Patents Assigned to Knowles Electronics, LLC
  • Patent number: 7995789
    Abstract: A transducer comprising a pair of spaced magnets at least partially forming a tunnel having a central axis. A coil having a first and a second side wall and an upper and a lower wall at least partially forms the tunnel. A reed having a central portion extends through the tunnel. The reed has a stationary end, a deflection end, and a tip portion which lies at least partially between the magnets, wherein the reed is mounted for deflection towards or away from the respective magnets.
    Type: Grant
    Filed: June 21, 2007
    Date of Patent: August 9, 2011
    Assignee: Knowles Electronics, LLC
    Inventors: Paris Tsangaris, Thomas E. Longwell, Thomas E. Miller, Dennis Ray Kirchhoefer, Daniel M. Warren
  • Patent number: 7921540
    Abstract: A linkage assembly (140) is used for mechanically coupling an armature (124) and a diaphragm (118) of a balanced receiver (100), the linkage assembly (140) formed from a first linkage member (822) displaced from a strip of stock material (800) relative to the plane of the stock material (800) and a second linkage member (826) displaced from the strip (800) relative to the plane. The first and second linkage members (822, 826) are then joined while secured to the strip (800). At least one severable connecting member (870a-c) securing the linkage member to the strip (800) is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly (140).
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: April 12, 2011
    Assignee: Knowles Electronics, LLC
    Inventors: Mekell Jiles, David Earl Schafer
  • Patent number: 7925041
    Abstract: A linkage assembly is used for mechanically coupling an armature and a diaphragm of a balanced receiver, the linkage assembly formed from a first linkage member displaced from a strip of stock material relative to the plane of the stock material and a second linkage member displaced from the strip relative to the plane. The first and second linkage members are then joined while secured to the strip. At least one severable connecting member securing the linkage member to the strip is severed to release the linkage member from the strip for assembly of the linkage member into the receiver. A method of forming a three-dimensional structure from flat stock is used to form the linkage assembly.
    Type: Grant
    Filed: November 1, 2007
    Date of Patent: April 12, 2011
    Assignee: Knowles Electronics, LLC
    Inventors: Mekell Jiles, David Earl Schafer
  • Patent number: 7869610
    Abstract: A bone conduction transducer suitable for use in a listening device, such as hearing aids, in-ear monitors, headphones, electronic hearing protection devices, and very small scale acoustic speakers, has an end mass assembly disposed within the housing. The end mass assembly is mounted to the acoustic assembly and operatively coupled to the motor assembly via a coupling assembly.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: January 11, 2011
    Assignee: Knowles Electronics, LLC
    Inventors: Vignesh Jayanth, Henry G. Nepomuceno
  • Patent number: 7860264
    Abstract: An acoustic assembly for use in a transducer includes a multi-layer structure. A first layer member includes a first center portion, a first edge portion and a first aperture separating the first center portion and the first edge portion. A second layer member includes a second center portion, a second edge portion and a second aperture separating the second center portion and the second edge portion such that the second center portion is free to move relative to the second edge portion. The first and second layers are formed into an assembly wherein the first center portion and the second center portion are coupled, the first edge portion and the second edge portion are coupled, and the first aperture and the second aperture are substantially aligned to define a passageway. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: December 28, 2010
    Assignee: Knowles Electronics, LLC
    Inventors: Mekell Jiles, David Earl Schafer, Anthony D. Minervini, Hanny Sunarto, Thomas Edward Miller, Daniel Max Warren
  • Patent number: 7817815
    Abstract: An armature for a receiver includes a first leg portion, a second leg portion, and a connection portion in communication with the first and second leg portions. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions.
    Type: Grant
    Filed: January 15, 2004
    Date of Patent: October 19, 2010
    Assignee: Knowles Electronics, LLC
    Inventor: Thomas E. Miller
  • Patent number: 7747032
    Abstract: A transducer assembly may include a first transducer having a first front volume, a first back volume and a first port acoustically coupled to the first front volume; and a second transducer having a second front volume, a second back volume and second port acoustically coupled to the second front volume. The first front volume and the second front volume are acoustically coupled to increase the effective back volume of both the first transducer and the second transducer. An optional signal processing circuit may be used to control the output of the first transducer based upon a signal received from the second transducer.
    Type: Grant
    Filed: May 9, 2006
    Date of Patent: June 29, 2010
    Assignee: Knowles Electronics, LLC
    Inventors: John Zei, Dennis R. Kirchhoefer, Evan Llamas-Young
  • Patent number: 7706559
    Abstract: A microphone assembly comprises a housing that includes a conductive material. A preamplifier circuit is disposed within the housing, the preamplifier circuit having a signal input and a ground terminal. A microphone portion is disposed within the housing, the microphone portion having an output coupled to the signal input of the preamplifier circuit. A ribbon wire is attached to the ground terminal of the preamplifier circuit and is attached to the housing.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: April 27, 2010
    Assignee: Knowles Electronics, LLC
    Inventor: James S. Collins
  • Patent number: 7688987
    Abstract: A microphone buffer circuit being adaptable for connection to a power source is disclosed. The microphone buffer circuit includes an input transistor operably connected between an input and an output for buffering an input signal. The microphone buffer circuit includes a means for reducing power supply noise capable of being coupled to the input transistor wherein the means being operably connected to the input transistor and the power source.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: March 30, 2010
    Assignee: Knowles Electronics, LLC
    Inventor: Steven E. Boor
  • Patent number: 7680292
    Abstract: A receiver module for a personal listening device to be fitted in the ear, on the ear, near the ear, or behind the ear, the receiver module having a movable armature, the receiver module comprises a motor assembly and a housing defining a chamber, the housing is made from a material that is corrosion resistant and is biocompatible to human skin contact. The receiver module further comprises at least one motor assembly directly disposed in the chamber. Optionally a communication link adapted to couple or decouple with the motor assembly. At least a portion of the communication link is disposed in the housing.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: March 16, 2010
    Assignee: Knowles Electronics, LLC
    Inventors: Daniel Max Warren, Thomas Edward Miller, Charles Bender King, Janice L. LoPresti, Gwendolyn P. Massingill
  • Patent number: 7633156
    Abstract: A module (100, 200, 300, 400, 500, 600, 900) may be electrically connected to a PCB (18, 918) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16, 916) of the device (14). The module may include a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910) having a connecting surface (114, 214, 314, 414, 514, 614, 914), and at least one acoustic port (124, 224, 324, 424, 524, 624, 924) to couple a surface of the surface mountable acoustic transducer to the exterior of the device (14). The module (100, 200, 300, 400, 500, 600, 900) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614, 914) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610, 910).
    Type: Grant
    Filed: April 30, 2008
    Date of Patent: December 15, 2009
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 7537964
    Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: May 26, 2009
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 7501703
    Abstract: A module (100, 200, 300, 400, 500, 600) may be electrically connected to a PCB (18) residing in a device (14) or may be joined to the device (14) to form a portion of the housing (16) of the device (14). The module includes a housing (102, 202, 302, 402, 502, 602) having at least one layer, a surface mountable component, such as a surface mountable acoustic transducer (110, 210, 310, 410, 510, 610) having a connecting surface (114, 214, 314, 414, 514, 614) disposed within the housing (102, 202, 302, 402, 502, 602), and at least one acoustic port (124, 224, 324, 424, 524, 624) formed on a surface of the housing (102, 202, 302, 402, 502, 602). The module (100, 200, 300, 400, 500, 600) may further include a secondary mounting structure (654) electrically connected to the connecting surface (114, 214, 314, 414, 514, 614) of the surface mountable acoustic transducer (110, 210, 310, 410, 510, 610). The acoustic port (124, 224, 324, 424, 524, 624) may include a layer of an environmental barrier (450, 550).
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: March 10, 2009
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 7477756
    Abstract: An insert earphone comprises a housing and at least one transducer that is located in the housing. The transducer is adapted to receive electrical energy and to responsively convert the electrical energy into acoustic energy for presentation to an eardrum of a user. The transducer is positioned within the housing so as to be in close proximity to the eardrum of the user when the housing is inserted into the ear canal. At least one sealing member is coupled to the housing. The at least one sealing member is adapted to provide an acoustic seal within the ear canal of the user.
    Type: Grant
    Filed: March 2, 2006
    Date of Patent: January 13, 2009
    Assignee: Knowles Electronics, LLC
    Inventors: Timothy K. Wickstrom, William J. Ballad, David M. Schaefer
  • Patent number: 7471798
    Abstract: A directional microphone system is disclosed, which comprises circuitry for low pass filtering a first order signal, and circuitry for high pass filtering a second order signal. The system further comprises circuitry for summing the low pass filtered first order signal and the high pass filtered second order signal. A method of determining whether a plurality of microphones have sufficiently matched frequency response characteristics to be used in a multi-order directional microphone array is also disclosed. For a microphone array having at least three microphones, wherein one of the microphones is disposed between the other of the microphones, a method of determining the arrangement of the microphones in the array is also disclosed.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: December 30, 2008
    Assignee: Knowles Electronics, LLC
    Inventor: Daniel M. Warren
  • Patent number: 7443997
    Abstract: An armature for a receiver comprising a first and a second leg portion each having a thickness and a width and connected to each other, and a connection portion in communication with the first and second leg portions. The connection portion has a width greater than the width of the first and second leg portions individually. The connection portion reduces the stiffness of the armature and minimizes magnetic reluctance of the connection between the first and second leg portions. According to one aspect of the invention, the first and second leg portions are integrally formed with the connection portion and the connection portion includes at least a portion having a thickness less than the thickness of the first and second leg portions individually to reduce the stiffness of the armature. According to another aspect of the invention, the first and second leg portions are separately formed and attached to the connection portion in a way that reduces the stiffness of the armature.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: October 28, 2008
    Assignee: Knowles Electronics, LLC.
    Inventors: Thomas Miller, Daniel Warren
  • Patent number: 7439616
    Abstract: A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
    Type: Grant
    Filed: February 10, 2006
    Date of Patent: October 21, 2008
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Patent number: 7434305
    Abstract: A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
    Type: Grant
    Filed: August 19, 2004
    Date of Patent: October 14, 2008
    Assignee: Knowles Electronics, LLC.
    Inventor: Anthony D. Minervini
  • Patent number: 7415125
    Abstract: A receiver assembly includes a first diaphragm assembly having a diaphragm, and a second diaphragm assembly having a diaphragm. A linkage assembly is coupled to an armature of the receiver. The linkage assembly is also coupled to the first diaphragm assembly and to the second diaphragm assembly.
    Type: Grant
    Filed: May 10, 2004
    Date of Patent: August 19, 2008
    Assignee: Knowles Electronics, LLC
    Inventors: Daniel M. Warren, Stephen C. Thompson, David E. Schafer
  • Patent number: 7412763
    Abstract: A method of making an acoustic assembly for use in a transducer includes forming a multi-layer assembly. The multi-layer assembly includes a first layer member and a second layer member. Each member includes a center portion, an edge portion and an aperture separating the center portion and the edge portion. The assembly has an assembly stiffness that is greater than the stiffness of either the first or second layer members. A hinge joins the assembled first and second center portions and the first and second edge portions such that the assembled first and second center portions is free to at least partially rotate relative to the assembled first and second edge portions about an axis. A flexible layer member is coupled to the assembly and provides airtight sealing of the passageway.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: August 19, 2008
    Assignee: Knowles Electronics, LLC.
    Inventors: Mekell Jiles, David Earl Schafer, Anthony D. Minervini, Hanny Sunarto, Thomas Edward Miller, Daniel Max Warren