Abstract: The disclosure provides a light-emitting diode (LED) and a method for manufacturing the same. The LED includes a first semiconductor layer, a light-emitting layer, a second semiconductor layer, a first current spreading layer, a current blocking having a plurality of nitrogen vacancies, and a second current spreading layer, wherein the second spreading layer includes a current spreading area and a current blocking area. The current blocking area is formed the nitrogen vacancies by high power sputtering on the current blocking area of the second semiconductor layer, so as to increase the resistance of the current blocking area and occur the efficiency of current blocking.

Abstract: A light emitting diode structure is provided. The light emitting diode structure includes a substrate, a light emitting multi-layer structure, a first current blocking layer, a first current spreading layer, a second current blocking layer and a second current spreading layer. The light emitting multi-layer structure is formed on the substrate by way of stacking. The first current blocking layer is formed on part of the light emitting multi-layer structure. The first current spreading layer covers the first current blocking layer and the light emitting multi-layer structure. The second current blocking layer is formed on part of the first current spreading layer. An orthogonal projection of the second current blocking layer is disposed in an orthogonal projection of the first current blocking layer. The second current spreading layer covers the second current blocking layer and the first current spreading layer.

Abstract: A light-emitting diode (LED) light tube driving circuit includes a LED driver and a rectifier unit. The LED driver is configured for receiving an operating voltage to drive at least one LED. The rectifier unit has a first input/output terminal and a second input/output terminal and is electrically coupled to an external alternating-current power source selectively by the first input/output terminal and the second input/output terminal. The rectifier unit is configured for providing the operating voltage to the LED driver. The rectifier unit further includes a first rectifier diode and a second rectifier diode.

Abstract: A light emitting diode (LED) package structure is provided. The LED package structure comprises a substrate, at least one LED chip, an encapsulating compound and a curing material. The substrate has a first surface and a second surface opposite to the first surface. The LED chip is disposed on the first surface. The encapsulating compound covers the LED chip. The encapsulating compound has a plurality of particulate phosphors therein. The phosphors are centralized near a side of the encapsulating compound away from the substrate. The curing material is adhered to the side of the encapsulating compound away from the substrate.

Abstract: An electrode structure includes at least one reflection layer, a barrier layer, and a conductive pad. The barrier layer includes a first barrier layer and a second barrier layer. The first and second barrier layers are stacked on the reflection layer in sequence. The first and second barrier layers are made of different materials. The conductive pad is located on the barrier layer.

Abstract: An illumination system includes a light-emitting device, a first switch element, a driving device, a detecting circuit, an arithmetic unit and a power supply unit. The first switch element is configured for receiving an external voltage supplied by an external power source. The driving device is configured for converting the external voltage to a direct-current power signal for driving the light-emitting device to emit light; the detecting circuit is configured for detecting a voltage across the first switch element and converting the voltage to a detecting signal; the arithmetic unit is configured for performing an arithmetic operation on the direct-current power signal and the detecting signal to generate a control signal; and the power supply unit is configured for supplying power for the light-emitting device according to the control signal and driving the light-emitting device to emit light. An illumination driving method is also disclosed herein.

Abstract: An LED chip is disclosed. The LED chip includes a substrate and a semiconductor element formed on the substrate. A recess is formed on the semiconductor element so as to expose a first-type of semiconductor layer thereof to the environment. The LED chip also includes a conductive layer disposed on a second-type semiconductor layer of the semiconductor element, a first electrode disposed in the recess and electrically connected to the first-type of semiconductor layer, and a second electrode disposed on the conductive layer. In addition, the LED chip includes a first circular electrode disposed on the conductive layer and extending along an edge of the substrate and electrically connected to the second electrode.

Abstract: Disclosed herein is a light emitting diode, the structure of the light emitting diode comprises a substrate, a first-type semiconductor layer, a structural layer, a light emitting layer, a second-type semiconductor layer, a transparent conductive layer, a first contact pad and a second contact pad in regular turn. The structural layer comprises a stacked structure having a trapezoid sidewall and nano columns extending from the trapezoid sidewall in regular arrangement. Also, a method for fabricating the light emitting diode is disclosed.

Abstract: A light adjusting device for adjusting the luminance of a light source is provided. The light adjusting device comprises a rectifier module, a first switch element, a second switch element and a control module. The rectifier module receives an AC signal from a first power node and a second power node, and rectifies the AC signal to output a driving signal to the light source. The first switch element is coupled to the first power node. The second switch element is coupled to the second power node. The control module outputs a control signal to the first and second switch elements to control the conduction states of the first and second switch elements. When the first and second switch elements are turned on, the driving signal provided to the light source is interrupted.

Abstract: A panel lamp includes a lamp housing, multiple first punched holes, multiple second punched holes, multiple first protruding bent portions, multiple second protruding bent portions, a light source module, and a lampshade. The lamp housing includes a first side plate and a second side plate opposite thereto. The first and second side plates respectively include a first folded portion and a second folded portion. Each first protruding bent portion is adjacent to each first punched hole. The first protruding bent portions and first folded portion form a first fixing mechanism. Each second protruding bent portion is adjacent to each second punched hole. The second protruding bent portions and second folded portion form a second fixing mechanism. The lampshade includes a first edge and a second edge. The first and second edges are respectively held by the first and second fixing mechanisms and are fixed to the lamp housing.

Abstract: A light-emitting diode element is provided. N light-emitting diode chips are arranged on a substrate. Each light-emitting diode chip includes a first-type semiconductor layer, an active layer, a second-type semiconductor layer, a first electrode, and a second electrode. The first-type semiconductor layer is disposed on the substrate. The active layer is disposed on the first-type semiconductor layer to bare a surface of a portion of the first-type semiconductor layer. The second-type semiconductor layer is disposed on the active layer. The first and second electrode are disposed on the first-type and second-type semiconductor layers respectively. The second electrode is close to a side of the second-type semiconductor layer which is opposite side of the first-type semiconductor layer. First and second connection lines connect the first electrode of an i-th light-emitting diode chip and the second electrode of an (i+1)-th light-emitting diode chip among the light-emitting diode chips.

Abstract: A light-emitting diode (LED) chip is disclosed. The LED chip includes a substrate and a LED stack on the substrate. The LED stack includes a first-type semiconductor layer, an active layer covering a portion and exposing another portion of the first-type semiconductor layer, and a second-type semiconductor layer on the active layer. A current spreading layer is formed on the second-type semiconductor layer. A first electrode is formed on the exposed portion of the first-type semiconductor layer, and a second electrode is formed on the current spreading layer. The current spreading layer includes a first portion having a first thickness and a second portion having a second thickness. A vertical projection of the second portion onto the first-type semiconductor layer surrounds a vertical projection of a portion of the first electrode onto the first-type semiconductor layer. The first thickness is greater than the second thickness.

Abstract: A LED package structure includes a base portion, a light-emitting chip, a cup portion and an encapsulating glue. The base portion has an upper surface and a lower surface. The upper surface has a die-bonding area. The light-emitting chip emits a light with a first wavelength and is located on the die-bonding area. The cup portion is located on the base portion to surround the die-bonding area to form a recess having an opening. The encapsulating glue is filled into the recess. The encapsulating glue has a wavelength conversion material configured to convert part of the light with the first wavelength into a light with a second wavelength. The cup portion includes an electro chromic layer electrically connected to a first external power and a transmittance of the electro chromic layer is changed in accordance with an input voltage of the first external power to adjust the light-emitting profile of the light-emitting chip.

Abstract: A light emitting diode includes a substrate, a first-type semiconductor layer, a nanorod layer and a transparent planar layer. The first-type semiconductor layer is disposed over the substrate. The nanorod layer is formed on the first-type semiconductor layer. The nanorod layer includes a plurality of nanorods and each of the nanorods has a quantum well structure and a second-type semiconductor layer. The quantum well structure is in contact with the first-type semiconductor layer, and the second-type semiconductor layer is formed on the quantum well structure. The transparent planar layer is filled between the nanorods. A surface of the second-type semiconductor layer is exposed out of the transparent planar layer.

Abstract: A control device including a first switch, a control unit and a second switch is provided. When the first switch is turned on, a power signal generated by a power supply is transmitted to a lighting load via the first switch. The brightness of the lighting load is gradually increased or reduced as time increases. When the first switch is turned on, the control unit executes a countdown according to a time value. Upon finishing the countdown, the control unit generates a trigger signal and simultaneously the brightness of the lighting load is at a set value. When receiving the trigger signal, the second switch stops transmitting the power signal from the first switch to the lighting load at first and then transmits the power signal from the first switch to the lighting load such that the brightness of the lighting load keeps at the set value.

Abstract: The present disclosure provides a light-emitting diode package, including: a carrier; a light-emitting diode chip disposed over the carrier; and a fluorescent sheet covering the light-emitting diode chip, wherein the fluorescent sheet has a recess corresponding to the light-emitting diode chip, wherein the light-emitting diode chip is placed in the recess, and light-emitting surfaces of the light-emitting diode chip are covered by the fluorescent sheet. The present disclosure also provides a method for manufacturing a light-emitting diode package.

Abstract: An illuminating device including a substrate, a light-emitting diode element disposed on the substrate, an electrode element, and a sealing ring. The substrate has a groove, and the electrode element has a retaining slot disposed in the groove. The sealing ring is embedded into the retaining slot and a part of the groove to tightly fix the electrode element on the groove.

Abstract: The invention provides a method for fabricating a light-emitting diode device. The method includes providing a carrier having a first surface and a second surface. The first surface has insulating micro patterns. A buffer layer, a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer are grown on the first surface to form a light-emitting lamination layer. A substrate is provided for the second-type semiconductor layer to bond on. The carrier is lifted off from the light-emitting lamination layer by a laser lift-off process, and surfaces of the insulating micro patterns and a surface of the barrier layer between the insulating micro patterns are exposed. The insulating micro patterns and the barrier layer are removed. Recess structures are formed on the first-type semiconductor layer. A surface-roughing process is then performed on the recess structures.

Abstract: A light emitting diode module includes a lead frame, a first light emitting diode chip, a second light emitting diode chip, an encapsulant, and a lens structure. The lead frame has a die-bonding surface and a side wall together defining an accommodating recess. The encapsulant is filled in the accommodating recess, and covers the first and the second light emitting diode chips. The lens structure disposed on the lead frame has a bottom surface, a reflective surface, a first, a second, a third, and a fourth light emitting curved surface. The light emitting curved surfaces are respectively disposed opposite to the bottom surface. An adjacent position among the light emitting curved surfaces is a lowest point nearest to the bottom surface. The first and the second light emitting diode chips are disposed at the projections of the first and the second light emitting curved surface on the die-bonding surface.

Abstract: A light bar structure is disclosed. A light source module is disposed on a circuit board. At least two power input portions are disposed on the circuit board and are in parallel connection. The at least two power input portions are electrically connected to the light source module.