Patents Assigned to Laird Technologies
  • Patent number: 9608318
    Abstract: According to various aspects, exemplary embodiments are disclosed of antenna assemblies and methods of manufacturing the same. In an exemplary embodiment, a method generally includes forming (e.g., molding, etc.) a sleeve over and/or between a first portion of a first component (e.g., a bushing, etc.) and a second portion of a second component (e.g., adaptor, etc.). The sleeve is coupled to the first and second portions of the respective first and second components. The method may also include removably attaching an antenna connector subassembly to the first component such that a printed circuit board assembly of the antenna connector subassembly is covered by the sleeve. The method may additionally include overmolding a sheath over the sleeve and one or more radiating elements of a multiband antenna assembly that includes the antenna connector subassembly, whereby the sleeve covers and protects the printed circuit board assembly during the overmolding.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: March 28, 2017
    Assignee: Laird Technologies, Inc.
    Inventors: Yen Siang Tan, Chit Yong Hang
  • Patent number: 9595755
    Abstract: According to various aspects, exemplary embodiments are disclosed of ground independent multi-band antenna assemblies. In an exemplary embodiment, a ground independent multi-band antenna assembly is operable within at least a first frequency range and a second frequency range different than the first frequency range. The antenna assembly generally includes an annular ground element, a feed element, a patch element, and a high band element. The feed element includes a feeding point and a shorting point electrically connected to the annular ground element. The patch element is electrically shorted to the annular ground element by the feed element. The high band element is electrically connected to the feed element.
    Type: Grant
    Filed: August 17, 2015
    Date of Patent: March 14, 2017
    Assignee: Laird Technologies, Inc.
    Inventors: Kok Jiunn Ng, Tshu Pin Chee, Tze Yuen Ng, Xin Wen Teoh
  • Patent number: 9491691
    Abstract: According to various aspects, exemplary embodiments are disclosed of systems and methods related to Bluetooth assisted cooperative scan and roam for wireless networks. In an exemplary embodiment, a cooperative scan and roam Bluetooth system generally includes one or more Bluetooth nodes configured to transmit node roam table data and/or a universally unique identifier (UUID) to one or more client devices having a stored client roam table and connected to at least one of multiple access points of a wireless network. This allows the one or more client devices to update their stored client roam tables based on the transmitted node roam table data and/or roam table information obtained from a server and/or cache including multiple roam tables, based on the UUID.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: November 8, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Mahendra Tailor, Steve deRosier, Daniel B. Kephart, Jr.
  • Patent number: 9472846
    Abstract: Exemplary embodiments are provided of multi-band Planar Inverted-F antennas and antenna systems including the same. In an exemplary embodiment, a Planar Inverted-F antenna (PIFA) generally includes a planar radiator or upper radiating patch element having a slot. A lower surface of the PIFA is spaced apart from the upper radiating patch element. First and second shorting elements electrically connect the planar radiator to the lower surface. The PIFA also includes a feeding element electrically connected between the upper radiating patch element and the lower surface. The PIFA may be mounted on a ground plane that is larger than the lower surface of the PIFA.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: October 18, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Kok Jiunn Ng, Ee Wei Sim, Joshua Ooi Tze Meng
  • Patent number: 9460574
    Abstract: According to various aspects, exemplary embodiments are disclosed of a Bluetooth zone control system. In an exemplary embodiment, a Bluetooth zone control system generally includes a first Bluetooth device configured to provide a first Bluetooth signal. A location of the first Bluetooth device corresponds to a location of a machine. The system also includes an operator control unit having a second Bluetooth device configured to detect the first Bluetooth signal. The operator control unit is configured to control the machine based on first authorization rights when the second Bluetooth device detects the first Bluetooth signal at or above a signal threshold, and to control the machine based on second authorization rights when the second Bluetooth device does not detect the first Bluetooth signal at or above the signal threshold.
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: October 4, 2016
    Assignee: Laird Technologies, Inc.
    Inventor: David Stagg
  • Patent number: 9431687
    Abstract: Heating assemblies for one or more rechargeable batteries include a flexible heating element positionable about the one or more rechargeable batteries, a temperature sensor configured to sense a temperature adjacent the one or more rechargeable batteries, and a control circuit configured to receive the sensed temperature from the temperature sensor. The control circuit is configured to connect the charger to the flexible heating element for allowing power to flow from the charger to the flexible heating element in response to the sensed temperature adjacent the one or more rechargeable batteries falling below a defined threshold temperature. The temperature sensor is adjacent the flexible heating element. The flexible heating element is configured to receive power from a charger that is operable for charging the one or more rechargeable batteries. Systems including the one or more heating assemblies are also disclosed.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 30, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Ronald James Bonebright, Robert Jacek Slawinski, Augustine Odili Ekeinde
  • Patent number: 9376606
    Abstract: According to various aspects, exemplary embodiments are disclosed of thermally conductive composites that include a polymer matrix functionalized with liquid crystals grafted onto the polymer matrix. Also disclosed are methods that generally include modifying liquid crystals and incorporating the modified liquid crystals into a polymer matrix such that the modified liquid crystals are grafted onto the polymer matrix.
    Type: Grant
    Filed: May 1, 2015
    Date of Patent: June 28, 2016
    Assignee: Laird Technologies, Inc.
    Inventor: Sumana Roy Chowdhury
  • Patent number: 9360240
    Abstract: A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where the hot side comprises a single fan sink and the cold side comprises dual fan sinks. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. The assembly may include one or more moisture barrier measures, including a wire seal, a series of screw O-rings, and a sealing layer.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: June 7, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Henrik Höjer, Anders Thorén, Dan Martin Gustav Karlstedt
  • Patent number: 9357683
    Abstract: According to various aspects, exemplary embodiments are disclosed of shielding apparatus or assemblies including electrically-conductive foam frames and covers or lids attachable to the frames. Also disclosed are exemplary embodiments of electrically-conductive foam frames for shielding apparatus or assemblies. Further, exemplary embodiments are disclosed of methods relating to making shielding apparatus or assemblies including electrically-conductive foam frames. Additionally, exemplary embodiments are disclosed of methods relating to providing shielding for one or more components on a substrate.
    Type: Grant
    Filed: October 14, 2014
    Date of Patent: May 31, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Ming Yueh Liu, Yi-Shen Lin, Jui-Iung Tsao, Ping-Feng Hsu
  • Patent number: 9330998
    Abstract: A thermal interface material assembly generally includes a substrate and one or more pillars protruding outwardly away from the substrate. A thermally-conductive heat path is at least partially defined by the substrate and the one or more thermally-conductive pillars, whereby heat may be transferable along the thermally-conductive heat path from a heat source of an electronic device.
    Type: Grant
    Filed: August 19, 2014
    Date of Patent: May 3, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Richard F. Hill
  • Patent number: 9322580
    Abstract: A circuit assembly generally includes a circuit board and at least one electrical pathway configured to couple a thermoelectric module to the circuit board. The circuit board and the at least one electrical pathway form part of the thermoelectric module when the thermoelectric module is coupled to the circuit board via the at least one electrical pathway. The thermoelectric module, including the portion of the circuit board forming part of the thermoelectric module, defines a footprint that is smaller than a footprint of the circuit board. As such, the circuit board is capable of supporting electrical components on the circuit board in a position outside the footprint defined by the thermoelectric module.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: April 26, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Jeffrey Gerard Hershberger, Richard F. Hill, Robert Michael Smythe, Michael G. Sutsko
  • Patent number: 9321949
    Abstract: According to various aspects, exemplary embodiments are disclosed of adhesive, thermally conductive electrically insulators. In an exemplary embodiment, a thermally conductive, electrically insulating material includes 4 to 40 parts by weight of a macromolecular matrix material; 1 to 20 parts by weight of an adhesive additive; and 40 to 85 parts by weight of thermally conductive electrically insulating particles. The adhesive additive includes a reactive group that is the same as or similar to at least one curable active group in the macromolecular matrix material.
    Type: Grant
    Filed: February 5, 2013
    Date of Patent: April 26, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Yousen Wang, Jingqi Zhao
  • Patent number: 9303902
    Abstract: A thermoelectric assembly is disclosed, the assembly having a cold side and a hot side, where each of the hot side and cold side comprises a fan sink. Thermoelectric modules may be between the hot side and cold side and arranged in one circuit or multiple parallel circuits, and in direct thermal contact with both the hot side and the cold side. Each of the hot side and cold side has an air intake direction and an exhaust direction.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 5, 2016
    Assignee: Laird Technologies, Inc.
    Inventor: Dan Martin Gustav Karlstedt
  • Patent number: 9307631
    Abstract: According to various aspects, exemplary embodiments include one or more frequency selective surfaces, which may be used for attenuating, reflecting, and/or redirecting electromagnetic signals. Also disclosed are methods of using one or more frequency selective surfaces for attenuating, reflecting, and/or redirecting electromagnetic signals.
    Type: Grant
    Filed: March 29, 2013
    Date of Patent: April 5, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: John Song, Paul Francis Dixon, Yoeri Ariën
  • Patent number: 9270019
    Abstract: Disclosed are exemplary embodiments of multiband multiple input multiple output (MIMO) vehicular antenna assemblies for installation to a vehicle body wall. In exemplary embodiments, a multiband MIMO vehicular antenna assembly generally includes at least one cellular antenna configured to be operable over one or more cellular frequencies (e.g., Long Term Evolution (LTE), etc.), at least one satellite antenna configured to be operable over one or more satellite frequencies (e.g., Global Navigation Satellite System (GNSS), satellite digital audio radio services (SDARS), etc.) and at least one Dedicated Short Range Communication (DSRC) antenna configured to be operable over DSRC frequencies.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: February 23, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Cheikh T. Thiam, Ayman Duzdar, Hasan Yasin, Melissa Carolina Lugo Brito
  • Patent number: 9260645
    Abstract: Thermal interface materials are disclosed that include or are based on thermally reversible gels, such as thermally reversible gelled fluids, oil gels and solvent gel resins. In an exemplary embodiment, a thermal interface material includes at least one thermally conductive filler in a thermally reversible gel.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: February 16, 2016
    Assignee: Laird Technologies, Inc.
    Inventor: Karen J. Bruzda
  • Patent number: 9260646
    Abstract: Disclosed are thermally conductive composites that include a polymer matrix functionalized with a carbon-containing species covalently coupled with the polymer matrix. Also disclosed are methods that generally include functionalizing a carbon-containing species and incorporating the functionalized carbon-containing species into the polymer, such that the carbon-containing species are covalently bonded to the polymer matrix via a coupling agent.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: February 16, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Sumana Roy Chowdhury, Padma Priya Sudharshana, Srinivasan Duraiswamy
  • Patent number: 9258928
    Abstract: According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing. In an exemplary embodiment, a thermally-conductive structure which comprises graphite may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path around the battery area through or along the thermally-conductive structure which comprises graphite.
    Type: Grant
    Filed: June 3, 2013
    Date of Patent: February 9, 2016
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Shahi Riaz
  • Patent number: 9226433
    Abstract: A fabric over foam electromagnetic interference gasket has a body of indefinite length, and includes a layer of dielectric material thereon. The gasket may be compressed between two substrates and provide electrical conductivity in one axis and EMI shielding and nonconductivity in a perpendicular axis.
    Type: Grant
    Filed: November 10, 2014
    Date of Patent: December 29, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Kelly Cook, Tomas Hrcek, Michael Poulsen, Sri Talpallikar
  • Patent number: 9222735
    Abstract: According to various aspects of the present disclosure, exemplary embodiments are disclosed of thermally-conductive interface assemblies suitable for use in dissipating heat from one or more components of a memory module. The thermally-conductive interface assembly may generally include a flexible heat-spreading material having first and second sides and one or more perforations extending through the flexible heat-spreading material from the first side to the second side. The flexible heat-spreading material may be sandwiched between first and second layers of soft thermal interface material. A portion of the soft thermal interface material may be disposed within the one or more perforations. The thermally-conductive interface assembly may be positioned relative to one or more components of a memory module to provide a thermally-conductive heat path from the one or more components to the first layer of soft thermal interface material.
    Type: Grant
    Filed: September 8, 2014
    Date of Patent: December 29, 2015
    Assignee: Laird Technologies, Inc.
    Inventors: Richard F. Hill, Robert Michael Smythe