Abstract: An epitaxial structure includes a substrate, a first epitaxial layer and a second epitaxial layer. The substrate has a surface, and the first epitaxial layer is disposed over the substrate and defines a plurality of slanting air voids tapering away from the substrate and an opening over each of the slanting air voids. The second epitaxial layer is disposed on the first epitaxial layer and collectively defines the slanting air voids in a shape of trapezoid with the surface and the first epitaxial layer.

Abstract: A light-emitting diode chip package is provided. The light-emitting diode chip package includes a substrate; a light-emitting diode chip set (LED chip set) disposed over the substrate, wherein the LED chip set is formed by a plurality of light-emitting diode chips (LED chips) in one piece; and at least two electrodes disposed over the substrate and electrically connected to the LED chip set.

Abstract: The invention provides a photocoupler package. The photocoupler package includes a light-emitting diode (LED) mounted on a first lead frame, electrically connected to the first lead frame. A photodetector is mounted on a second lead frame, electrically connected to the second lead frame. A first insulating material is disposed on the first lead frame, surrounding the LED. A second insulating material is disposed on the second lead frame, surrounding the photodetector. A third insulating material encapsulates the first insulating material and the LED. A third insulating material also encapsulates the second insulating material and the photodetector. This photocoupler possesses high photocoupling efficiency, small volume, and superior high-isolation capability.

Abstract: A light-emitting diode (LED) chip is disclosed. The chip includes a light-emitting diode and an electrode layer on the light-emitting diode. The electrode layer includes a reflective metal layer. The reflective metal layer includes a first composition and a second composition. The first composition includes aluminum or silver, and the second composition includes copper, silicon, tin, platinum, gold, palladium or a combination thereof. The weight percentage of the second composition is greater than 0% and less than 20%.

Abstract: A die-positioning device includes a roller body, a plurality of die-suction portions, and at least one gas control device. The roller body includes a plurality of chambers therein, and the chambers are separated from each other. The die-suction portions are located on the surface of the roller body in columns. The die-suction portions for each column correspond to one of the chambers, and each of the die-suction portions has a die suction region and a gas channel that passes through the die suction region. The gas control device is connected to the chambers and disposed on the roller body. The gas control device selectively sucks the air from a specific chamber, such that each of the die-suction portions on the specific chamber sucks an LED die by the corresponding gas channel.

Abstract: An epitaxial structure includes a substrate, a first epitaxial layer and a second epitaxial layer. The substrate has a surface, and the first epitaxial layer is disposed over the substrate and defines a plurality of stepped air voids and an opening over each of the stepped air voids. The second epitaxial layer is disposed on the first epitaxial layer and collectively defines the stepped air voids with the surface and the first epitaxial layer.

Abstract: The invention provides an apparatus for fabricating a periodic micro-pattern by laser beams. The apparatus includes an ultrafast laser light source configured to generate an output laser beam. A diffraction optical element is configured to divide the output laser beam into a plurality of diffractive laser beams. A confocal system is configured to focus the plurality of diffractive laser beams on a focal point, so that the plurality of diffractive laser beams produces an interference light beam with interference phenomena. The interference light beam ablates a surface of an element to fabricate a periodic micro-pattern on the surface of the element. The confocal system includes a first lens, a second lens and a light shielding mask. The plurality of diffractive laser beams passes through the first lens, the light shielding mask and the second lens in sequence.

Abstract: A method for fabricating a light-emitting device is provided. The method includes: providing a substrate; forming a sacrificial dielectric layer on the substrate, wherein the sacrificial dielectric layer is a structure containing voids; forming a buffer layer on the sacrificial dielectric layer; forming an epitaxial light-emitting structure on the buffer layer; forming a metal bonding layer on the epitaxial light-emitting structure; bonding the metal bonding layer to a thermally conductive substrate; and wet etching the sacrificial dielectric layer for to remove the substrate.

Abstract: The invention relates to a driving circuit comprising a first bridge circuit, a second bridge circuit, a first protection device and a second protection device. The first bridge circuit comprising a first positive input terminal, a first negative input terminal, a first positive output terminal and a first negative output terminal is coupled to an AC voltage source to output a first voltage. The second bridge circuit comprising a second positive input terminal, a second negative input terminal, a second positive output terminal and a second negative output terminal is coupled to the AC voltage source to output a second voltage. The second and the first negative output terminals are both coupled to the ground potential. The first protection device is coupled between the second positive input terminal and the AC voltage source. The second protection device is coupled between the second negative input terminal and the AC voltage source.

Abstract: A backlight module is provided, including a circuit board, a plurality of light-emitting elements, a frame, and a plurality of first and second light-reflecting portions. The light-emitting elements are disposed on the circuit board and separated from each other. The frame includes a base plate and two lateral plates extended from the base plate, wherein the circuit board is disposed on the base plate. The first and second light-reflecting portions are disposed on at least one of the lateral plates and arranged in a staggered manner. The first light-reflecting portions are closer to the light-emitting elements than the second light-reflecting portions. The reflectivity of the second light-reflecting portions exceeds that of the first light-reflecting portions.

Abstract: A light bar structure is provided, including a longitudinal circuit board, a plurality of light-emitting elements, and a power-input terminal. The circuit board includes a first segment, a second segment, and a third segment arranged along a longitudinal axis of the circuit board, wherein the second segment is between the first segment and the third segment. The light-emitting elements are disposed on the circuit board. The power-input terminal is disposed on the second segment and electrically connected to the light-emitting elements in parallel.

Abstract: A lamp includes a lamp tube, a carrier, a light bar circuit board, a driver circuit board, a plurality of first luminous elements and a parallel-connected type luminous unit. The carrier is accommodated in the lamp tube. The light bar circuit board is disposed on the carrier. The driver circuit board is disposed on the carrier and adjoins the light bar circuit board. The first luminous elements are disposed on the light bar circuit board. The parallel-connected type luminous unit is disposed on the driver circuit board, and includes a plurality of luminous element groups connected in parallel.

Abstract: An illumination device includes a rectifier circuit, M light-emitting modules, and a control module. The rectifier circuit has a positive output terminal and a negative output terminal, and generates a driving voltage between the positive output terminal and the negative output terminal according to an input power. The M light-emitting modules are coupled between the positive output terminal and the negative output terminal. Each of the M light-emitting modules has a conduction voltage, and includes a light-emitting unit that includes at least one light-emitting diode. The control module is coupled between the rectifier circuit and the M light-emitting modules, and controls the M light-emitting modules to dynamically form S light-emitting diode strings coupled in parallel with each other. A number of the light-emitting units in each of the S light-emitting diode strings is N, in which S×N=M, where M, S, N are positive integers.

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract: A dimming circuit is disclosed herein. The dimming circuit includes a control voltage receiving module and a driving module. The control voltage receiving module is configured to output a reference voltage according to a control voltage. The driving module is electrically connected to the control voltage receiving module, in which the driving module includes a driving transistor, a first transistor and a feedback circuit. The driving transistor is configured to provide a driving current to drive a lighting module. The first transistor is configured to control the driving transistor with feedback according to the reference voltage. The feedback circuit is electrically connected between the driving transistor and the first transistor and configured to determine the operating state of the first transistor according to the driving current.

Abstract: A manufacturing method of a LED display is provided. A temporary substrate is provided, wherein the temporary substrate has a first adhesive layer and a plurality of first, second and third LED chips mounted on the first adhesive layer. A first transparent substrate is provided, the transparent substrate has a plurality of pixels disposed thereon, and each of the pixels comprises a first sub-pixel, a second sub-pixel and a third sub-pixel respectively surrounded by a light-insulating structure. Then, the temporary substrate and the first transparent substrate are bonded together, such that each of the first, second and third LED chips is correspondingly mounted in each of the first sub-pixels, the second sub-pixels and the third sub-pixels. After that, the temporary substrate is removed. A LED display manufactured by said method is also provided.

Abstract: A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.