Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board.

Abstract: A microphone circuit includes a condenser microphone and a charge pump. The condenser microphone is configured to receive sound energy and responsively convert the sound energy into a microphone output voltage. The charge pump is implemented in a low voltage CMOS process. It is coupled to the microphone and is configured to supply a bias voltage to the microphone allowing the microphone to operate. By using a proper circuit topology, whose maximum output voltage is limited by the breakdown voltage between the NWELL and the substrate, and by blocking the formation of the PWELL around the NWELL at a predetermined distance so that the NWELL is surrounded by a very lightly doped substrate from all sides, the maximum output voltage of the charge pump is increased significantly.

Abstract: A micro electro mechanical system (MEMS) apparatus includes a substrate. The substrate includes a first surface and a second surface. The first surface and the second surface are on opposing sides of the substrate. A programming contact pad is disposed on the second surface of the substrate. A MEMS device is disposed on the first surface of the substrate. An integrated circuit is disposed on the first surface of the substrate and electrically connected to the MEMS device and the contact pad. An anti-fuse region is coupled to the pad and to ground. When the anti-fuse region is not fused, a first electrical path exists from the programming contact pad to the integrated circuit. When the anti-fuse region is fused, a second electrical path is created from the programming contact pad to ground and the first electrical path is no longer available for programming purposes.

Abstract: A bottom port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphones are manufactured from panels of substrates, sidewall spacers, and lids. Each MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port disposed in the substrate. The panels are joined together, and each individual substrate, sidewall spacer, and lid cooperate to form an acoustic chamber for its respective MEMS microphone die. The joined panels are then singulated to form individual MEMS microphones.

Abstract: A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid with an acoustic port, and the MEMS microphone die is lid-mounted and acoustically coupled to the acoustic port. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the lid-mounted MEMS microphone die.

Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a sidewall spacer and a lid, and the MEMS microphone die is substrate-mounted and acoustically coupled to the acoustic port in the substrate. The substrate, the sidewall spacer, and the lid are joined together to form the MEMS microphone, and the substrate, the sidewall spacer, and the lid cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: A buffer is coupled to an acoustic motor. The buffer has an input and an output. The input has an input voltage and the output has an output voltage. The buffer is coupled to a load. The buffer includes an input transistor and push-pull transistor circuitry. The input transistor has a gate, a source, and a drain, a gate-to-source capacitance, and an area. The push-pull transistor circuitry is coupled to the input transistor. Under a first set of operating conditions, the gate to source voltage of the input transistor remains constant and the output voltage is a buffered copy of the input voltage. Under a second set of operating conditions, the push-pull transistor circuitry selectively sinks or sources additional current to the load so that linearity of buffer operation is provided. A gate-to-drain capacitance of the input transistor is buffered allowing the area of the input transistor to be increased without reducing the gain of the motor.

Abstract: The present invention relates to a surface mount package for a micro-electro-mechanical system (MEMS) microphone die and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components that simplifies manufacturing and lowers costs. The surface mount package features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the MEMS microphone die is mechanically attached, providing an interior surface for making electrical connections between the MEMS microphone die and the package, and providing an exterior surface for surface mounting the microphone package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The microphone package has a substrate with metal pads on its top and bottom surfaces, a sidewall spacer, and a lid.

Abstract: A Microelectromechanical System (MEMS) microphone includes a printed circuit board, a MEMS die, and an integrated circuit. The MEMS die is disposed on a top surface of the printed circuit board. The integrated circuit is disposed at least partially within the printed circuit board and produces at least one output signal. The output signals of the integrated circuit are routed directly into at least one conductor to access pads at the printed circuit board and the access pads are disposed on a bottom surface of the printed circuit board that is opposite the top surface.

Abstract: A method is provided for manufacturing a plurality of packages. The method comprises the steps of: applying a means for adhering two or more covers to a substrate; positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate; coupling the covers to the substrate; depositing a material into the one or more channels; performing a process on the material to affix the material; and singulating along the channels to create the plurality of packages.

Abstract: A micro-electromechanical system (MEMS) device includes a housing and a base. The base includes a port opening extending therethrough and the port opening communicates with the external environment. The MEMS die is disposed on the base and over the opening. The MEMS die includes a diaphragm and a back plate and the MEMS die, the base, and the housing form a back volume. At least one vent extends through the MEMS die and not through the diaphragm. The at least one vent communicates with the back volume and the port opening and is configured to allow venting between the back volume and the external environment.

Abstract: An acoustic apparatus includes a high frequency driver that has a first front volume and a low frequency driver that has a second front volume. The first front volume and the second front volume communicate with each other to form a common front volume. At least one acoustic resistance is placed between the first front volume and the second front volume. The acoustic resistance acts as a low pass filter.

Abstract: A microphone includes a microelectromechanical system (MEMS) circuit and an integrated circuit. The MEMS circuit is configured to convert a voice signal into an electrical signal, and the integrated circuit is coupled to the MEMS circuit and is configured to receive the electrical signal. The integrated circuit and the MEMS circuit receive a clock signal from an external host. The clock signal is effective to cause the MEMS circuit and integrated circuit to operate in full system operation mode during a first time period and in a voice activity mode of operation during a second time period. The voice activity mode has a first power consumption and the full system operation mode has a second power consumption. The first power consumption is less than the second power consumption. The integrated circuit is configured to generate an interrupt upon the detection of voice activity, and send the interrupt to the host.

Abstract: The output impedance of an amplifier is substantially matched to an input impedance of a receiver using a buffer circuit. The buffer circuit includes a primary transistor and a secondary transistor. A first back gate terminal of the primary transistor is coupled to a second back gate terminal of the secondary transistor and the primary transistor is configured to have an output for the buffer circuit. An input signal is received from the amplifier at a gate terminal of the secondary transistor. The first back gate terminal of the primary transistor is responsively driven independently from the output of the buffer circuit to effectively adjust a transconductance of the primary transistor and substantially match an output impedance of the amplifier with an input impedance of the receiver.

Abstract: An Electret Condenser Microphone (ECM) motor apparatus includes a diaphragm ring support structure, a charge plate, and at least one stitch. The diaphragm ring support structure defines an opening there through. The charge plate is disposed within the opening. The at least one stitch is coupled to the diaphragm ring support structure to the charge plate. The diaphragm is disposed adjacent to and in a generally parallel relationship to the charge plate. The stitch is configured to hold the charge plate and the diaphragm ring, and the stitch is configured to maintain a constant or nearly constant distance between the charge plate and the diaphragm in the absence of sound energy.

Abstract: A microphone assembly comprising includes a base, at least one side wall, and a cover. The side wall is disposed on the base. The cover is coupled to the at least one side wall. The base, the side wall, and the cover form a cavity and the cavity has a MEMS device disposed therein. A top port extends through the cover and a first channel extends through the side wall. The first channel is arranged so as to communicate with the top port. A bottom port extends through the base. The MEMS device is disposed over the bottom port. A second channel is formed and extends along a bottom surface of the base. The second channel extends between and communicates with the first channel and the bottom port. Sound received by the top port is received at the MEMS device.

Abstract: An acoustic apparatus includes a substrate, micro electro mechanical system (MEMS) die, and an integrated circuit. The substrate includes a permanent opening that extends there through. The micro electro mechanical system (MEMS) die is disposed over the permanent opening and the MEMS die includes a pierce-less diaphragm that is moved by sound energy. A first temporary opening extends through the substrate. The integrated circuit is disposed on the substrate and includes a second opening. The first temporary opening and the second opening are generally aligned. A cover that is coupled to the substrate and encloses the MEMS die and the integrated circuit. The cover and the substrate form a back volume, and the diaphragm separates the back volume from a front volume. The first temporary opening is unrestricted at a first point in time to allow gasses present in the back volume to exit through the temporary opening to the exterior and the pierce-less diaphragm prevents the gasses from passing there through.

Abstract: An the acoustic apparatus comprising a first MEMS motor that includes a first diaphragm and a first back plate, and a second MEMS motor that includes a second diaphragm and a second back plate. The first motor is biased with a first electrical polarity and a second motor is biased with a second electrical polarity such that the first electrical polarity and the second electrical polarity are opposite. At the first motor, a first signal is created that is representative of received sound energy. At the second motor, a second signal is created that is representative of the received sound energy. A differential output signal that is the representative of the difference between the first signal and the second signal is obtained. In obtaining the differential output signal, common mode noise between the first motor and the second motor is rejected.

Abstract: A microphone assembly includes a base, a cover, and a microelectromechanical system (MEMS) die. The cover extends at least partially over and is coupled to the base. The cover and the base form a cavity. The MEMS die is coupled to the base and disposed within the cavity. At least a portion of the cover is constructed of a copper-nickel-zinc alloy that is effective in preventing solder from moving from a first portion of the cover to a second portion of the cover.