Abstract: A modular system of LED lighting provides for the use of LED lighting modules that are connectable using a interconnect module that provides structural rigidity. The LED lighting modules provide a sealed connection between adjoining LED modules, allowing their use under environmental conditions that may involve transient exposure to liquids such as water. Variants of the module allow using interconnect modules that allow flexible connections where rigidity is of less concern. Mounting features integrated into the interconnect modules allow mounting the interconnected lighting units to an installation site as desired.

Abstract: A light-emitting structure is provided. The disclosed light-emitting structure may include a light-emitting diode (LED) die, a plurality of light-penetrating microspheres covered a light emitting surface of the LED die, and a light-penetrating structure, disposed over the LED die and the light-penetrating microspheres, for converting light emitting from the LED die. Another light-emitting structure is also provided. The disclosed light-emitting structure may include a light-emitting diode (LED) die, a plurality of light-penetrating microspheres covered a light emitting surface of the LED die, and a light-penetrating structure, disposed between the LED die and the light-penetrating microspheres, for converting light emitting from the LED die.

Abstract: A diffuser and an optical system is provided in the present disclosure. The diffuser is configured to enhance the intensity of a light generated from a light source. The diffuser includes a transparent substrate, a transparent metalized layer, a bonding layer, and a plurality of light-penetrating microsphere balls. The transparent substrate has a first surface and a second surface. The transparent metalized layer is disposed on the first surface of the transparent substrate. The bonding layer is disposed on the transparent metalized layer. The plurality of light-penetrating microsphere balls are disposed on the bonding layer. The first surface is opposite to the second surface, and the light enters the diffuser from the second surface of the transparent substrate.

Abstract: An LED bulb is provided which includes a white light conversion film, a metal shell, a blue or purple or UV LED light source, an insulation connecting component, and a lamp holder. The metal shell includes an upper step and a lower step in an inner surface thereof. The white light conversion film is disposed on the upper step. The LED light source is disposed on the lower step. The lamp holder is connected to a bottom of the metal shell via the insulation connecting component.

Abstract: An illumination source for a camera includes one or more LEDs, and an electrical circuit that selectively applies power from the DC voltage source to the LEDs, wherein the illumination source is suitable for handheld portable operation. In some embodiments, the electrical circuit further includes a control circuit for driving the LEDs with electrical pulses at a frequency high enough that light produced has an appearance to a human user of being continuous rather than pulsed, the control circuit changing a pulse characteristic to adjust a proportion of light output having the first characteristic color spectrum output to that having the second characteristic color spectrum output. Some embodiments provide an illumination source including a housing including one or more LEDs and a control circuit that selectively applies power from a source of electric power to the LEDs, thus controlling a light output color spectrum of the LEDs.

Abstract: A lighting apparatus with light-emitting diode chips and a remote phosphor layer includes a plurality of LED chips, a cover, a heat sink, a first end cap, a second end cap, at least one PCB, and a LED driver. The plurality of LED chips is positioned on the at least one PCB and electronically connected with the LED driver. The LED driver is electrically connected with male contacts which traverse through the first end cap and the second end cap. The at least one PCB is enclosed with the cover, the heat sink, the first end cap, and the second end cap. The blue light and ultraviolet light from the plurality of LED chips coverts into white or yellow light from a phosphor layer of the cover, where the phosphor layer is remotely positioned from the plurality of LED chips.

Abstract: A light emitting diode (LED) illuminating apparatus including a heat sink, a light emitting module, a power connection portion, a translucent cover and a wiring path. The heat sink has a plurality of heat dissipation fins. The light emitting module is positioned on an upper portion of the heat sink. The power connection portion is positioned below a lower portion of the heat sink. The translucent cover is mounted to cover an upper portion of the light emitting module. The wiring path is formed in the heat sink so as to accommodate a wire for electrically connecting the power connection portion and the light emitting module. In the LED illuminating apparatus, the light emitting module emits light by directly receiving AC power supplied through the wire accommodated in the wiring path.

Abstract: Methods of fabricating a light-emitting device are provided. A light-emitting device can be formed from bonding a lens including a plug and a cap to an LED package including a socket configured to receive the plug. The lens can be fabricated using an injection mold formed from a well secured to the LED package and injecting a material into the injection mold to cure into a shape of the lens. The lens can also be fabricated using a blank about the shape of the lens and machining the blank to produce the plug and the cap of the lens. The lens can be bonded to the LED package using a convex bead of adhesive deposited on the surface of the LED package and spreading the adhesive between the lens and the LED package.

Abstract: An LED bulb assembly includes a pinion, a plurality of LEDs, an upper heat sink, and a lower base. The plurality of LEDs are configured or arranged around a surface of the pinion, such that the optical axis of the LEDs face outward. An upper heat sink may be configured to provide heat transfer for the LEDs and pinion. The lower base may be configured to provide a connection to the pinion and an upper heat sink. In embodiments, one or more optical elements (e.g., lenses) or LED covers may be included. Further, for some embodiments, the upper heat sink may be upwardly offset a separation distance from an upper surface of the pinion, and may be configured to improve air flow to the upper heat sink.

Abstract: An optical semiconductor based illuminating apparatus including a housing having an opening portion, a lighting unit disposed adjacent to the housing that includes at least one optical semiconductor, a power supply mounted within the housing that supplies power to the lighting unit, and a gate unit connected to the opening part that opens and shuts the inner housing.

Abstract: The nitride-based light emitting device according to one embodiment includes a first nitride semiconductor layer doped with a first conductive impurity; a strain buffer layer formed on the first nitride semiconductor layer and comprised of InGaN; an active layer formed on the strain buffer layer and having a multi-quantum well structure in which a quantum-well layer and a quantum-barrier layer are alternately stacked one above another; and a second nitride semiconductor layer formed on the active layer and doped with a second conductive impurity opposite to the first conductive impurity, wherein the ratio B/A satisfies 1.4<B/A<6.1, where A is the product of an average indium content of the strain buffer layer and a thickness of the strain buffer layer and B is the product of an average indium content of the active layer and a thickness of the active layer.

Abstract: A housing once included a high intensity discharge (HID) light source, lens, and fixture chamber between the housing and lens. The housing is retrofit to exclude a routinely functioning HID light source and exclude at least a portion of the HID lens. The housing is made to include at least a first support for at least one light emitting diode (LED) light source and an LED diode lighting fixture chamber. A second support is affixed at least to the first support and is positioned at least in part outside the LED fixture chamber. The LED light source is mounted to the second support outside the LED fixture chamber. At least one LED light source lens is mounted to provide a lens for the LED light source, also outside the LED lighting fixture chamber. The LED light source is thereby substantially free of exposure to the temperature effects.

Abstract: An optical semiconductor lighting apparatus including a housing with a first end portion and a second end portion that is open, a light source module disposed in the housing, a fan disposed adjacent to the light source module in the housing, the fan rotating in a first direction to blow air toward the light source module, and a reflector disposed adjacent to the second end portion of the housing, the reflector enhancing an illumination scope. A moving path, in which at least a portion of the air drawn into the housing by the fan externally flows through the light source module, is formed in the housing.

Abstract: A light emitting diode module includes a substrate, a light emitting diode die, a transparent layer, a phosphor material layer and a lens layer. The light emitting diode die is disposed on the substrate. The transparent layer disposed on the light emitting diode die. The phosphor material layer disposed on the transparent layer. The lens layer disposed on the phosphor material layer.

Abstract: An alternating current light emitting diode flip chip is provided. The flip chip includes an alternating current light emitting diode chip having a first bond pad and a second bond pad formed thereon. A first solder ball is disposed on the first bond pad and a second solder ball is disposed on the second bond pad. A flip-chip bonding process is performed to bond a carrier substrate with the first solder ball and the second solder ball.

Abstract: A multi-color light emitting diode device includes a plurality of light sources and a control module. The light sources are a Ultraviolet A light source, a Ultraviolet B light source, and a Ultraviolet C light source, a red light source, a green light source, and a blue light source, an infrared light source, and a YVA light source. The control circuit is configured with a plurality of control channels. Each of the control channels controls he respective light source to emit a light to generate a desired light combination.

Abstract: An LED lighting system is provided for connection to a variable power source providing input power, the LED lighting system having at least one power analyzing and processing circuitry connecting to the variable power source, and being configured to identify one or more characteristics of the input power, where the characteristics are selected from amplitude, frequency and pulse width of the input power, compare one or more of the characteristics of the input power to preset control criteria either in hardware or software or both to yield a comparison result, and then control the current control circuitry according to the comparison result.