Patents Assigned to Knowles Electronics, LLC
  • MEMS APPARATUS WITH INCREASED BACK VOLUME
    Publication number: 20140291784
    Abstract: A microelectromechanical system (MEMS) microphone assembly includes a base and a cover. The cover is coupled to the base and together with the base defines a cavity. The base forms a recess and the recess has dimensions and a shape so as to hold a MEMS die. The MEMS die includes a diaphragm and back plate.
    Type: Application
    Filed: March 20, 2014
    Publication date: October 2, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Wade Conklin
  • EMBEDDED DIELECTRIC AS A BARRIER IN AN ACOUSTIC DEVICE AND METHOD OF MANUFACTURE
    Publication number: 20140294209
    Abstract: A microphone base includes a plurality of metal layers and a plurality of core layers. Each of the plurality of core layers is disposed between selected ones of the metal layers. A dielectric membrane is disposed between other selected ones of the plurality of metal layers. A port extends through the metal layers and the core layers but not through the dielectric membrane. The dielectric membrane has a compressed portion and an uncompressed portion. The uncompressed portion extends across the port and the compressed portion is in contact with the other selected ones of the metal layers. The compressed portion of the membrane is effective to operate as a passive electronic component and the uncompressed portion is effective to act as a barrier to prevent at least some external debris from traversing through the port.
    Type: Application
    Filed: November 4, 2011
    Publication date: October 2, 2014
    Applicant: KNOWLES ELECTRONICS, LLC
    Inventors: John B. Szczech, Peter Van Kessel
  • Apparatus in an acoustic assembly for registering assembly parts
    Patent number: 8837755
    Abstract: An acoustic apparatus includes a first acoustic element, a second acoustic element, and a registration portion. The first acoustic element and the second acoustic element are elements such as a coil, a reed, or a yoke. The registration portion is configured to register the first acoustic element with respect to the second acoustic element such that an exact and relative alignment and positioning between the first acoustic element and second acoustic element is provided and ensured.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: September 16, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Mekell Jiles, Matthew Mason, Phillip M McCratic
  • Low axial vibration receiver armature and assembly
    Patent number: 8824726
    Abstract: An armature apparatus includes a first tine member, a second tine member, a center tine member, and a connecting portion. The connecting portion is coupled to the first tine member, the second tine member, and the connecting portion, and the connecting portion has a line of symmetry. The center tine member is attached to the connecting portion along the line of symmetry such that approximately one half the area of the connection portion is above the center tine member and approximately one half the area of the connection portion is below the center tine member. The attachment is effective to prevent a formation of a horizontal force in the center tine member along the third length when a vertical force is applied to the center tine member in the direction of third thickness.
    Type: Grant
    Filed: July 22, 2013
    Date of Patent: September 2, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Thomas E. Miller, Clifford Ryan Grounds, Henry Nepomuceno, David E. Schafer, George Patterson
  • Acoustic valve mechanisms
    Patent number: 8798304
    Abstract: A valve for a personal auditory system is described. The auditory system is capable of converting between an acoustic signal and an electrical signal. The auditory system has an acoustic pathway through which an acoustic signal may travel between a first point exterior to the auditory system and a second point interior to the auditory system. The valve includes a free floating electrode and a second electrode adjacent to free floating electrode. An electric signal that is generated by the second electrode moves the free floating electrode to substantially open or close the acoustic pathway.
    Type: Grant
    Filed: December 8, 2010
    Date of Patent: August 5, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Thomas E. Miller, William A. Ryan, Joseph J. Heidenreich, Ryan S. Scott, Daniel Repplinger, James Steven Collins
  • Package with a CMOS die positioned underneath a MEMS die
    Patent number: 8791531
    Abstract: A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
    Type: Grant
    Filed: October 21, 2011
    Date of Patent: July 29, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Peter V. Loeppert, David Giesecke, Anthony Minervini, Jeffrey Niew, Lawrence Grunert
  • Telescopic OP-AMP With Slew Rate Control
    Publication number: 20140197887
    Abstract: An operational amplifier includes a transfer circuit, a cascode control circuit, and a slew rate boost circuit. The transfer circuit is configured to apply a transfer function to a received input signal and the application of the transfer function to the received input signal is effective to create an output signal. The cascode circuit is coupled to the transfer circuit. The cascode circuit is configured to increase an open loop gain of the operational amplifier. The slew rate boost circuit is coupled to the cascode circuit. The slew rate boost circuit is configured to increase the slew rate of the operational amplifier without necessarily increasing the power consumption of the operational amplifier.
    Type: Application
    Filed: January 14, 2014
    Publication date: July 17, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Per Flemming Hovesten, Claus Erdmann Furst, Aziz Yurttas
  • Compact, highly integrated microphone assembly
    Patent number: 8781140
    Abstract: A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: July 15, 2014
    Assignee: Knowles Electronics, LLC
    Inventors: Eric J. Lautenschlager, Galen Kirkpatrick
  • Methods of manufacture of top port surface mount silicon condenser microphone packages
    Patent number: 8765530
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: July 1, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Apparatus and Method For High Voltage I/O Electro-Static Discharge Protection
    Publication number: 20140177113
    Abstract: An electronics chip includes a charge pump and at least one high voltage (HV) electro-static discharge (ESD) module. The charge pump is configured to provide a predetermined voltage across a microphone. The devices described herein are implemented in a standard low voltage CMOS process and has a circuit topology that provides an inherent ESD protection level (when it is powered down), which is higher than the operational (predetermined) DC level. At least one high voltage (HV) electro-static discharge (ESD) module is coupled to the output of the charge pump. The HV ESD module is configured to provide ESD protection for the charge pump and a microelectromechanical system (MEMS) microphone that is coupled to the chip. The at least one HV ESD module includes a plurality of PMOS or NMOS transistors having at least one high voltage NWELL/DNWELL region formed within selected ones of the PMOS or NMOS transistors.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 26, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Svetoslav Radoslavov Gueorguiev, Claus Erdmann Furst, Tore Sejr Joergensen
  • Digital Microphone With Frequency Booster
    Publication number: 20140177874
    Abstract: A digital microphone, the microphone includes a microelectromechanical (MEMS) component and a frequency boost component. The MEMS component is configured to convert. sound into an electrical signal. The frequency boost component is configured to receive the electrical signal and ultrasonically boost the electrical signal to create a frequency response. The frequency response does not substantially affect an audio band of interest of the microphone.
    Type: Application
    Filed: December 18, 2013
    Publication date: June 26, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Gudmundur Bogason, Henrik Thomsen
  • APPARATUS FOR PREVENTION OF PRESSURE TRANSIENTS IN MICROPHONES
    Publication number: 20140133687
    Abstract: An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 15, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Sung Bok Lee
  • APPARATUS TO PREVENT EXCESS MOVEMENT OF MEMS COMPONENTS
    Publication number: 20140133686
    Abstract: An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a stop. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate, and the MEMS apparatus is disposed over the port. The stop is disposed over the MEMS apparatus and configured to prevent movement of portions of the MEMS apparatus that would damage the portions of the MEMS apparatus.
    Type: Application
    Filed: November 8, 2013
    Publication date: May 15, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Sung Bok Lee
  • Acoustic Device and Method of Manufacture
    Publication number: 20140112516
    Abstract: An acoustic assembly includes an upper housing and a lower housing. The lower housing is coupled to the upper housing forming an interior cavity there between. At least one acoustic component is disposed within the cavity. At least one metalized area is formed in the upper housing or the lower housing. The at least one metalized area is in contact with the at least one acoustic component and is configured and arranged to provide an electrical connection between the acoustic component in the cavity and a customer that is exterior to the assembly. The at least one metalized area directly adheres to the upper housing or lower housing.
    Type: Application
    Filed: October 4, 2013
    Publication date: April 24, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Mekell Jiles
  • Top port surface mount silicon condenser microphone package
    Patent number: 8704360
    Abstract: The present invention relates to a surface mount package for a silicon condenser microphone and methods for manufacturing the surface mount package. The surface mount package uses a limited number of components which simplifies manufacturing and lowers costs, and features a substrate that performs functions for which multiple components were traditionally required, including providing an interior surface on which the silicon condenser die is mechanically attached, providing an interior surface for making electrical connections between the silicon condenser die and the package, and providing an exterior surface for surface mounting the package to a device's printed circuit board and for making electrical connections between package and the device's printed circuit board.
    Type: Grant
    Filed: December 31, 2012
    Date of Patent: April 22, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Anthony D. Minervini
  • Lens assembly apparatus and method
    Patent number: 8699141
    Abstract: An optical apparatus includes a first membrane, a second membrane and at least one electromagnetically displaceable component. The first membrane includes an optically active area. The first membrane and the second membrane are coupled by a filler material disposed in a reservoir. At least one electromagnetically displaceable component is coupled to the filler material via the second membrane, such that a displacement of the at least one electromagnetically displaceable component is operative to cause a deformation of the optically active area of the first membrane by movement of the filler material.
    Type: Grant
    Filed: March 9, 2010
    Date of Patent: April 15, 2014
    Assignees: Knowles Electronics, LLC, Optotune AG
    Inventors: Manuel Aschwanden, David Niederer, Thomas Schmidhausler, Christoph Romer, Thomas Kern, Shu-Heng Yang, Charles King, Dennis Ray Kirchhoefer, Daniel Warren
  • Single Stage Buffer With Filter
    Publication number: 20140097906
    Abstract: A single-stage buffer apparatus includes a first transistor, a second transistor, and a high pass filter network. The first transistor is configured to receive an input signal from a microphone. The second transistor is configured to operate as a cascode transistor. The high pass filter network is coupled to the first transistor and the second transistor. The second transistor electrically decouples the first transistor from an output of the single-stage buffer apparatus. A gate terminal of the second transistor is driven by the high-pass filter network, and the high-pass filter network is driven by the first transistor.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 10, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Michael Jennings, Craig Stein, Dean Badillo
  • Microphone interface and method of operation
    Patent number: 8687823
    Abstract: An interface is provided between a transducer and audio processing circuitry. The interface has a switching device coupled to the transducer. The interface also has a first signal path that is selectively coupled to transducer via the switching device and includes a first output, the first signal path being configured to selectively receive input signals from the transducer, and form a first output signal at the first output by amplifying the input signals to provide a first gain. The first output is coupled to the audio processing circuitry. A second signal path is provided that is selectively coupled to the transducer via the switching device and includes a second output. The second gain is selected to be substantially larger than the first gain. The switching device is configured to switch the input signal between the first signal path and the second signal path.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: April 1, 2014
    Assignee: Knowles Electronics, LLC.
    Inventors: Peter V. Loeppert, Paul Fielding Smith, Wei-Wen Dai, Shawn Beus
  • RF shielding for acoustic devices
    Patent number: 8682015
    Abstract: A receiver includes a housing and a sleeve. The housing forms a chamber, and the coil is disposed in the chamber and radiates a flux. The sleeve at least partially surrounds the coil such that a majority of flux radiated from the coil is blocked by the sleeve. The sleeve is constructed of a highly conductive material and is insulated from the housing.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: March 25, 2014
    Assignee: Knowles Electronics, LLC
    Inventor: Thomas E. Miller
  • Buffering Apparatus and Method
    Publication number: 20140070888
    Abstract: The output impedance of an amplifier is substantially matched to an input impedance of a receiver using a buffer circuit. The buffer circuit includes a primary transistor and a secondary transistor. A first back gate terminal of the primary transistor is coupled to a second back gate terminal of the secondary transistor and the primary transistor is configured to have an output for the buffer circuit. An input signal is received from the amplifier at a gate terminal of the secondary transistor. The first back gate terminal of the primary transistor is responsively driven independently from the output of the buffer circuit to effectively adjust a transconductance of the primary transistor and substantially match an output impedance of the amplifier with an input impedance of the receiver.
    Type: Application
    Filed: November 19, 2013
    Publication date: March 13, 2014
    Applicant: Knowles Electronics, LLC
    Inventor: Steven E. Boor