.

Abstract: A top port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover with an acoustic port, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: A bottom port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's printed circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, each substrate having an acoustic port, and each MEMS microphone die is substrate-mounted and acoustically coupled to its respective acoustic port. Individual covers are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die. The completed panel is singulated to form individual MEMS microphones.

Abstract: An acoustic apparatus includes a first acoustic element, a second acoustic element, and a registration portion. The first acoustic element and the second acoustic element are elements such as a coil, a reed, or a yoke. The registration portion is configured to register the first acoustic element with respect to the second acoustic element such that an exact and relative alignment and positioning between the first acoustic element and second acoustic element is provided and ensured.

Abstract: An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event.

Abstract: An acoustic apparatus includes a top assembly and a bottom assembly. The bottom assembly is coupled to the top assembly to form an overall assembly. A diaphragm assembly is disposed in the overall assembly so as to separate the overall assembly into a front volume and a back volume. The diaphragm assembly includes a frame and the frame has a first end, a second end, and a middle portion that is disposed between the first end and the second end. The first end and the second end are not in the same plane as the middle portion. The first end is coupled to the bottom assembly and the second end is coupled to the top assembly.

Abstract: First analog signals are received from a first microphone, converted into first digital data and stored in a first buffer. A determination is made as to whether voice activity has occurred when voice activity is determined, a voice activity detect signal is sent to an external processor. The external processor responsively provides an exterior clock signal upon receiving the voice activity detect signal. Second analog signals are received from a second microphone, converted into second digital data and stored in a second buffer. The first digital data in the first buffer is not necessarily synchronized in real time with the second digital data in the second buffer. The first digital data from the first buffer and the second digital data from the second buffer is decimated using the external clock to provide decimated output data, the decimated output data having the first digital data and the second digital data aligned in real time.

Abstract: A microphone includes a microelectromechanical system (MEMS) circuit and an integrated circuit. The MEMS circuit is configured to convert a voice signal into an electrical signal, and the integrated circuit is coupled to the MEMS circuit and is configured to receive the electrical signal. The integrated circuit and the MEMS circuit receive a clock signal from an external host. The clock signal is effective to cause the MEMS circuit and integrated circuit to operate in full system operation mode during a first time period and in a voice activity mode of operation during a second time period. The voice activity mode has a first power consumption and the full system operation mode has a second power consumption. The first power consumption is less than the second power consumption. The integrated circuit is configured to generate an interrupt upon the detection of voice activity, and send the interrupt to the host.

Abstract: Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port disposed in the lid. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.

Abstract: Streaming audio is received. The streaming audio includes a frame having plurality of samples. An energy estimate is obtained for the plurality of samples. The energy estimate is compared to at least one threshold. In addition, a band pass estimate of the signal is determined. An energy estimate is obtained for the band-passed plurality of samples. The two energy estimates are compared to at least one threshold each. Based upon the comparison operation, a determination is made as to whether speech is detected.

Abstract: A human interface device is provided, having a substrate. A strain sensitive die is coupled to the substrate wherein the die is capable of providing an electrical signal indicative of a force applied to the strain sensitive die. A force transfer element is positioned adjacent to the strain sensitive die and coupled to the strain sensitive die. A translation element is mechanically coupled to the force transfer element. An elastic element is at least partially surrounding the translation element and the force transfer element, wherein the elastic element provides the mechanical coupling between the translation element and the force transfer element. A force applied to the translation element causes stretching of the elastic element, wherein the stretching of the elastic element causes a force to be applied to the force transfer element; and wherein the force applied to the force transfer element by the elastic element is then applied to the strain sensitive die.

Abstract: A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening.

Abstract: An acoustic system includes a receiver (or microphone), a tube, or a moisture resistant screen. The receiver is capable of outputting an audio signal, while the microphone receives an audio signal. The tube is in connection with the receiver (or microphone) and the audio signal travels along a length of the tube. The moisture resistant screen is fitted at an end of the tube. The moisture resistant screen prevents moisture from passing along the tube toward the receiver, and causes an amount of damping to the audio signal. The moisture resistant screen is configured to have a submersion rating greater than or equal to 7 IP.

Abstract: Methods for manufacturing multiple top port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from a panel of unsingulated substrates, and each MEMS microphone die is substrate-mounted. Individual covers, each with an acoustic port, are joined to the panel of unsingulated substrates, and each individual substrate and cover pair cooperates to form an acoustic chamber for its respective MEMS microphone die, which is acoustically coupled to the acoustic port in the cover. The completed panel is singulated to form individual MEMS microphones.