Abstract: The present invention relates construction element comprising: a sandwich structure comprising an electrically insulating layer and an electrically conducting front layer and an electrically conducting rear layer which are spaced apart by the electrically insulating layer. A circuit board is carrying an electronic component and is positioned between the electronic component and the electrically conducting rear layer.

Abstract: An improvement in a light therapy device including multiple light-emitting diodes (LEDs) positioned in a handheld portable device is disclosed. Where the housing and the LEDs are configured to have direct contact with the skin or tissue of the user without any intermediary materials, and light the surface and underlying layers of tissue for photodynamic stimulation of the cells. Two iterations of the device utilize light known to have a bactericidal effect in the case or acne or Rosacea. The devices are fabricated from an injection molded plastic housing. The housing contains an arrangement of 36-72 LEDs on a circuit board in an arrangement to provide even lighting over the skin or tissue surface.

Abstract: A method of making a light emitting diode (LED) lamp is disclosed. Included are steps of: providing a metal heat sink having a cylindrical portion formed with flat planar surfaces extending longitudinally around the outer surface; providing flat LED boards that are attached to the flat planar surfaces; providing a circular LED board mounted to the top end of the cylindrical portion; providing a turret connector board with electrical connection ports to electrically join the LED boards; providing a driver circuit board and electrically connecting it to the turret connector board; connecting the flat LED boards to the driver circuit board; securing the circular LED board to the top open-end; and securing the flat LED boards to the flat planar surfaces. Optional steps include: providing a mounting plate of heat conducting metal; applying thermal compound; providing and installing a transparent cover; providing and attaching a mount to the incandescent lamp.

Abstract: An LED luminaire according to an exemplary embodiment of the present invention includes a rectifier outputting a first rectified voltage generated by rectifying AC voltage and flattening the rectified voltage, a power factor correction unit receiving the first rectified voltage output from the rectifier and generating and outputting a drive voltage, an LED light emitting unit including first to m-th light emitting groups each including at least one LED, the LED light emitting unit sequentially driven by receiving the drive voltage input from the power factor correction unit, and an LED drive IC determining a voltage level of the drive voltage upon receiving the drive voltage input from the power factor correction unit, and controlling sequential driving of the first to m-th light emitting groups according to the determined voltage level of the drive voltage.

Abstract: A capacitive sensing apparatus is described that incorporates a light guide having a light scattering means for illumination of the apparatus. The apparatus has a capacitive sensor mounted on a substrate that provides a capacitive sensing area for generating an electric field that emanates from the apparatus. A light source is arranged in optical communication with the light scattering means via the light guide. This arrangement acts to mitigate the effects of interference between the capacitive sensor and the light source. When an opaque substrate is employed an air gap is located between the substrate and the light guide so as to provide a substantially uniform illumination across the light guide. Appropriate selection of the refractive indices of the light guide, ng, and a transparent substrate, ns, provides the same desired uniform illumination in alternative embodiments. The capacitive sensing apparatus finds particular application within a touch sensitive display.

Abstract: An optical semiconductor lighting apparatus including: a substrate in which a single LED chip or a plurality of LED chips are disposed; a first mold portion disposed on the substrate to cover the plurality of LED chips; and a second mold portion extending from an edge of the first mold portion and disposed on the substrate. The respective LED chips can improve adhesive strength with respect to the substrate through the first and second mold portions. Peeling, surface cracking and damage caused by moisture permeation can be prevented by the first and second mold portions. A fluorescent material included in the second mold portion can improve a wavelength conversion rate.

Abstract: A optical semiconductor lighting apparatus includes: a board; a drive IC which is disposed in a central portion of the board; a plurality of semiconductor optical devices which is disposed adjacent to and around the drive IC in the board in a grid shape in one or more rows and columns; a non-insulating heat sink in which the board is disposed; an insulating housing which accommodates the heat sink and protects the drive IC and the plurality of semiconductor optical devices from withstand voltages; and a first optical member which faces the plurality of semiconductor optical devices, transmits or reflects light irradiated from the semiconductor optical devices, and forms a vertical vent hole corresponding to the drive IC; and a second optical member which is connected to an upper side of the housing and forms light distribution by refracting light transmitted or reflected from the first optical member.

Abstract: A LED strip light connector system for providing a reliable connection between a flexible LED light strip and a connector. The LED strip light connector system generally includes a connector adapted to receive an end of a light strip, and a support member extending outwardly from the connector to support the light strip near the connector. The light strip is attached to the surface of the support member thereby preventing movement of the light strip with respect to the connector.

Abstract: The invention described herein is a very thin flat panel LED luminaire, including a flat baseboard, a flat reflection panel, a flat acrylic panel, a flat diffusion panel, LED bar, and aluminum encasement frame which combines with the baseboard to form the chassis for the luminaire. The LED bar is placed along either or both sides of the stack. The acrylic panel is printed with a mesh-like mask pattern of dots in a pattern in which the density of the pattern is decreases the farther away from the LED bar the pattern is, differentially coupling the light from the point source LED bar from the reflection panel into the flat acrylic panel so that illumination across the luminaire is substantially uniform.

Abstract: Embodiments of the invention provide AC LED lighting apparatuses. The AC LED lighting apparatuses may increase luminous flux and provide optimal efficiency through novel arrangement of a plurality of light emitting blocks on a circuit board and a plurality of LEDs and drive ICs included in each of the light emitting blocks to be sequentially driven, and/or through efficient series-parallel connection between a limited number of LEDs.

Abstract: A circuit for altering a level of impedance presented to a power supply including a power supply line includes an energy dissipating circuit, a detection circuit configured to generate a control signal indicative of a power consumption level in a load circuit coupled to the power supply line, and an activation circuit configured to controllably couple the energy dissipating circuit to the power supply line in response to the control signal. Methods of operating a solid state lighting apparatus including a power supply and a solid state lighting device coupled to the power supply include detecting a level of power consumption by the solid state lighting device, and coupling an energy dissipating circuit to the power supply in response to the level of power consumption by the solid state lighting device falling below a threshold level.

Abstract: A lighting device includes an LED light source (20) operable by electric power supplied to the device, and a control system (23) receiving electric power from an external power supply (26) and supplying power to the light source (20). The control system (23) also being operable of operating in a second mode to supply power to the light source (20) only on receipt by the control system (23) via the power supply (26) of a signal identifying said device. Thus the device (24) can be incorporated in a conventional lighting circuit or a circuit in which the devices (24) are individually controlled.

Abstract: A method is provided for manufacturing a LED package base including providing a metal core substrate having a top surface and a bottom surface and forming two first trenches in the metal core substrate. The first trenches extend from the top surface to the bottom surface, The method further includes at least partially filling in the first trenches with first dielectric material to form dielectric isolations. The dielectric isolations divide the metal core substrate into three metal core portions. Two of the metal core portions may be configured to serve as LED package electrodes. The method also includes applying a second dielectric material to cover at least a portion of the first dielectric material, and forming a conductive layer over the second dielectric material to form circuit contacts. The conductive layer includes a first conductive material.

Abstract: An optical semiconductor lighting apparatus includes: a housing; a heat discharge block which is made of a metal and is embedded in the housing; an AC direct-connection module which is made of a metal and is embedded in the housing, the AC direct-connection module including a semiconductor optical device which is driven in an AC direct-connection scheme; and an insulation connector which is provided in the AC direct-connection module and is exposed to an outside of the housing for electrical connection with an external power source.

Abstract: An optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube, and a plurality of optical semiconductor modules arranged along a circumference of the light-transmitting tube and separated from each other in a cross-sectional view of the light-transmitting tube. Each of the optical semiconductor modules is placed on a point, which is not on a central axis line of light emitted from other optical semiconductor modules, so as not to face another optical semiconductor module at an opposite side thereof.

Abstract: A light emitting module according to an exemplary embodiment of the present invention includes a printed circuit board (PCB) and first through m-th lighting blocks (‘m’ is an integer greater than one). The PCB has wiring patterns electrically connecting optical semiconductor devices. The first through the m-th lighting blocks are disposed on the PCB and configured to generate light. Each of the first through the m-th lighting blocks includes first through n-th lighting groups (each block includes at least one group), each of which includes optical semiconductor devices disposed on the PCB, and an electric currents configured to flow through each lighting group is substantially the same.