Light emitting diode package

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Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is a bottom perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D656107 March 20, 2012 Hsu
D664103 July 24, 2012 Sasaoka et al.
D664104 July 24, 2012 Hsu
D664105 July 24, 2012 Hsu
D664107 July 24, 2012 Wang
D664505 July 31, 2012 Ko
D664510 July 31, 2012 Wang
D668235 October 2, 2012 Chang et al.
D668623 October 9, 2012 Hsu
D669044 October 16, 2012 Hsu
D671082 November 20, 2012 Chang
D678225 March 19, 2013 Ko et al.
D678226 March 19, 2013 Hsu et al.
D695239 December 10, 2013 Ko et al.
D697876 January 21, 2014 Hsu et al.
D697877 January 21, 2014 Hsu et al.
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Patent History
Patent number: D709039
Type: Grant
Filed: Sep 13, 2012
Date of Patent: Jul 15, 2014
Assignee: Lextar Electronics Corporation (Hsinchu)
Inventors: Bo-Yu Ko (New Taipei), Chun-Wei Wang (New Taipei), Shing-Kuo Chen (Taipei)
Primary Examiner: Selina Sikder
Application Number: 29/432,065
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)