Abstract: Disclosed are a nitride semiconductor light-emitting element and a method for manufacturing the same. The nitride semiconductor light-emitting element according to the present invention comprises: a current blocking part disposed between a substrate and an n-type nitride layer; an activation layer disposed on the top surface of the n-type nitride layer; and a p-type nitride layer disposed on the top surface of the activation layer, wherein the current blocking part is an AlxGa(1-x)N layer, and the Al content x times layer thickness (?m) is in the range of 0.01-0.06. Accordingly, the nitride semiconductor light-emitting element can increase the luminous efficiency by having a current blocking part which prevents current leakage from occurring.

Abstract: The problem addressed by the present invention consists in providing an LED luminaire which corresponds to the known shapes for incandescent bulbs both in terms of contour and size and which enables illumination similar to that of an incandescent bulb by means of the light-emitting means both in terms of the emission response and the luminous intensity of said luminaire. The heat sink which is required for technical reasons and which bears the light-emitting means itself predetermines the shape of the incandescent bulb and the emission of the LEDs for this purpose. The heat sink can in this case be in the form of one body or can comprise a plurality of separate heat sinks, which are arranged about a central axis so as to be associated with the respective light-emitting means.

Abstract: A method of fabricating a light emitting diode device comprises providing a substrate, growing an epitaxial structure on the substrate. The epitaxial structure includes a first layer on the substrate, an active layer on the first layer and a second layer on the active layer. The method further comprises depositing a conductive and reflective layer on the epitaxial structure, forming a group of first trenches and a second trench. Each of the first and second trenches extends from surface of the conductive and reflective layer to the first layer to expose part of the first layer. The method further comprises depositing conductive material to cover a portion of the conductive and reflective layer to form a first contact pad, and cover surfaces between adjacent first trenches to form a second contact pad. The second contact pad electrically connects the first layer by filling the conductive material in the first trenches.

Abstract: The present invention relates to a rotor chamber for a centrifuge, in particular an air-cooled laboratory centrifuge, having a chamber wall, comprising an inner side facing toward the chamber interior, the chamber interior being implemented to receive a centrifuge rotor, and an outer side facing away from the chamber interior, and having a sound barrier which is implemented to reduce the sound emitted from the rotor chamber, which comprises a multilayer damping lining. The first layer comprises a material having essentially sound-absorbing properties relative to the second laver, and the second layer comprises a material having essentially sound-reflecting properties relative to the first layer. The present invention also relates to a centrifuge having such a rotor chamber, and methods for reducing the sound emanating from the rotor chamber of a centrifuge, in particular an air-cooled laboratory centrifuge.

Abstract: Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.

Abstract: A modular floorstanding centrifuge comprising at least the following modules, the modules being preassembled, coherent components capable of being mounted as a whole, including a floor plate, a wall module adapted to be mounted on the floor plate together with two side wall elements capable of being attached to opposing edge regions of the floor plate, and a ceiling element adapted to interconnect the side wall elements, and a guard ring module adapted to be mounted on the wall module and comprising a guard ring attached to at least one side wall element and/or a ceiling element, wherein the ceiling element and the at least one side wall element are joined together and the at least one side wall element is mounted on the ceiling element such that it is capable of being attached to an edge region of the ceiling element pertaining to the underlying wall module.

Abstract: A LED strip light connector system for providing a reliable connection between a flexible LED light strip and a connector. The LED strip light connector system generally includes a connector adapted to receive an end of a light strip, and a support member extending outwardly from the connector to support the light strip near the connector. The light strip is attached to the surface of the support member thereby preventing movement of the light strip with respect to the connector.

Abstract: A principal aspect of invention comprises a housing that before being retrofit included a high intensity discharge light source, a high intensity discharge lens, and a high intensity discharge lighting fixture chamber defined between the housing and the high intensity discharge lens. The housing is retrofit to exclude a routinely functioning high intensity discharge light source and exclude at least a portion of the high intensity discharge lens. The housing is made to include at least a first support for at least one light emitting diode light source in place of the portion of the high intensity discharge lens. With this aspect, the retrofit high intensity discharge lighting fixture is no longer a source of high intensity discharge light and is instead a source of light emitting diode light.

Abstract: Disclosed is a method of making an LED light bulb using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons and optimizing the number and placement of the surface mount light emitting diodes for the widest lighting angle (to achieve as close to 360-degrees in three dimensions) with a heat sink matched to the thermal output of the surface mount light emitting diodes and the heat conductive capacity of the polyhedron. Also described are a light emitting diode light bulb made using a plurality of surface mount light emitting diodes mounted on a variety of semiregular polyhedrons. Some embodiments may include a heat conductor comprising a plurality of curved-T shaped heat fins.

Abstract: An optical semiconductor based illuminating apparatus includes a first unit which is disposed on an upper side of a housing and includes protrusions formed on a lower outer side of an optical member surrounding a semiconductor optical device and having an inclined surface inclined upwards from a lower edge of an optical member; and a second unit which accommodates and holds the first unit, so that it can reduce defect rate, improve assembly efficiency, and has excellent durability.

Abstract: A closable centrifuge cup, comprising a cup and a lid which can be placed on the cup edge, closes the cup opening and can be fastened under tension by means of at least one clamping element with its lid edge to the cup edge, characterized by at least one of the following properties: the cup edge or a gasket arranged in the region of the cup edge protrudes further in the direction towards the lid edge in a region remote from the at least one clamping element in the circumferential direction of the cup edge than in a region situated closer to the at least one clamping element; the lid edge or a gasket arranged in the region of the lid edge protrudes further in the direction towards the cup edge in a region remote from the at least one clamping element in the circumferential direction of the lid edge than in a region situated closer to the at least one clamping element.

Abstract: A system and method for streetlight control is provided. A lamp sensor inside a reflector of the streetlight is utilized to detect the output of a lamp of the streetlight. During daytime periods when the lamp is OFF, the lamp sensor is utilized to act as a day/night sensor by detecting ambient light near the lamp. When the ambient light level falls below a sufficient level indicative that night is approaching the lamp is turned ON and the lamp sensor utilized to detect the lamp output of the streetlight.

Abstract: The invention relates to a centrifuge with a drive head which can be connected with a drive, a rotor which can detachably be mounted on the drive head, at least one connection element with which the drive head can be connected in a torsion-proof manner with the rotor, and at least one coupling element which is attached to the drive head and is able to exert an axial force on the rotor in such a way that the rotor can be fixed axially, with the axial force increasing with the rising rotational speed of the drive head, with the coupling element on the rotor transmitting the axial force by means of a ramp surface which is inclined at an angle (?) relative to the horizontal line in a range of more than 0° to 15°. Secure locking of the rotor during standstill and high speeds can thus be achieved.

Abstract: An LED light assembly comprises an aluminium extrusion cut to length to form a heat sink (20) with a hollow interior that may be semi-circular in cross-section or any other convenient cross-section to allow air flow through the heat sink and including a mounting surface (21) for supporting and conveying heat from an LED light source (62) mounted on the surface. The extrusion has a heat dissipating surface (24) with fins (27) for receiving and dissipating heat from the LED light sources (62) on the mounting surface (21). The fins (27) support items such as anchors (45), brackets (37) and casings (28, 35) also formed by lengths of respective extrusions and a sliding fit on the heat sink (20).

Abstract: Provided is a light-emitting device including a light-emitting cell formed on one surface of a substrate, wherein the light-emitting cell comprises a plurality of semiconductor layers and emits light of a certain wavelength; and a wavelength conversion layer formed on the other surface of the substrate and to a certain height of the side of the substrate, wherein the wavelength conversion layer converts a wavelength of light emitted from the light-emitting cell.

Abstract: An optical semiconductor-based tube type lighting apparatus capable of enlarging light distribution to have improved assembly characteristics. The lighting apparatus includes an elongated light-transmitting tube; a linear slit formed on the light-transmitting tube in a longitudinal direction thereof; and at least one bar-shaped optical semiconductor module secured to the light-transmitting tube, with edges of the slit fitted into side surfaces of the bar-shaped optical semiconductor module. The optical semiconductor module includes a heat sink, a PCB attached to the heat sink, and an array of semiconductor optical devices arranged on the PCB. The heat sink is partially exposed from the light-transmitting tube through the slit.

Abstract: An optical semiconductor based illuminating apparatus includes a first unit which is disposed on an upper side of a housing and includes protrusions formed on a lower outer side of an optical member surrounding a semiconductor optical device and having an inclined surface inclined upwards from a lower edge of an optical member; and a second unit which accommodates and holds the first unit, so that it can reduce defect rate, improve assembly efficiency, and has excellent durability.