Abstract: A light-emitting diode (LED) with a bump structure on a sidewall is provided. The LED comprises a substrate, an epitaxial structure, a first conductive bump, a second conductive bump, a first extended electrode and a second extended electrode. The substrate has a top surface, a first side surface and an inclined surface between the top surface and the first side surface. The epitaxial structure is disposed on the top surface of the substrate, and comprises a N-type semiconductor layer, a light-emitting layer, a P-type semiconductor layer, a transparent conductive layer, a P-electrode and a N-electrode. The first extended electrode and the second extended electrode connect the P-electrode and the N-electrode, extend through the inclined surface, and are electrically connected to the first and the second conductive bumps, respectively. A mounting structure comprises said LED, a sub-mount and a connector mounting the LED onto the sub-mount.

Abstract: A dual-use light fixture having AC and DC LEDs includes a heat-dissipating housing, a printed circuit board located on a first end of the heat-dissipating housing, AC and DC LED chips located on the printed circuit board, and a power supply pedestal coupled to a second end of the heat-dissipating housing. The power supply pedestal includes an AC plug, a DC driving unit, and a thread connector. The AC plug is electrically connected to the printed circuit board for inserting into an AC outlet to provide an AC power. The DC driving unit is located in an accommodating space formed by the power supply pedestal and the heat-dissipating housing and is electrically connected to the printed circuit board. The thread connector is coupled to another AC power, and the AC power is converted into a DC power by the DC driving unit.

Abstract: A dimmer circuit and a lighting apparatus using the same are provided. The dimmer circuit comprises a dimmer, a rectifier, a sample-and-hold unit, an integral unit and a current holding circuit. The dimmer is coupled to an AC for modulating the AC into an alternating signal. The rectifier couples the dimmer and the AC for rectifying the alternating signal into a DC signal. The sample-and-hold unit is coupled to the rectifier for sampling the DC signal to obtain an average positive wave pulse. The integral unit is coupled to the sample-and-hold unit for integrating the average positive wave pulse to generate a DC voltage. The current holding circuit comprises a switch and a bleeder. The current holding circuit determines the on/off state of the switch according to a comparison between the DC voltage and a reference voltage, such that the DC signal passes through the bleeder or the switch.

Abstract: The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting diode chip includes at least two recesses at corners located on a diagonal line of the light-emitting diode chip; a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer includes at least two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers a portion of a top surface of the light-emitting diode chip. The present disclosure also provides a method for manufacturing a light-emitting diode package.

Abstract: A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

Abstract: The control method comprises the following steps. Firstly, whether a touch event occurs in a control device is determined. Then, responding to a color temperature set and a brightness set from the control device, a first PWM and a second PWM is generated. Then, whether the lamp connects with to the control device is determined. Then, the first PWM and the second PWM is packaged in a color control package if the lamp connects with to the control device. Then, the color control package is transmitted to the lamp in wireless.

Abstract: A light emitting diode package structure includes a substrate, a light emitting diode chip and a terminal connecting portion. The substrate has a first surface and a second surface that are opposite to each other, and a side surface surrounding and connecting the first surface and the second surface. The first surface has a predetermined die bonding area and the light emitting diode chip is disposed on the die bonding area. The terminal connecting portion protrudes from the side surface and is electrically connected to the light emitting diode chip.

Abstract: The invention provides a method for fabricating a light-emitting diode device. The method includes providing a carrier having a first surface and a second surface. The first surface has insulating micro patterns. A buffer layer, a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer are grown on the first surface to form a light-emitting lamination layer. A substrate is provided for the second-type semiconductor layer to bond on. The carrier is lifted off from the light-emitting lamination layer by a laser lift-off process, and surfaces of the insulating micro patterns and a surface of the buffer layer between the insulating micro patterns are exposed. The insulating micro patterns and the buffer layer are removed. Recess structures are formed on the first-type semiconductor layer. A surface-roughing process is then performed on the recess structures.

Abstract: The disclosure provides a light emitting diode projection bulb including a heat dissipation base, a light emitting diode module, and a annular heat dissipation member. The heat dissipation base includes a bottom surface, a sidewall surrounding the bottom surface, and a annular rim. The annular rim is connected to an end of the sidewall to define a first opening facing toward outside. A surface of the annular rim forms a plurality of first convection holes and a plurality of first locating portions. The light emitting diode module is installed on the bottom surface of the heat dissipation base and emits light toward the first opening. The annular heat dissipation member includes a second opening, a plurality of second convection holes, and a plurality of second locating portions.

Abstract: A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed.

Abstract: An epitaxial growth method includes the steps of: providing a substrate; forming a sacrifice layer on the substrate; patterning the sacrifice layer to form a plurality of bumps spaced apart from each other on the substrate; epitaxially forming a first epitaxial layer on the substrate to cover a portion of each of the bumps; removing the bumps to form a plurality of cavities; and epitaxially forming a second epitaxial layer on the first epitaxial layer such that the cavities are enclosed by the first epitaxial layer and the second epitaxial layer. An epitaxial structure grown by the method is disclosed as well.

Abstract: An illuminating device including a substrate, a light-emitting diode element disposed on the substrate, an electrode element, and a sealing ring. The substrate has a groove, and the electrode element has a retaining slot disposed in the groove. The sealing ring is embedded into the retaining slot and a part of the groove to tightly fix the electrode element on the groove.

Abstract: A light-emitting diode (LED) package frame is provided, including a leadframe and an insulating member. The leadframe includes a first electrode and a second electrode separated from each other. The insulating member is disposed between the first electrode and the second electrode for insulation between the first and second electrodes, including a first protrusion and a second protrusion. The coefficient of thermal expansion of the insulating member is greater than that of the leadframe. Specifically, the first electrode and the second electrode respectively include a first recess and a second recess which abut the insulating member. The first protrusion and the second protrusion are respectively engaged with the first recess and the second recess.

Abstract: A lamp electrode module includes a lamp cap, a spring electrode, a bottom electrode and a first insulation member. The lamp electrode has an inner sidewall surrounded by an internal thread and an inner bottom surface adjacent to the inner sidewall. The spring electrode has a helix portion wedged in the internal thread and a first connecting portion extended from the helix portion and located inside the lamp cap. The bottom electrode includes a contacting portion abutting against an outer surface opposite to the inner surface and a second connecting portion passing through the lamp cap and erecting on the inner bottom surface. The first insulation member covers the helix portion of the spring electrode and the inner sidewall of the lamp cap.

Abstract: An LED drive circuit applied between an LED load and an AC power supply is provided. The circuit includes a rectifier, a power conversion module, a voltage regulator, a photo coupler and a controller. The rectifier rectifies and converts an AC voltage outputted from the AC power supply into a DC voltage. The power conversion module converts the DC voltage into a first drive voltage and a second drive voltage. The first drive voltage drives the LED load. The voltage regulator receives and processes the second drive voltage with a voltage regulating process to generate a third drive voltage not exceeding a maximum voltage rating of the controller. The photo coupler generates a feedback signal according to a signal outputted from the LED load. The controller receives the third drive voltage and generates a control signal to control the power conversion module according to the feedback signal.

Abstract: A light emitting diode includes a substrate, a first semiconductor layer, a luminous layer, a second semiconductor layer, a current diffusion layer, a third semiconductor layer, a first electrode, a second electrode, and an insulation layer. The first semiconductor layer is formed above the substrate. The luminous layer is formed on the first semiconductor layer, and exposes a portion of the first semiconductor layer. The second semiconductor layer is formed on the luminous layer. The current diffusion layer is formed on the second semiconductor layer. The third semiconductor layer is formed on the current diffusion layer. The first electrode is formed on the first semiconductor layer. The second electrode includes a base portion formed on the surface of the substrate, and plural comb structures extending upward vertically. Each tip of the comb structure is in the third semiconductor layer. The insulation layer exposes the tip of each comb structure.

Abstract: The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier and electrically connected to the carrier, wherein the light-emitting diode chip includes at least two recesses at corners located on a diagonal line of the light-emitting diode chip; a eutectic layer disposed between the light-emitting diode chip and the carrier, wherein the eutectic layer includes at least two metal pillars embedded into the at least two recesses respectively, wherein an upper portion of the metal pillars covers a portion of a top surface of the light-emitting diode chip. The present disclosure also provides a method for manufacturing a light-emitting diode package.